公开(公告)号：US20190088510A1

公开(公告)日：2019-03-21

申请号：US16082902

申请日：2017-02-28

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B7/02 ,  B08B3/08

Abstract: High-performance substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus are provided.A substrate cleaning apparatus, including: a substrate holding and rotating mechanism that holds and rotates a substrate; a first cleaning mechanism that brings a cleaning tool into contact with the substrate to clean the substrate, cleans the substrate using two-fluid jet, or cleans the substrate using ozone water; and a second cleaning mechanism that cleans the substrate using an ultrasonic cleaning liquid is provided.

公开(公告)号：US20190080933A1

公开(公告)日：2019-03-14

申请号：US16189896

申请日：2018-11-13

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  B08B3/02 ,  B08B1/00

Abstract: A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate.

公开(公告)号：US20160144410A1

公开(公告)日：2016-05-26

申请号：US14944551

申请日：2015-11-18

Applicant: Ebara Corporation

Inventor： Tomoatsu ISHIBASHI

IPC: B08B1/04

CPC classification number: B08B1/04 ,  A46B9/005 ,  A46B13/02 ,  B08B1/003 ,  B08B1/02 ,  B08B3/041 ,  B08B11/00 ,  H01L21/00 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68735 ,  H01L21/68764

Abstract: A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

Abstract translation: 根据一个实施例的用于通过旋转来清洁衬底的清洁装置包括：清洁构件，其构造成清洁衬底; 以及沿着所述清洁部件的周缘设置的套筒，所述套筒的下部被分成多个夹持爪，每个夹持爪保持所述清洁部件的侧面的一部分，其中， 多个夹持爪，多个突出部设置成大致平行于清扫部件的旋转方向，多个突起的端部构成为与清扫部件的侧面接触。

公开(公告)号：US20150034121A1

公开(公告)日：2015-02-05

申请号：US14321796

申请日：2014-07-01

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67

CPC classification number: H01L21/67046 ,  H01L21/67051

Abstract: A substrate cleaning apparatus capable of quickly removing cleaning liquid that has been used in cleaning of a substrate with a roll cleaning tool from the substrate. The substrate cleaning apparatus includes a substrate holder configured to hold and rotate a substrate; a cleaning-liquid supply nozzle configured to supply cleaning liquid onto a first region of the substrate; a roll cleaning tool configured to be placed in sliding contact with the substrate in the presence of the cleaning liquid to thereby clean the substrate; and a fluid supply nozzle configured to supply fluid, which is constituted by pure water or chemical liquid, onto a second region of the substrate. The second region is located at an opposite side of the first region with respect to the roll cleaning tool, and a supply direction of the fluid is a direction from a central side toward a peripheral side of the substrate.

Abstract translation: 一种基材清洗装置，其能够快速地从基板上清除用辊清洗工具清洗基板的清洗液。 基板清洁装置包括：基板保持器，其构造成保持和旋转基板; 清洁液供给喷嘴，其构造成将清洗液供给到所述基板的第一区域; 辊清洁工具，其构造成在所述清洁液的存在下与所述基板滑动接触，从而清洁所述基板; 以及流体供给喷嘴，其构造成将由纯水或化学液体构成的流体供给到基板的第二区域。 第二区域相对于辊清洁工具位于第一区域的相对侧，并且流体的供给方向是从基板的中心侧朝向周边侧的方向。

公开(公告)号：US20140253136A1

公开(公告)日：2014-09-11

申请号：US14197101

申请日：2014-03-04

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: G01N27/60

CPC classification number: G01R29/12 ,  G01R31/2831 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus for measuring a surface potential of an object on an underlying structure is disclosed. A relatively-moving mechanism moves a probe and a second support member relative to each other until the probe faces a reference structure on the second support member, an electric potential measuring device measures the surface potential of the reference structure through the probe, the controller calibrates the electric potential measuring device such that a measured value of the surface potential of the reference structure becomes 0, the relatively-moving mechanism moves the probe and a first support member relative to each other until the probe faces the object on the first support member after the calibration, and the electric potential measuring device measures the surface potential of the object through the probe.

Abstract translation: 公开了一种用于测量底层结构上的物体的表面电位的装置。 相对移动的机构相对于彼此移动探针和第二支撑构件直到探针面向第二支撑构件上的参考结构，电位测量装置通过探针测量参考结构的表面电位，控制器校准 所述电位测量装置使得所述参考结构的表面电位的测量值为0，所述相对移动的机构相对于彼此移动所述探针和第一支撑构件，直到所述探针在所述第一支撑构件上面对所述物体之后，经过所述第一支撑构件上的物体之后， 校准和电位测量装置通过探头测量物体的表面电位。

公开(公告)号：US20140182634A1

公开(公告)日：2014-07-03

申请号：US14139685

申请日：2013-12-23

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B08B3/02

Abstract: A substrate cleaning apparatus cleans a surface of a substrate in a non-contact state. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, downwardly toward the front surface of the substrate held by the substrate holding mechanism, and a moving mechanism configured to move the two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by the substrate holding mechanism. The two-fluid nozzle is inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from the two-fluid nozzle and a vertical line becomes a certain inclined angle, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of the two-fluid nozzle.

Abstract translation: 基板清洁装置以非接触状态清洁基板的表面。 基板清洁装置包括：基板保持机构，其构造成保持和旋转基板;双流体喷嘴，被配置为向包括气体和液体的两个流体喷射流向下喷射到由基板保持机构保持的基板的前表面 基板保持机构，以及移动机构，其构造成使双流体喷嘴从由基板保持机构保持的基板的中心部朝向径向外侧的一个方向移动。 双流体喷嘴倾斜使得从双流体喷嘴喷射的双流体喷射流的喷射中心线与垂直线之间的角度变为一定的倾斜角，并且双液体喷射流与 在两流体喷嘴的移动方向上的前方位置处的基板的前表面。

公开(公告)号：US20140158159A1

公开(公告)日：2014-06-12

申请号：US14098439

申请日：2013-12-05

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/67046 ,  H01L21/67051

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate by keeping a roll cleaning member and the surface of the substrate in contact with each other in the presence of a cleaning liquid. The substrate cleaning apparatus includes a first chemical liquid supply nozzle comprising a nozzle configured to supply a chemical liquid toward the substrate so that the chemical liquid is brought into contact with the surface of the substrate in a first contact area extending in an elongated shape, and a second chemical liquid supply nozzle comprising a nozzle configured to supply a chemical liquid toward the substrate so that the chemical liquid is brought into contact with the surface of the substrate in a second contact area spreading in an elliptical shape.

Abstract translation: 基板清洗装置通过在清洁液的存在下保持辊清洁部件和基板的表面彼此接触来进行基板的表面的擦洗清洗。 基板清洗装置包括：第一药液供给喷嘴，其包括喷嘴，该喷嘴构造成朝向基板供给化学液体，使得化学液体在延伸成长形状的第一接触区域中与基板的表面接触;以及 第二药液供给喷嘴，其包括喷嘴，所述喷嘴构造成朝向所述基板供给化学液体，使得所述化学液体在扩展为椭圆形状的第二接触区域中与所述基板的表面接触。

公开(公告)号：US20130219740A1

公开(公告)日：2013-08-29

申请号：US13860787

申请日：2013-04-11

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/67

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角θ / 2相对于从90°减去半接触角θ/ 2确定的角度，半接触角θ/ 2是接触角θ的一半。