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公开(公告)号：US20210193687A1
公开(公告)日：2021-06-24
申请号：US17040510
申请日：2020-03-18
Inventor： Yonglian QI , Chao LIU , Lianjie QU , Hebin ZHAO , Shan ZHANG , Ning JIA , Guangdong SHI , Shuai LIU
IPC: H01L27/12 , H01L25/075
Abstract: A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.
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公开(公告)号：US20210183897A1
公开(公告)日：2021-06-17
申请号：US17020133
申请日：2020-09-14
Inventor： Yonglian QI , Hong YANG , Lianjie QU , Shan ZHANG , Hebin ZHAO , Yun QIU
IPC: H01L27/12 , H01L25/075
Abstract: A substrate includes a driving backplane, a plurality of first connecting lines and a plurality of second connecting lines. The driving backplane includes a base substrate, at least one first lead group and at least one second lead group. Each first lead group includes a plurality of first leads, and each second lead group includes a plurality of second leads. A first lead group and a corresponding second lead group is disposed in a peripheral region. The plurality of first connecting lines are disposed on at least one side face of the driving backplane, each first connecting line is electrically connected to at least one first lead. The plurality of second connecting lines are disposed on the at least one side face of the driving backplane, each second connecting line is electrically connected to at least one second lead, and is in contact with a corresponding first connecting line.
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公开(公告)号：US20200301189A1
公开(公告)日：2020-09-24
申请号：US16082950
申请日：2018-01-04
Inventor： Lianjie QU , Hebin ZHAO , Yonglian QI , Bingqiang GUI , Minqi CHEN , Tao LIU
IPC: G02F1/1339 , G06F3/041 , G06F3/044 , G02F1/1333
Abstract: This disclosure provides a liquid crystal display panel. The liquid crystal display panel comprises: a first substrate and a second substrate arranged oppositely, a plurality of main spacers located between the first substrate and the second substrate for supporting cell gap of the liquid crystal display panel, a plurality of auxiliary spacers located between the first substrate and the second substrate, and a plurality of pressure sensing electrodes in one-to-one correspondence with the plurality of auxiliary spacers; wherein a height of the auxiliary spacer is smaller than a height of the main spacer; a material of the auxiliary spacer is a piezoelectric material. This disclosure also discloses a manufacturing method of the liquid crystal display panel and a display device comprising the liquid crystal display panel.
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公开(公告)号：US20200035657A1
公开(公告)日：2020-01-30
申请号：US16397626
申请日：2019-04-29
Inventor： Lianjie QU , Ruiyong WANG , Yun QIU , Hebin ZHAO , Yonglian QI , Bingqiang GUI , Hui ZHANG
IPC: H01L25/16 , H01L25/075 , H01L23/538 , H01L33/58 , H01L33/62
Abstract: An electroluminescent device and a manufacturing method thereof are provided. The electroluminescent device includes a transparent substrate and array of electroluminescent chips located thereon, wherein light-emitting surfaces of the electroluminescent chips are attached to the transparent substrate.
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公开(公告)号：US20190049854A1
公开(公告)日：2019-02-14
申请号：US15920952
申请日：2018-03-14
Inventor： Lianjie QU , Yonglian QI , Yun QIU , Hebin ZHAO , Bingqiang GUI , Jiantao LIU
IPC: G03F7/20
Abstract: Disclosed are an exposure device and an exposure method thereof. The exposure device includes a stage for placing thereon a substrate to be exposed, a mask arranged above the stage and comprising periodical patterns, an exposure light source arranged above the stage and configured to transmit light at a preset wavelength, and a transparent body configured to move horizontally in a preset direction in an exposure area between the mask and the stage while the exposure light source is exposing in operation. The transparent body is so structured that there is a change in light journey of greater than 2p2/λ at each exposure position in the exposure area while an exposure light source is exposing in operation, where p represents a space between periodical patterns in the mask, and λ represents a preset wavelength of light emitted by the exposure light source.
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Patent Agency Ranking
公开(公告)号：US20190006219A1
公开(公告)日：2019-01-03
申请号：US15916114
申请日：2018-03-08
Inventor： Yonglian QI , Lianjie QU , Zhidong WANG , Yuanxin DU , Hebin ZHAO , Yun QIU
IPC: H01L21/683 , H01L21/56 , H01L23/00 , H01L23/31
Abstract: A method of packaging a chip includes laminating a first substrate with a second substrate, the first substrate being capable of withstanding a greater stress than the second substrate; applying an adhesive layer on the second substrate; bonding the chip on the adhesive layer; and forming an encapsulation layer that covers at least the chip.
