公开(公告)号：US20090014046A1

公开(公告)日：2009-01-15

申请号：US11964712

申请日：2007-12-27

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai

IPC分类号： H01L35/02 ,  B29C43/02

CPC分类号： H01L35/34 ,  B29C43/18 ,  H01L35/32

摘要： A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

摘要翻译： 提供了一种柔性热电装置及其制造方法。 柔性基板通过使用LIGA工艺，微机电工艺或电铸技术形成。 柔性基板用于制造热电装置。 基板的结构和材料特性为热电装置提供了灵活的性能和拉伸性能。 在柔性基板上形成诸如热通孔或金属扩散层的热转移增强结构，以克服柔性基板的低热传递性能。

公开(公告)号：US20070194465A1

公开(公告)日：2007-08-23

申请号：US11309041

申请日：2006-06-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L23/29

CPC分类号： H01L33/645 ,  F21K9/00 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

摘要翻译： 提供了包括第一基板，LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。 第一基板具有第一表面和相应的第二表面。 适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。 第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。 第三表面面向第二表面。 热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

公开(公告)号：US08242372B2

公开(公告)日：2012-08-14

申请号：US12835716

申请日：2010-07-13

申请人： Ming-Sheng Leu ,  Chun-Kai Liu ,  Jenn-Dong Hwang ,  Jin-Bao Wu ,  Chih-Kuang Yu

发明人： Ming-Sheng Leu ,  Chun-Kai Liu ,  Jenn-Dong Hwang ,  Jin-Bao Wu ,  Chih-Kuang Yu

IPC分类号： H05K1/00

CPC分类号： C23C14/0605 ,  B32B2307/302 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2313/04 ,  B32B2315/02 ,  C22C1/02 ,  C23C14/0617 ,  C23C14/165 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311 ,  Y10T428/12472 ,  Y10T428/12736 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/30 ,  Y10T428/31678

摘要： Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.

摘要翻译： 公开了一种导热电绝缘复合膜，包括设置在金属基板的顶表面和底表面上的界面层和绝缘层。 由于该膜具有导热性和电绝缘性，因此可以将其布置在堆芯片封装结构的芯片之间，从而同时在水平和垂直方向上散热。

公开(公告)号：US20110042805A1

公开(公告)日：2011-02-24

申请号：US12849774

申请日：2010-08-03

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain

IPC分类号： H01L23/498

CPC分类号： H01L35/32 ,  H01L2224/16225

摘要： Package structures for integrating thermoelectric components with stacking chips are presented. The package structures include a chip with a pair of conductive through vias. Conductive elements are disposed one side of the chip contacting the pair of conductive through vias. Thermoelectric components are disposed on the other side of the chip, wherein the thermoelectric component includes a first type conductive thermoelectric element and a second type conductive thermoelectric element respectively corresponding to and electrically connecting to the pair of conductive through vias. A substrate is disposed on the thermoelectric component, wherein the thermoelectric component, the pair of conductive through vias and the conductive element form a thermoelectric current path. Therefore, heat generated from the chip is transferred outward through a thermoelectric path formed from the thermoelectric components, the conductive through vias and the conductive elements.

摘要翻译： 介绍了将热电元件与堆叠芯片集成的封装结构。 封装结构包括具有一对导电通孔的芯片。 导电元件设置在与一对导电通孔相接触的芯片的一侧。 热电元件设置在芯片的另一侧，其中热电元件包括​​分别对应于并电连接到一对导电通孔的第一类型的导电热电元件和第二型导电热电元件。 基板设置在热电元件上，其中热电元件，一对导电通孔和导电元件形成热电电流路径。 因此，从芯片产生的热量通过由热电组件，导电通孔和导电元件形成的热电路径向外转移。

公开(公告)号：US20100224226A1

公开(公告)日：2010-09-09

申请号：US12429193

申请日：2009-04-24

申请人： Suh-Yun Feng ,  Chun-Kai Liu ,  Ming-Che Hsieh ,  Chih-Kuang Yu

发明人： Suh-Yun Feng ,  Chun-Kai Liu ,  Ming-Che Hsieh ,  Chih-Kuang Yu

IPC分类号： H01L35/02

CPC分类号： H01L35/32

摘要： A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers. The second heat-conductive and electrically insulating structure is connected between two adjacent second conductive layers.

