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31.发明申请公开(公告)号：US20100225200A1
公开(公告)日：2010-09-09
申请号：US12660807
申请日：2010-03-03
CPC分类号： B06B1/0292 , Y10T29/49005
摘要： Low temperature wafer bonding (temperature of 450° C. or less) is employed to fabricate CMUTs on a wafer that already includes active electrical devices. The resulting structures are CMUT arrays integrated with active electronics by a low-temperature wafer bonding process. The use of a low-temperature process preserves the electronics during CMUT fabrication. With this approach, it is not necessary to make compromises in the CMUT or electronics designs, as is typical of the sacrificial release fabrication approach. Various disadvantages of sacrificial release, such as low process control, poor design flexibility, low reproducibility, and reduced performance are avoided with the present approach. With this approach, a CMUT array can be provided with per-cell electrodes connected to the substrate integrated circuitry. This enables complete flexibility in electronically assigning the CMUT cells to CMUT array elements.
摘要翻译： 采用低温晶片接合（450℃或更低的温度）在已包括有源电气设备的晶片上制造CMUT。 所得到的结构是通过低温晶片结合工艺与有源电子器件集成的CMUT阵列。 在CMUT制造期间使用低温过程保留电子元件。 采用这种方法，就像在牺牲释放制造方法中一样，不需要在CMUT或电子设计中做出妥协。 本方法避免了牺牲释放的各种缺点，如低过程控制，设计灵活性差，再现性低，性能下降。 利用这种方法，可以提供连接到衬底集成电路的每个单元电极的CMUT阵列。 这使得能够将CMUT单元电子分配给CMUT阵列元件的完全灵活性。
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32.发明授权High quality factor resonators for liquid immersion biological and chemical sensors 失效液体生物和化学传感器的高品质因子谐振器公开(公告)号：US07694552B2
公开(公告)日：2010-04-13
申请号：US12069730
申请日：2008-02-11
CPC分类号： G01N29/022 , G01N2291/014 , G01N2291/02466
摘要： A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.
摘要翻译： 提供一种能够提供本质上高的浸入机械品质因子的机械谐振器。 谐振器包括在其周边附接到框架的膜，使得膜的前侧与液体接触，并且膜的背面不与液体或框架接触。 膜可以用作机械谐振器。 通过在框架上靠近膜并与液体接触来提供压力释放边界区域来增强该谐振器的品质因数。 压力释放边界区域提供了软边界条件，这在固体 - 液体界面的固体侧的机械阻抗小于液体机械阻抗的意义上。 提供这样的软边界条件降低了由于液体中的波的激发引起的机械能损失，从而改善了谐振器品质因数。 这种高Q谐振器对于传感器应用特别有用。
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33.发明授权Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same 有权具有贯通衬底电气连接的电容式微加工超声波换能器阵列及其制造方法公开(公告)号：US07545075B2
公开(公告)日：2009-06-09
申请号：US11144184
申请日：2005-06-04
CPC分类号： B06B1/0292
摘要： The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.
摘要翻译： 本发明的实施例提供了一种CMUT阵列及其制造方法。 CMUT阵列具有单独地或分别可从其上制造CMUT阵列的衬底的背面寻址的CMUT元件。 在一个实施例中，CMUT阵列形成在非常高导电性的硅衬底的正面上。 通过晶片沟槽从衬底的背面蚀刻到衬底中以电隔离形成在衬底前侧上的各个CMUT元件。 电极形成在衬底的背面，以通过衬底单独地寻址CMUT元件。
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公开(公告)号：US5469742A
公开(公告)日：1995-11-28
申请号：US28331
申请日：1993-03-09
CPC分类号： G01B17/025 , G01K11/22 , G01N29/041 , G01N2291/011 , G01N2291/0237 , G01N2291/02854 , G01N2291/02881 , G01N2291/0421 , G01N2291/0422 , G01N2291/105 , G01N2291/2632
摘要： An acoustic temperature and/or film thickness monitoring system for semiconductor wafers in which the velocity of acoustic waves in the wafer is employed to measure temperature and/or thickness.
