利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

84 条记录 (耗时 0.021 秒)

    HYBRID LASER ARC WELDING PROCESS AND APPARATUS
    33.
    发明申请
    HYBRID LASER ARC WELDING PROCESS AND APPARATUS 审中-公开
    混合激光焊接工艺和设备

    公开(公告)号：US20130309000A1

    公开(公告)日：2013-11-21

    申请号：US13476458

    申请日：2012-05-21

    申请人： Dechao Lin ,  David Vincent Bucci ,  Srikanth Chandrudu Kottilingam ,  Yan Cui

    发明人： Dechao Lin ,  David Vincent Bucci ,  Srikanth Chandrudu Kottilingam ,  Yan Cui

    IPC分类号： B23K28/02 ,  B23K101/00

    CPC分类号： B23K28/02 ,  B23K26/0608 ,  B23K26/0652 ,  B23K26/0676 ,  B23K26/348 ,  Y10T403/477

    摘要： A welding method and apparatus that simultaneously utilize laser beams and arc welding techniques. The welding apparatus generates a first laser beam that is projected onto a joint region between at least two workpieces to produce a first laser beam projection on adjacent surfaces of the workpieces and to cause the first laser beam projection to travel along the joint region and penetrate the joint region. The apparatus also generates an electric arc to produce an arc projection that encompasses the first laser beam projection and travels therewith along the joint region to form a molten weld pool. In addition, the apparatus generates a pair of lateral laser beams that produce lateral laser beams projections that are encompassed by the arc projection and are spaced laterally apart from the joint region to interact with portions of the weld pool that solidify to define weld toes of the weld joint.

    摘要翻译： 一种同时使用激光束和电弧焊接技术的焊接方法和装置。 焊接装置产生投射在至少两个工件之间的接合区域上的第一激光束，以在工件的相邻表面上产生第一激光束投影，并且使第一激光束投影沿着接合区域行进并穿透 联合区域。 该装置还产生电弧以产生包围第一激光束突起并沿其沿着接合区域行进的弧形突起，以形成熔融熔池。 另外，该装置产生一对横向激光束，该横向激光束产生横向激光束突起，该突出部被弧形突起包围，并且与接合区域横向间隔开，以与凝固的部分熔池相互作用，以限定焊接趾部 焊缝。

    Process of filling openings in a component
    35.
    发明授权
    Process of filling openings in a component 有权
    填充部件中的开口的过程

    公开(公告)号：US08087565B2

    公开(公告)日：2012-01-03

    申请号：US12206033

    申请日：2008-09-08

    申请人： Srikanth Chandrudu Kottilingam ,  Charles Gitahi Mukira ,  Warren Martin Miglietti ,  Arthur S. Peck ,  Christopher Penny ,  Yan Cui ,  Steven Rauch

    发明人： Srikanth Chandrudu Kottilingam ,  Charles Gitahi Mukira ,  Warren Martin Miglietti ,  Arthur S. Peck ,  Christopher Penny ,  Yan Cui ,  Steven Rauch

    IPC分类号： B23K31/00 ,  B23P6/04

    CPC分类号： B23K1/001 ,  B23K1/0018 ,  B23K35/0244 ,  B23K35/3033 ,  B23K35/3046 ,  B23K2101/001 ,  Y10T29/49318

    摘要： A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.

    摘要翻译： 一种用于在高温部件中填充开口的方法，包括盲孔，通孔和空腔。 该方法需要通过混合至少一种基础合金的颗粒和含有足够量的熔点降低剂的第二种合金来形成粉末混合物，使其熔点比基体合金低。 将粉末混合物与粘合剂组合并压实以形成压实的预制件，然后将其加热以除去粘合剂并形成刚性烧结预制件。 烧结的预成型件被制造或任选地进一步成形为具有横截面形状和尺寸以实现与开口的高达200微米的间隙，之后将预成型件放置在开口中并在开口内扩散粘合 形成包含分散在由第二合金形成的基体中的基础合金的颗粒的钎焊。

    PROCESS OF CLOSING AN OPENING IN A COMPONENT
    36.
    发明申请
    PROCESS OF CLOSING AN OPENING IN A COMPONENT 有权
    关闭组件中打开的过程