摘要翻译： 热电转换装置包括热端子基板，冷端子基板和堆叠结构。 堆叠结构设置在热端子基板和冷端子基板之间。 层叠结构包括各自包括热电偶层，第一导电层和第二导电层的热电转换层，第一导热和电绝缘结构以及第二导热和电绝缘结构。 每个热电转换层被布置成堆叠结构。 第一导电层包括第一导电材料并且布置在P / N型热电转换元件的顶部。 第二导电层包括第二导电材料并且布置在P / N型热电转换元件的底部。 第一导热和电绝缘结构连接在两个相邻的第一导电层之间。 第二导热和电绝缘结构连接在两个相邻的第二导电层之间。

公开(公告)号：US20090258449A1

公开(公告)日：2009-10-15

申请号：US12489445

申请日：2009-06-23

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L21/50

CPC分类号： H01L33/645 ,  F21K9/00 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit substrate having a third surface and a corresponding fourth surface are provided. The second surface and the third surface respectively have a plurality of electrodes. Then, a plurality of N-type semiconductor materials and a plurality of P-type semiconductor materials alternatively arranged on the electrodes are formed. Then, the first circuit substrate and the second circuit substrate are assembled. The two type semiconductor materials are located between the electrodes of the first circuit substrate and the second circuit substrate. The two type semiconductor materials are electrically connected to the first circuit substrate and the second circuit substrate through the electrodes. Finally, an LED chip is arranged on the first surface and electrically connected to the first circuit substrate.

摘要翻译： 提供一种制造发光二极管封装结构的方法。 首先，提供具有第一表面和对应的第二表面的第一电路基板和具有第三表面和相应的第四表面的第二电路基板。 第二表面和第三表面分别具有多个电极。 然后，形成交替布置在电极上的多个N型半导体材料和多个P型半导体材料。 然后，组装第一电路基板和第二电路基板。 两种类型的半导体材料位于第一电路基板和第二电路基板的电极之间。 两种类型的半导体材料通过电极电连接到第一电路基板和第二电路基板。 最后，LED芯片布置在第一表面上并电连接到第一电路基板。

公开(公告)号：US07586125B2

公开(公告)日：2009-09-08

申请号：US11309041

申请日：2006-06-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/645 ,  F21K9/00 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

摘要翻译： 提供了包括第一基板，LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。 第一基板具有第一表面和相应的第二表面。 适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。 第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。 第三表面面向第二表面。 热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

公开(公告)号：US20080006843A1

公开(公告)日：2008-01-10

申请号：US11861294

申请日：2007-09-26

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L33/645 ,  H01L2224/48227 ,  Y10S257/93 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a first substrate, one or more LED chips, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

摘要翻译： 提供了包括第一基板，一个或多个LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。 第一基板具有第一表面和相应的第二表面。 适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。 第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。 第三表面面向第二表面。 热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

公开(公告)号：US08546924B2

公开(公告)日：2013-10-01

申请号：US12849774

申请日：2010-08-03

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain

IPC分类号： H01L23/02

CPC分类号： H01L35/32 ,  H01L2224/16225

摘要： Package structures for integrating thermoelectric components with stacking chips are presented. The package structures include a chip with a pair of conductive through vias. Conductive elements are disposed one side of the chip contacting the pair of conductive through vias. Thermoelectric components are disposed on the other side of the chip, wherein the thermoelectric component includes a first type conductive thermoelectric element and a second type conductive thermoelectric element respectively corresponding to and electrically connecting to the pair of conductive through vias. A substrate is disposed on the thermoelectric component, wherein the thermoelectric component, the pair of conductive through vias and the conductive element form a thermoelectric current path. Therefore, heat generated from the chip is transferred outward through a thermoelectric path formed from the thermoelectric components, the conductive through vias and the conductive elements.

摘要翻译： 介绍了将热电元件与堆叠芯片集成的封装结构。 封装结构包括具有一对导电通孔的芯片。 导电元件设置在与一对导电通孔相接触的芯片的一侧。 热电元件设置在芯片的另一侧，其中热电元件包括​​分别对应于并电连接到一对导电通孔的第一类型的导电热电元件和第二型导电热电元件。 基板设置在热电元件上，其中热电元件，一对导电通孔和导电元件形成热电电流路径。 因此，从芯片产生的热量通过由热电组件，导电通孔和导电元件形成的热电路径向外转移。

公开(公告)号：US08222728B2

公开(公告)日：2012-07-17

申请号：US12336320

申请日：2008-12-16

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Yuan Cheng

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Yuan Cheng

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L27/16 ,  H01L23/38 ,  H01L2924/0002 ,  H01S3/04 ,  H01S5/024 ,  H01S5/02476 ,  H01L2924/00

摘要： An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.

摘要翻译： 一种活性固体散热装置及其制造方法涉及一种高效固体冷却装置，其中由具有小面积和高发热密度的热源产生的热量使用热的热传导特性扩散到整个基板 热电子（TI）结构的电子和热电子（TI）结构和热电（TE）结构共享热扩散到的衬底。 此外，共用衬底用作TE结构的冷端，并且向共享衬底的扩散的热量被泵送到TE结构的热端的另一个TE结构的衬底。