摘要翻译： 用于半导体晶片的声温度和/或膜厚监测系统，其中采用晶片中的声波速度来测量温度和/或厚度。
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公开(公告)号：US4995259A
公开(公告)日：1991-02-26
申请号：US320950
申请日：1989-03-09
CPC分类号： G01S15/8909 , G01N29/06 , G01N29/343
摘要： An acoustic microscope surface inspection system and method in which pulses of high frequency electrical energy are applied to a transducer which forms and focuses acoustic energy onto a selected location on the surface of an object and receives energy from the location and generates electrical pulses. The phase of the high frequency electrical signal pulses are stepped with respected to the phase of a reference signal at said location. An output signal is generated which is indicative of the surface of said selected location. The object is scanned to provide output signals representative of the surface at a plurality of surface locations.
摘要翻译： 一种声学显微镜表面检查系统和方法，其中将高频电能的脉冲施加到换能器，所述换能器将声能形成并聚焦到物体表面上的选定位置并从该位置接收能量并产生电脉冲。 相对于所述位置处的参考信号的相位，高频电信号脉冲的相位是阶梯式的。 产生指示所述选定位置的表面的输出信号。 扫描对象以在多个表面位置处提供表示表面的输出信号。
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公开(公告)号：US4683750A
公开(公告)日：1987-08-04
申请号：US669197
申请日：1984-11-07
CPC分类号： G01N29/0681 , G01H3/125 , G01K11/22 , G01N29/2418 , G01N2291/02881 , G01N2291/0423
摘要： A noncontacting method of measuring periodic surface heating is described. The perturbation of an externally generated acoustic wave is measured. The acoustic wave is generated in the air above a sample to be studied. The acoustic wave is directed onto the sample surface, coincident with a modulated light beam. Absorption of the light beam results in the periodic heating of the sample, at and near the sample surface. The air in contact with the sample surface is in turn heated, and produces a periodic phase shift in the reflected acoustic wave. This phase shift is detected and gives a direct measure of the periodic heating of the sample surface. An acoustic microscope may generate the acoustic wave. The sample is placed in water. An acoustic microscope lens produces an acoustic wave in the water, which focuses onto the sample surface, coincident with a modulated laser beam. The light beam is guided onto the sample using an optical fiber. Heating in the water directly above the illuminated sample produces a phase perturbation in the acoustic wave reflecting off the sample surface. This embodiment of the present invention allows surface heating to be measured with very high spatial resolution.
摘要翻译： 描述了测量周期性表面加热的非接触方法。 测量外部产生的声波的扰动。 在要研究的样品上方的空气中产生声波。 声波被引导到样品表面上，与调制的光束重合。 吸收光束导致样品在样品表面和样品表面附近的周期性加热。 与样品表面接触的空气又被加热，并在反射的声波中产生周期性的相移。 检测该相移，并给出样品表面的周期性加热的直接测量。 声学显微镜可能会产生声波。 将样品置于水中。 声学显微镜透镜在水中产生声波，其聚焦在样品表面上，与调制的激光束重合。 使用光纤将光束引导到样品上。 在照射样品正上方的水中加热在反射离开样品表面的声波中产生相位扰动。 本发明的该实施例允许以非常高的空间分辨率测量表面加热。
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37.发明授权公开(公告)号：US08402831B2
公开(公告)日：2013-03-26
申请号：US12660807
申请日：2010-03-03
CPC分类号： B06B1/0292 , Y10T29/49005
摘要： Low temperature wafer bonding (temperature of 450° C. or less) is employed to fabricate CMUTs on a wafer that already includes active electrical devices. The resulting structures are CMUT arrays integrated with active electronics by a low-temperature wafer bonding process. The use of a low-temperature process preserves the electronics during CMUT fabrication. With this approach, it is not necessary to make compromises in the CMUT or electronics designs, as is typical of the sacrificial release fabrication approach. Various disadvantages of sacrificial release, such as low process control, poor design flexibility, low reproducibility, and reduced performance are avoided with the present approach. With this approach, a CMUT array can be provided with per-cell electrodes connected to the substrate integrated circuitry. This enables complete flexibility in electronically assigning the CMUT cells to CMUT array elements.
