Abstract:
The regulation of the output voltage of a voltage multiplier driven by a ring oscillator, an inverter of which is substituted by a NOR gate for providing a terminal through which stopping the oscillation, is effected by controlling the oscillation frequency in function of the current delivered by the voltage multiplier by means of a transistor T1 working as a current generator connected in series with a regulating chain of series-connected diodes by biasing the gate of the transistor with a constant voltage Vref, thus imposing a reference current Iref through the transistor. The voltage signal across the transistor is fed to the input of a first inverter with a preset triggering threshold and the output signal of the inverter is fed through an amplifying and phase-regenerating stage to said terminal for stopping the oscillation of said NOR gate of the ring oscillator. When the discharge current through the regulating chain becomes greater than the imposed current Iref, across the transistor T1 a voltage signal develops which, beyond a certain threshold, determines the switching of the inverter and, through the amplifying and phase-regenerating stage, causes a stop of the oscillation which resumes only when conduction through the regulating chain stops. At steady state the oscillation frequency will result controlled so as to maintain constant the output voltage of the voltage multiplier and to limit the discharge current through the regulating chain thus limiting power consumption.
Abstract:
Example embodiments for configuring a non-volatile memory device may comprise configuring M physical partitions of the non-volatile memory into two or more banks, wherein the two or more banks respectively comprise one or more of the M physical partitions, and wherein at least a first of the M physical partitions comprises a first size and wherein at least a second of the M physical partitions comprises a second size.
Abstract:
Example embodiments for configuring a non-volatile memory device may comprise configuring M physical partitions of the non-volatile memory into two or more banks, wherein the two or more banks respectively comprise one or more of the M physical partitions, and wherein at least a first of the M physical partitions comprises a first size and wherein at least a second of the M physical partitions comprises a second size.
Abstract:
A memory array and a method of writing to a unidirectional non-volatile storage cell are disclosed whereby a user data word is transformed to an internal data word and written to one or more unidirectional data storage cells according to a cell coding scheme. A check word may be generated that corresponds to the internal data word. In some embodiments, the check word may be generated by inverting one or more bits of an intermediate check word. Other embodiments may be described and claimed.
Abstract:
Cumulative delay contributions introduced by an input buffer and by the metal line that distributes the buffered external control signal to data transfer circuits for performing a transfer of data to and from an integrated device are reduced by having the external signal distributed unbuffered through a metal line of sufficiently large size. This introduces a negligible intrinsic propagation delay being within the specified maximum admitted input pad capacitance. The delay reduction is also based on locally dedicated input buffers for each data transfer circuit, and for applying thereto a buffered replica of the external signal present on the metal line.
Abstract:
Cumulative delay contributions introduced by an input buffer and by the metal line that distributes the buffered external control signal to data transfer circuits for performing a transfer of data to and from an integrated device are reduced by having the external signal distributed unbuffered through a metal line of sufficiently large size. This introduces a negligible intrinsic propagation delay being within the specified maximum admitted input pad capacitance. The delay reduction is also based on locally dedicated input buffers for each data transfer circuit, and for applying thereto a buffered replica of the external signal present on the metal line.
Abstract:
A memory device includes a group of memory cells organized in rows and columns and a first addressing circuit for addressing said memory cells of said group on the basis of a cell address. The device further includes a plurality of sets of reference cells, associated to the group, each of said set having a plurality of reference cells, and a second addressing circuit for addressing one of the reference cells during operations of read and verify of addressed memory cells.
Abstract:
An array of non-volatile memory cells includes a row with N cells and M cells. In a partial-storage step, a datum is stored in a first portion of the N cells of the row. A second portion of the N cells of the row are in an “erase” state. A first error correction code associated with the datum is stored in the M cells along with a first enable bit or guard-cell which is indicative of whether the first error correction code is active. The number of M cells, adjacent to the N cells of the row, is defined on the basis of the number N of cells. In the event the datum stored in the first portion of the N cells of the row is subsequently updated or manipulated, a second error correction code associated with the updated or manipulated datum is determined and stored in the second portion of the N cells of the row along with a second enable bit or guard-cell which is indicative of whether the second error correction code is active. At that point, the first enable bit or guard-cell is modified to indicate that the first error correction code is not active.
Abstract:
A redundancy scheme for a memory integrated circuit having at least two memory sectors and, associated with each memory sector, a respective memory location selector for selecting memory locations within the memory sector according to an address. The redundancy scheme comprises at least one redundant memory sector adapted to functionally replace one of the at least two memory sectors, and a redundancy control circuitry for causing the functional replacement of a memory sector declared to be unusable by one of the at least one redundant memory sector; the redundancy control circuitry detects an access request to a memory location within the unusable memory sector and diverts the access request to a corresponding redundant memory location in the redundant memory sector. Associated with each memory location selector, respective power supply control means are provided adapted to selectively connect/disconnect the associated memory location selector to/from a power supply distribution line. A memory sector unusable status indicator element is associated with each memory sector, for controlling the respective power supply control means so as to cause, when set, the selective disconnection of the respective memory location selector from the power supply distribution line.
Abstract:
An electrically erasable and programmable non-volatile memory device comprises at least one memory sector comprising an array of memory cells arranged in rows and first-level columns, the first-level columns being grouped together in groups of first-level columns each coupled to a respective second-level column, first-level selection means for selectively coupling one first-level column for each group to the respective second-level column, second-level selection means for selecting one of the second-level columns, first direct memory access test means activatable in a first test mode for directly coupling a selected memory cell of the array to a respective output terminal of the memory device, redundancy columns of redundancy memory cells for replacing defective columns of memory cells, and a redundancy control circuit comprising defective-address storage means for storing addresses of the defective columns and activating respective redundancy columns when the defective columns are addressed. The redundancy control circuit comprises second direct memory access test means activatable in a second test mode together with the first direct memory access test means for directly coupling memory elements of the defective-address storage means to respective second-level columns of the array, whereby the memory elements of the defective-address storage means can be directly coupled to output terminals of the memory device.