    公开(公告)号：US20110024393A1

    公开(公告)日：2011-02-03

    申请号：US12511494

    申请日：2009-07-29

    申请人： Yan Cui ,  Gitahi Charles Mukira ,  Srikanth Chandrudu Kottilingam

    发明人： Yan Cui ,  Gitahi Charles Mukira ,  Srikanth Chandrudu Kottilingam

    IPC分类号： B23K9/04

    CPC分类号： F01D5/147 ,  B22C21/14 ,  B23K10/027 ,  B23K26/32 ,  B23K26/342 ,  B23K35/30 ,  B23K35/3066 ,  B23K2101/001 ,  B23K2103/18 ,  B23K2103/26 ,  C22C19/055 ,  C22C19/056 ,  C22C19/07 ,  F05D2230/10 ,  F05D2230/21 ,  F05D2230/232

    摘要： A process for closing an opening in a surface of a component, and components formed thereby. The process entails forming a channel in the component surface so that the channel at least partially surrounds an opening at the component surface. An alloy is then deposited in the channel to form a crack-free deposit in the channel. A step is then machined that intersects the opening and is at least partially formed in the deposit. The step defines a recess that is at least partially surrounded by a peripheral portion of the deposit and has a surface recessed into the component surface. A cap is placed in the recess and welded to the peripheral portion of the deposit to define a weld joint that completely closes the opening. The surface of the weld joint is then machined to form a machined surface that is substantially flush with the component surface.

    摘要翻译： 用于封闭部件表面中的开口的过程，以及由此形成的部件。 该过程需要在部件表面中形成通道，使得通道至少部分地围绕部件表面处的开口。 然后将合金沉积在通道中以在通道中形成无裂纹沉积物。 然后加工与开口相交并且至少部分地形成在沉积物中的台阶。 台阶限定了至少部分地被沉积物的周边部分包围的凹部，并且具有凹入到部件表面中的表面。 将盖放置在凹部中并焊接到沉积物的周边部分以限定完全关闭开口的焊接接头。 然后对焊接接头的表面进行加工，以形成与部件表面基本齐平的机加工表面。

    PROCESS OF FILLING OPENINGS IN A COMPONENT
    37.
    发明申请
    PROCESS OF FILLING OPENINGS IN A COMPONENT 有权
    在组件中填充开口的过程

    公开(公告)号：US20100059573A1

    公开(公告)日：2010-03-11

    申请号：US12206033

    申请日：2008-09-08

    申请人： Srikanth Chandrudu Kottilingam ,  Charles Gitahi Mukira ,  Warren Martin Miglietti ,  Arthur S. Peck ,  Christopher Penny ,  Yan Cui ,  Steven Rauch

    发明人： Srikanth Chandrudu Kottilingam ,  Charles Gitahi Mukira ,  Warren Martin Miglietti ,  Arthur S. Peck ,  Christopher Penny ,  Yan Cui ,  Steven Rauch

    IPC分类号： B23K1/20

    CPC分类号： B23K1/001 ,  B23K1/0018 ,  B23K35/0244 ,  B23K35/3033 ,  B23K35/3046 ,  B23K2101/001 ,  Y10T29/49318

    摘要： A process for filling openings, including blind holes, through-holes, and cavities, in high temperature components. The process entails forming a powder mixture by mixing particles of at least a base alloy and a second alloy that contains a sufficient amount of a melting point depressant to have a lower melting temperature than the base alloy. The powder mixture is combined with a binder and compacted to form a compacted preform, which is then heated to remove the binder and form a rigid sintered preform. The sintered preform is produced, or optionally is further shaped, to have a cross-sectional shape and dimensions to achieve a clearance of up to 200 micrometers with the opening, after which the preform is placed in the opening and diffusion bonded within the opening to form a brazement comprising the particles of the base alloy dispersed in a matrix formed by the second alloy.

    摘要翻译： 一种用于在高温部件中填充开口的方法，包括盲孔，通孔和空腔。 该方法需要通过混合至少一种基础合金的颗粒和含有足够量的熔点降低剂的第二种合金来形成粉末混合物，使其熔点比基体合金低。 将粉末混合物与粘合剂组合并压实以形成压实的预制件，然后将其加热以除去粘合剂并形成刚性烧结预制件。 烧结的预成型件被制造或任选地进一步成形为具有横截面形状和尺寸以实现与开口的高达200微米的间隙，之后将预成型件放置在开口中并在开口内扩散粘合 形成包含分散在由第二合金形成的基体中的基础合金的颗粒的钎焊。