摘要翻译： 采用低温晶片接合（450℃或更低的温度）在已包括有源电气设备的晶片上制造CMUT。 所得到的结构是通过低温晶片结合工艺与有源电子器件集成的CMUT阵列。 在CMUT制造期间使用低温过程保留电子元件。 采用这种方法，就像在牺牲释放制造方法中一样，不需要在CMUT或电子设计中做出妥协。 本方法避免了牺牲释放的各种缺点，如低过程控制，设计灵活性差，再现性低，性能下降。 利用这种方法，可以提供连接到衬底集成电路的每个单元电极的CMUT阵列。 这使得能够将CMUT单元电子分配给CMUT阵列元件的完全灵活性。
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38.发明申请Fabrication of capacitive micromachined ultrasonic transducers by local oxidation 有权通过局部氧化制造电容微机械超声换能器公开(公告)号：US20090142872A1
公开(公告)日：2009-06-04
申请号：US12288009
申请日：2008-10-14
IPC分类号： H01L21/30
CPC分类号： B06B1/0292
摘要： Fabrication methods for capacitive micromachined ultrasonic transducers (CMUTS) with independent and precise gap and post thickness control are provided. The fabrication methods are based on local oxidation or local oxidation of silicon (LOCOS) to grow oxide posts. The process steps enable low surface roughness to be maintained to allow for direct wafer bonding of the membrane. In addition, methods for fabricating a step in a substrate are provided with reduced or minimal over-etch time by utilizing the nonlinearity of oxide growth. The fabrication methods of the present invention produce CMUTs with unmatched uniformity, low parasitic capacitance, and high breakdown voltage.
摘要翻译： 提供了具有独立且精确的间隙和后厚度控制的电容微加工超声波换能器（CMUTS）的制造方法。 制造方法基于硅（LOCOS）的局部氧化或局部氧化以生长氧化物柱。 该工艺步骤使得能够保持低表面粗糙度以允许膜的直接晶片结合。 此外，通过利用氧化物生长的非线性，在衬底中制造步骤的方法具有减小的或最小的过蚀刻时间。 本发明的制造方法产生具有无与伦比的均匀性，低寄生电容和高击穿电压的CMUT。
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公开(公告)号：US20090122651A1
公开(公告)日：2009-05-14
申请号：US12288575
申请日：2008-10-20
CPC分类号： H02N1/008 , B06B1/0292 , Y10T29/49005
摘要： A capacitive micromachined ultrasonic transducer (CMUT) array connected to a separate electronic unit is provided. The CMUT array includes at least two active elements, a ground element at the array end, and a non-active element having isolation trenches disposed between the active and ground elements. The active element includes a doped first silicon layer, a doped second silicon layer, and a first insulating layer disposed there between. A cavity is in the first silicon layer having a cross section that includes vertical portions disposed at each end of a horizontal portion, and the vertical portion spans from the first insulating layer through the first silicon layer such that a portion of the first silicon layer is isolated by the first insulating layer and the cavity. A membrane layer on the first silicon layer spans the cavity. A bottom electrode is disposed on the bottom of the second silicon layer.
摘要翻译： 提供连接到单独的电子单元的电容微机械超声换能器（CMUT）阵列。 CMUT阵列包括至少两个有源元件，阵列端的接地元件以及设置在有源和接地元件之间的具有隔离沟槽的非有源元件。 有源元件包括掺杂的第一硅层，掺杂的第二硅层和设置在其间的第一绝缘层。 空腔在第一硅层中，其横截面包括设置在水平部分的每一端处的垂直部分，并且垂直部分跨越第一绝缘层穿过第一硅层，使得第一硅层的一部分为 由第一绝缘层和空腔隔离。 第一硅层上的膜层跨越空腔。 底部电极设置在第二硅层的底部。
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40.发明授权公开(公告)号：US07274623B2
公开(公告)日：2007-09-25
申请号：US11094874
申请日：2005-03-30
CPC分类号： B06B1/0292 , G10K9/12
摘要： A novel operation regime for capacitive micromachined ultrasonic transducers (cMUTs). The collapse-snapback operation in which the center of the membrane makes intermittent contact with the substrate. This combines two distinct states of the membrane (in-collapse and out-of-collapse) to unleash unprecedented acoustic output pressures into the medium. The collapse-snapback operation utilizes a larger range of membrane defection profiles (both collapsed and released membrane profiles) and generates higher acoustic output pressures than the conventional operation. Collapse-snapback operation meets the extreme acoustic transmit pressure demands of the ultrasonic industry.
摘要翻译： 电容式微加工超声换能器（cMUT）的新颖操作方案。 折叠回击操作，其中膜的中心与衬底间歇接触。 这结合了膜的两种截然不同的状态（塌陷和失真），以释放出前所未有的声输出压力进入介质。 塌陷 - 回弹操作利用更大范围的膜缺陷曲线（两个折叠和释放的膜轮廓），并产生比常规操作更高的声输出压力。 塌陷 - 回弹操作满足超声波行业的极端声学传输压力要求。
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