Trench sidewall profile for device isolation
    31.
    发明授权
    Trench sidewall profile for device isolation 失效
    用于器件隔离的沟槽侧壁型材

    公开(公告)号:US06514805B2

    公开(公告)日:2003-02-04

    申请号:US09896532

    申请日:2001-06-30

    CPC classification number: H01L21/76229 H01L21/76232 H01L27/24

    Abstract: A method comprising forming a first trench in a substrate, and forming a second trench in the substrate, the second trench intersecting the first trench and having a retrograde sidewall profile relative to a direction from a top of the trench to a bottom of the trench. An apparatus comprising a matrix of cells in a substrate formed by a plurality of first trenches and a plurality of second trenches, the plurality of second trenches intersecting the plurality of first trenches and having a retrograde sidewall profile relative to a direction from a top to a bottom of the respective trench; and an electrically accessible storage device coupled to respective ones of the matrix of cells.

    Abstract translation: 一种方法,包括在衬底中形成第一沟槽,以及在所述衬底中形成第二沟槽,所述第二沟槽与所述第一沟槽相交并且具有相对于从所述沟槽的顶部到所述沟槽的底部的方向的逆向侧壁轮廓。 一种包括由多个第一沟槽和多个第二沟槽形成的衬底中的单元阵列的装置,所述多个第二沟槽与所述多个第一沟槽相交并且具有相对于从顶部到顶部的方向的逆向侧壁轮廓 相应沟槽的底部; 以及耦合到所述单元阵列中的相应单元的电可存储存储设备。

    Dual trench isolation for a phase-change memory cell and method of making same
    33.
    发明授权
    Dual trench isolation for a phase-change memory cell and method of making same 有权
    用于相变存储器单元的双沟槽隔离及其制造方法

    公开(公告)号:US06437383B1

    公开(公告)日:2002-08-20

    申请号:US09745322

    申请日:2000-12-21

    Applicant: Daniel Xu

    Inventor: Daniel Xu

    Abstract: The invention relates to a phase-change memory device. The device includes a double-trench isolation structure around the diode stack that communicates to the lower electrode. The present invention also relates to a method of making a phase-change memory device. The method includes forming two orthogonal and intersecting isolation trenches around a memory cell structure diode stack.

    Abstract translation: 本发明涉及一种相变存储器件。 该器件包括二极管堆叠周围的双沟槽隔离结构,其与下部电极连通。 本发明还涉及一种制造相变存储器件的方法。 该方法包括在存储单元结构二极管堆叠周围形成两个正交和相交的隔离沟槽。

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