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37.发明申请公开(公告)号：US20180187071A1
公开(公告)日：2018-07-05
申请号：US15523477
申请日：2016-11-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD
Inventor： Tingting ZHOU , Bin ZHANG , Yonglian QI , Dini XIE , Yong JIANG
IPC: C09K11/02 , G03F7/00 , G03F7/16 , G03F7/20 , G03F7/26 , C08G77/18 , G03F7/075 , G03F7/004 , G03F7/033 , G03F7/031 , G02B1/04
CPC classification number: C09K11/025 , C08G77/18 , C08G77/20 , C09D183/06 , C09K11/565 , C09K11/883 , G02B1/04 , G02F1/133617 , G02F2202/36 , G03F7/0007 , G03F7/0043 , G03F7/0047 , G03F7/027 , G03F7/031 , G03F7/033 , G03F7/038 , G03F7/0757 , G03F7/0758 , G03F7/16 , G03F7/20 , G03F7/2053 , G03F7/26
Abstract: The present disclosure provides a light-diffusion powder, a quantum-dot-containing photoresist, and a quantum-dot-containing color film, and their preparation methods. The light-diffusion powder is obtained from an alkoxysilane having a chemical structure represented by formula (I): where R1 includes a C1—C50 alkyl group, and R′ includes one or more of an alkyl and a substituted alkyl group.
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公开(公告)号：US20180130860A1
公开(公告)日：2018-05-10
申请号：US15861002
申请日：2018-01-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yonglian QI , Shi SHU , Guanbao HUI
IPC: H01L27/32 , H01L23/535 , G02F1/1368 , H01L21/768 , H01L51/56 , H01L27/12 , G02F1/1362
CPC classification number: H01L27/3248 , G02F1/1362 , G02F1/1368 , G02F2001/136222 , H01L21/76802 , H01L21/76877 , H01L23/535 , H01L27/1259 , H01L27/322 , H01L51/56 , H01L2227/323 , H01L2924/0002 , H01L2924/00
Abstract: A method for fabricating a COA array substrate, an array substrate and a display device are provided. The COA array substrate includes a photoresist layer disposed on a protection layer, wherein a color filter receiving hole is formed in the photoresist layer, and a color filter layer is formed in the color filter receiving hole, an entire surface of the photoresist layer is flushed with an entire surface of the color filter layer such that the photoresist layer functions as the planarized layer.
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39.发明申请OPPOSED SUBSTRATE OF AN OLED ARRAY SUBSTRATE AND METHOD FOR PREPARING THE SAME, AND DISPLAY DEVICE 审中-公开OLED阵列基板的对置基板及其制备方法及显示装置公开(公告)号：US20160276617A1
公开(公告)日：2016-09-22
申请号：US14407009
申请日：2014-04-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yonglian QI , Chuanxiang XU , Can WANG
CPC classification number: H01L51/525 , H01L27/322 , H01L27/3244 , H01L51/5212 , H01L51/5228 , H01L51/524 , H01L51/5284 , H01L51/56
Abstract: The present relates to the field of display technologies and discloses an opposed substrate of an OLED array substrate and a method for preparing the same, and a display device. In the embodiments of the invention, the layer structure of the opposed substrate of an OLED array substrate can be simplified, and the preparation difficulty of the opposed substrate can be lowered, thereby the yield rate of the opposed substrate can be improved. The opposed substrate of an OLED array substrate comprises a planarization layer and a plurality of protrusions located on the planarization layer, wherein, the planarization layer and the protrusions are conductive, and the protrusions are electrically connected with the electrodes of the OLED array substrate.
Abstract translation: 本发明涉及显示技术领域，并公开了OLED阵列基板的相对基板及其制备方法以及显示装置。 在本发明的实施例中，可以简化OLED阵列基板的相对基板的层结构，并且可以降低相对基板的制备难度，从而可以提高相对基板的屈服率。 OLED阵列基板的相对基板包括平坦化层和位于平坦化层上的多个突起，其中平坦化层和突起是导电的，并且突起与OLED阵列基板的电极电连接。
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公开(公告)号：US20150236056A1
公开(公告)日：2015-08-20
申请号：US14447928
申请日：2014-07-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chuanxiang XU , Shi SHU , Yonglian QI , Feng ZHANG
IPC: H01L27/12
CPC classification number: H01L27/1262 , G02F1/136227 , G02F2001/136222 , H01L27/124
Abstract: The present invention discloses an array substrate and a manufacturing method for the same, and a display device. By adopting the manufacturing method for the array substrate provided by the embodiments of the present invention, via holes with relatively small hole sizes in a color resin layer are realized, so that the aperture ratio of pixels is improved. The manufacturing method for the array substrate includes: forming thin film transistors on a substrate; forming a color resin layer on the substrate on which the thin film transistors are formed; forming a first light-blocking layer with a light-shielding effect on the color resin layer, the photolithographic resolution of the first light-blocking layer being greater than that of the color resin layer; and performing a patterning process on the first light-blocking layer and the color resin layer to form via holes in the color resin layer.
Abstract translation: 本发明公开了一种阵列基板及其制造方法以及显示装置。 通过采用由本发明实施例提供的阵列基板的制造方法，可以实现在彩色树脂层中具有较小孔尺寸的通孔，从而提高像素的开口率。 阵列基板的制造方法包括：在基板上形成薄膜晶体管; 在其上形成有薄膜晶体管的基板上形成着色树脂层; 在着色树脂层上形成具有遮光效果的第一遮光层，第一遮光层的光刻分辨率大于着色树脂层的光刻分辨率; 并对第一遮光层和着色树脂层进行图案化处理，以在着色树脂层中形成通孔。
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