公开(公告)号：US10547156B1

公开(公告)日：2020-01-28

申请号：US16052441

申请日：2018-08-01

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Ashley J. Maker ,  Kumar Satya Harinadh Potluri

IPC: H01S5/022 ,  G02B6/42 ,  G02B6/12 ,  H01S5/02

Abstract: A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.

公开(公告)号：US12255690B2

公开(公告)日：2025-03-18

申请号：US18177992

申请日：2023-03-03

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Matthew J. Traverso

IPC: H04B10/00 ,  H04B10/50 ,  H04J14/00

Abstract: A pluggable device and method are presented. The pluggable device includes a substrate, a first pin positioned on the substrate, an optical source positioned on the substrate, and an integrated circuit positioned on the substrate. The optical source produces a source optical signal and transmits the source optical signal through the first pin. The integrated circuit transmits a received optical data signal and transmits a data signal based on a portion of the optical data signal.

公开(公告)号：US11728616B2

公开(公告)日：2023-08-15

申请号：US17444202

申请日：2021-08-02

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Vipulkumar K. Patel ,  Dominic F. Siriani

IPC: H01S5/02 ,  H01S5/042 ,  H01S5/343 ,  H01S5/40 ,  H01S5/34 ,  G02B6/42

CPC classification number: H01S5/0215 ,  H01S5/021 ,  H01S5/0218 ,  H01S5/042 ,  H01S5/343 ,  H01S5/3412 ,  H01S5/4025 ,  G02B6/42 ,  G02B6/4234

Abstract: A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

公开(公告)号：US11614578B2

公开(公告)日：2023-03-28

申请号：US17446013

申请日：2021-08-26

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Matthew J. Traverso ,  Mark C. Nowell

IPC: G02B6/38 ,  F21V8/00 ,  G02B6/42 ,  G02B6/12

Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.

公开(公告)号：US11609389B2

公开(公告)日：2023-03-21

申请号：US17301407

申请日：2021-04-01

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Kumar Satya Harinadh Potluri ,  Jock T. Bovington ,  Ashley J. Maker

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25 ,  B23K1/005 ,  B23K103/00

Abstract: A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

公开(公告)号：US11418005B2

公开(公告)日：2022-08-16

申请号：US16581923

申请日：2019-09-25

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Vipulkumar K. Patel ,  Jock T. Bovington ,  Matthew J. Traverso

IPC: H01S5/00 ,  H01S5/026 ,  H01S3/23 ,  H01L31/0304 ,  G02B6/12 ,  H01S5/14 ,  H01S5/10 ,  H01S5/50 ,  H01S5/028 ,  H01S5/02

Abstract: Described herein is a two chip photonic device (e.g., a hybrid master oscillator power amplifier (MOPA)) where a gain region and optical amplifier region are formed on a III-V chip and a variable reflector (which in combination with the gain region forms a laser cavity) is formed on a different semiconductor chip that includes silicon, silicon nitride, lithium niobate, or the like. Sides of the two chips are disposed in a facing relationship so that optical signals can transfer between the gain region, the variable reflector, and the optical amplifier.

公开(公告)号：US11347003B2

公开(公告)日：2022-05-31

申请号：US17074539

申请日：2020-10-19

Applicant: Cisco Technology, Inc.

Inventor： Norbert Schlepple ,  Jock T. Bovington

IPC: G02B6/293 ,  H04J14/02 ,  G02B6/42

Abstract: Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.

公开(公告)号：US11133645B2

公开(公告)日：2021-09-28

申请号：US16364994

申请日：2019-03-26

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Kenneth J. Thomson ,  Dominic F. Siriani

IPC: H01S5/026 ,  H01S5/02 ,  H01S5/028 ,  H01S5/11 ,  H01S5/02325 ,  H01S5/042 ,  H01S5/00

Abstract: The present disclosure provides for laser integration into photonic platforms in which a first wafer, including a first substrate and a first insulator that includes a first plurality of dies that each include a first set of optical waveguides, is bonded to a second wafer, including a second substrate and a second insulator that includes a second plurality of dies that each include a second set of optical waveguides. The bond between the two wafers defines a wafer bond interface joining the first insulator with the second insulator and vertically aligning the first plurality of dies with the second plurality of dies such that respective first sets of optical waveguides are optically coupled with respective second sets of optical waveguides.

公开(公告)号：US11018473B1

公开(公告)日：2021-05-25

申请号：US16203463

申请日：2018-11-28

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Jock T. Bovington ,  Vipulkumar K. Patel

IPC: H01S5/026 ,  H01S5/343 ,  H01S5/02 ,  G02B6/136 ,  G02B6/122 ,  H01S5/028 ,  H01S5/10 ,  G02B6/13 ,  G02B6/12

Abstract: Embodiments provide for selective-area growth of III-V materials for integration with silicon photonics. The resulting platform includes a substrate; an insulator, extending a first distance from the substrate, including a passive optical component at a second distance from the substrate less than the first distance, and defining a pit extending to the substrate; and a III-V component, extending from the substrate within in the pit defined in the insulator, the III-V component including a gain medium included at the second distance from the substrate and optically coupled with the passive optical component. The pit may define an Optical Coupling Interface between the III-V component and the passive optical component, or a slit defined between the III-V component and the passive optical component may define the Optical Coupling Interface.

公开(公告)号：US10746934B2

公开(公告)日：2020-08-18

申请号：US16058608

申请日：2018-08-08

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/10

Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.