摘要:
A mechanism for use in insertion and extraction of a first printed circuit board (PCB) to and from a second PCB so as to engage and disengage an electrical connector of the first PCB to and from a corresponding electrical connector of the second PCB. The insertion and extraction mechanism includes a stiffener bar and a mounting block. The stiffener bar is affixed to the first PCB immediately adjacent to the electrical connector for stiffening the first PCB in the vicinity of the electrical connector. The mounting block is affixed to the second PCB immediately adjacent to the corresponding electrical connector. A threaded fastener is carried by the stiffener bar and is engageable with the mounting block. Rotation of the fastener in a first direction causes the first PCB to be inserted to the second PCB which causes the electrical connector to be engaged with the corresponding electrical connector. Rotation of the fastener in a second direction causes the first PCB to be extracted from the second PCB which causes the electrical connector to be disengaged from the corresponding electrical connector. An alignment pin of the stiffener bar is engageable with an alignment opening in the mounting block to insure that the electrical connector and the corresponding electrical connector are properly aligned during insertion and extraction of the first PCB to and from the second PCB.
摘要:
Techniques for cooling a data center include operating an air handling system in a first mode of operation to provide an outside airflow cooled through a direct evaporative cooling module to a data center without substantial mixing of the cooled outside airflow with another airflow; determining that a measured outside air contaminant level exceeds a setpoint contaminant level; and based on the determination, operating the air handling system in a second mode of operation to provide a datacenter return airflow cooled through an indirect evaporative cooling module to the data center without substantial mixing of the cooled return airflow with another airflow.
摘要:
A cooling apparatus adapted for impingement cooling of electronic components in an electronic system comprises an air mover, one or more heat sinks configured with multiple fins, and one or more flexible tubing segments. The flexible tubing segments are coupled to the air mover and are configured to direct airflow onto the heat sinks for impingement cooling.
摘要:
A management system includes a management application that is executable in a central management station and is operative to manage hardware components one or more systems using visual graphics that presents assembly and repair functionality in combination with system health information. The management application is further operative to present a visual set of step-by-step instructions through the visual graphics for addition, deletion, and/or replacement of the managed hardware components.
摘要:
A measurement system includes a transceiver and a transponder. The transceiver is configured to send and receive radio frequency signals. The transponder is configured to receive radio frequency signals from the transceiver and to send radio frequency signals to the transceiver. The transponder includes a sensor. The transceiver is configured to send an activation signal to the transponder thereby enabling the first transponder sensor to make a measurement and to hold the measurement.
摘要:
A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.
摘要:
An airflow distribution control system for usage in a raised-floor data center comprises an under-floor partition with a controllable flow resistance and a sensor. The partition is capable of selective positioning in a plenum beneath the raised-floor. The sensor is communicatively coupled to the partition and detects a parameter indicative of airflow distribution and controls the flow resistance based on the parameter.
摘要:
An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.
摘要:
A computer fan efficiency feedback system and method are presented. In one embodiment, an indication electronic components are operating is received. A cooling system is directed to provide air flow to the electronic components. In one exemplary implementation the cooling system includes a fan. The fan speed is modulated in accordance with a fan speed efficiency control plan. For example, the fan speed efficiency control plan includes directions for changing or modulating the fan speed to a value that maximizes an efficiency ratio of flow work to input power supplied to the fan.
摘要:
A divider for separating integrated circuit cards in a card cage comprises a planar member, at least one engagement edge disposed on the planar member and capable of engaging a slot in the card cage, and at least one aperture formed in and extending fully through the planar member. The at least one aperture facilitates airflow through the card cage.