公开(公告)号：US11664285B2

公开(公告)日：2023-05-30

申请号：US17044713

申请日：2019-04-03

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Scott Christopher Pollard

IPC: H01L23/15 ,  H01L21/50 ,  H01L23/36 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/15 ,  H01L21/50 ,  H01L23/36 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/14 ,  H05K1/0206 ,  H05K1/0306

Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.

公开(公告)号：US20230044556A1

公开(公告)日：2023-02-09

申请号：US17967354

申请日：2022-10-17

Applicant: CORNING INCORPORATED

Inventor： Jin Su Kim ,  Yu Xiao

IPC: H01L21/02 ,  C03B33/07

Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

公开(公告)号：US11573078B2

公开(公告)日：2023-02-07

申请号：US17103105

申请日：2020-11-24

Applicant: CORNING INCORPORATED

Inventor： William John Furnas ,  Jin Su Kim ,  Balamurugan Meenakshi Sundaram

IPC: G01B11/16 ,  G01L1/24

Abstract: Apparatus can comprise a cavity at least partially defined by a first major surface of a reference block and configured to receive a sample. The apparatus can comprise a first polarization-switching light source configured to emit a first polarization-switched light beam toward the cavity and a first detector configured to detect a corresponding signal. The apparatus can comprise a second polarization-switching light source configured to emit a second polarization-switched light beam toward the cavity and a second detector configured to detect a corresponding signal. The first reference block can be positioned between the second detector and the second reference block. Methods of determining an estimated stress profile can comprise determining a central tension from a measured retardation profile of the sample. Methods can comprise determining an initial stress profile from a refractive index profile of the sample. Methods can comprise scaling and adjusting stress profiles.

公开(公告)号：US11527452B2

公开(公告)日：2022-12-13

申请号：US17743643

申请日：2022-05-13

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun-Ro Yoon

IPC: H01L23/495 ,  H01L23/13 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  B32B17/06 ,  C03C23/00

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US20220212446A1

公开(公告)日：2022-07-07

申请号：US17605103

申请日：2020-04-13

Applicant: CORNING INCORPORATED

Inventor： Jason Thomas Harris ,  Jin Su Kim ,  Peter Joseph Lezzi ,  Natesan Venkataraman

IPC: B32B17/06 ,  C03C21/00 ,  C03C23/00 ,  C03B27/052 ,  C03B27/04 ,  C03B17/06

Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.

公开(公告)号：US20220161518A1

公开(公告)日：2022-05-26

申请号：US17437191

申请日：2020-02-25

Applicant: CORNING INCORPORATED

Inventor： Petr Gorelchenko ,  Jin Su Kim ,  Lu Zhang

IPC: B32B7/028 ,  B32B17/06 ,  C03C3/091 ,  C03C3/097 ,  C03C4/18

Abstract: A glass substrate comprises a glass clad layer fused to a glass core layer. The glass core layer comprises a core glass composition having an average core coefficient of thermal expansion (CTEcore) and the glass clad layer comprises a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore. A maximum tensile stress in the glass core layer is less than 15 MPa.

公开(公告)号：US20220144681A1

公开(公告)日：2022-05-12

申请号：US17435539

申请日：2020-02-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Timothy Michael Gross ,  Jin Su Kim ,  Jesse Kohl ,  Hung Cheng Lu ,  Yu Xiao ,  Liying Zhang ,  Lu Zhang

IPC: C03B17/02 ,  B32B17/06 ,  C03B17/06 ,  C03C3/093 ,  C03C3/091

Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.

公开(公告)号：US11236012B2

公开(公告)日：2022-02-01

申请号：US17040070

申请日：2019-03-28

Applicant: CORNING INCORPORATED

Inventor： George Halsey Beall ,  Heather Debra Boek ,  Ling Cai ,  Jin Su Kim ,  Dean Michael Thelen ,  Mark Owen Weller

IPC: B32B17/06 ,  C03C10/00 ,  C03B32/02 ,  C03B17/06

Abstract: A glass-ceramic that includes: SiO2 from about 35 mol % to about 80 mol %; B2O3 from about 10 mol % to about 50 mol %; P2O5 from about 10 mol % to about 50 mol %; and an optional addition of one or more of CaO, MgO and Bi2O3 from 0 mol % to about 5 mol %, wherein the glass-ceramic further comprises a boron-phosphate crystalline phase.

公开(公告)号：US20210156674A1

公开(公告)日：2021-05-27

申请号：US17103105

申请日：2020-11-24

Applicant: CORNING INCORPORATED

Inventor： William John Furnas ,  Jin Su Kim ,  Balamurugan Meenakshi Sundaram

IPC: G01B11/16 ,  G01L1/24

Abstract: Apparatus can comprise a cavity at least partially defined by a first major surface of a reference block and configured to receive a sample. The apparatus can comprise a first polarization-switching light source configured to emit a first polarization-switched light beam toward the cavity and a first detector configured to detect a corresponding signal. The apparatus can comprise a second polarization-switching light source configured to emit a second polarization-switched light beam toward the cavity and a second detector configured to detect a corresponding signal. The first reference block can be positioned between the second detector and the second reference block. Methods of determining an estimated stress profile can comprise determining a central tension from a measured retardation profile of the sample. Methods can comprise determining an initial stress profile from a refractive index profile of the sample. Methods can comprise scaling and adjusting stress profiles.

公开(公告)号：US20210041649A1

公开(公告)日：2021-02-11

申请号：US17044707

申请日：2019-04-03

Applicant: CORNING INCORPORATED

Inventor： Lars Martin Otfried Brusberg ,  Jin Su Kim ,  Aramais Robert Zakharian

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/03 ,  C03C3/04 ,  H05K3/00

Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).