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公开(公告)号：US10304706B2
公开(公告)日：2019-05-28
申请号：US16002640
申请日：2018-06-07
发明人： Allan Pourchet , Pooya Saketi
摘要： An LED die containing a gallium semiconductor layer is placed on a target substrate using a pick-up tool (PUT) attached to the LED die using metallic gallium. As a result of a laser lift-of (LLO) process to separate the gallium semiconductor layer from a substrate layer on which the gallium semiconductor layer is formed, a layer of gallium metal is formed on a surface of the LED die. The gallium layer is melted to form liquid gallium. A head of the PUT is contacted with the liquid gallium, whereupon the LED die is cooled such that the liquid gallium solidifies, attaching the LED die to the PUT. The PUT picks up and places the LED die at a desired location on a target substrate. The LED die can be heated to melt the gallium layer, allowing the PUT to be detached.
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公开(公告)号：US20190139794A1
公开(公告)日：2019-05-09
申请号：US15807518
申请日：2017-11-08
IPC分类号： H01L21/67 , H01L21/683 , H01L21/68
摘要： To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using suction force, a subset of pick-up heads of an array of pick-up heads is selectively operated to attach a subset of the semiconductor devices to the subset of pick-up heads by a suction force. The subset of semiconductor devices attached with the pick-up heads are placed over or on a target substrate, and releasing onto the target substrate. The semiconductor devices may be detached from the pick-up heads by releasing or reversing the suction force. The suction force may be created by controllable membranes in the pick-up heads, such as piezoelectric benders.
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公开(公告)号：US11349053B1
公开(公告)日：2022-05-31
申请号：US16742796
申请日：2020-01-14
发明人： Zheng Sung Chio , Daniel Brodoceanu , Ali Sengül , Oscar Torrents Abad , Jeb Wu , Pooya Saketi , Chao Kai Tung , Tennyson Nguty , Allan Pourchet
IPC分类号： H01L33/00 , H01L23/48 , H01L31/0203 , H01L21/00 , H01L21/46 , H01L33/62 , H01L25/075 , C09J9/02 , C09J5/00 , H01L33/52
摘要： Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.
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公开(公告)号：US11328942B1
公开(公告)日：2022-05-10
申请号：US16566808
申请日：2019-09-10
发明人： Thomas John Farrell Wallin , Yigit Mengue , Pooya Saketi , Ali Sengül , Nicholas Roy Corson , Katherine Healy , Remi Alain Delille , Oscar Torrents Abad , Daniel Brodoceanu , Robert Manson , Leif-Erik Sharif Simonsen
IPC分类号： H01L21/67 , H01L25/075
摘要： A pick-up head assembly comprises a body of a liquid crystalline elastomer (LCE) that undergoes a reversible expansion when exposed to a first frequency of light and contracts when exposed to a second frequency of light. Selective portions of the LCE in the pick-up head assembly are irradiated with the first frequency to cause an expansion in the selective portions. The adhesive forces of the expanded portions of the LCE are used to pick-up semiconductor devices from a first substrate. The semiconductor devices are placed on a second substrate by exposing the expanded portions of the LCE to the second frequency of light, causing the expanded portions to contract.
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公开(公告)号：US11276672B1
公开(公告)日：2022-03-15
申请号：US16596527
申请日：2019-10-08
发明人： Jeb Wu , Oscar Torrents Abad , Daniel Brodoceanu , Pooya Saketi , Zheng Sung Chio , Ali Sengül
IPC分类号： H01L25/075 , H01L33/62 , H01L21/66
摘要： A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.
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公开(公告)号：US11219151B1
公开(公告)日：2022-01-04
申请号：US16370771
申请日：2019-03-29
发明人： Pooya Saketi
摘要： To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using touch down sensors, a pick-up head including touch down sensors and the semiconductor devices on the carrier substrate are moved relative to each other to contact the carrier substrate with the touch down sensors. Signals from each touch down sensor indicating a degree of deformation of each touch down sensor caused by the contact with the carrier substrate are used to determine an orientation of the pick-up head by processing the signals, and adjust the orientation of the pick-up head based on the determined orientation to attach the semiconductor devices onto the pick-up head. In some embodiments, the touch down sensors are piezoelectric benders.
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公开(公告)号：US11101159B1
公开(公告)日：2021-08-24
申请号：US16732704
申请日：2020-01-02
IPC分类号： H01L21/683 , H01L21/67 , H01L25/075 , H01L33/24 , H01L33/44 , H01L33/40 , H01L33/62 , H01L33/06
摘要： Embodiments relate to using photocurable polymers to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. A LED assembly system places LEDs on a temporary substrate after fabrication and applies a a photocurable polymer onto the top surfaces of the LEDs. A transparent pickup head aligns with a subset of the LEDs. The pickup head is positioned on the top surfaces of the subset of LEDs such that the layer of the photocurable polymer is in between the pickup head and the top surface of the subset of the LEDs. Light is directed through the pickup head to cure the photocurable polymer, adhering the subset of LEDs to the pickup head. The subset of LEDs is removed away from the temporary substrate, due to relative movement between the temporary substrate and the pickup head.
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38.发明申请公开(公告)号：US20210210667A1
公开(公告)日：2021-07-08
申请号：US17184071
申请日：2021-02-24
发明人： Daniel Brodoceanu , Thiago Martins Amaral , Pooya Saketi , Patrick Joseph Hughes , Alexander Udo May , Karsten Moh , Oscar Torrents Abad
摘要： Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.
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公开(公告)号：US10989735B2
公开(公告)日：2021-04-27
申请号：US16781490
申请日：2020-02-04
摘要： Embodiments relate to the design of an electronic device capable of preventing a lateral motion between a first body and a second body. The device comprises a first body comprising one or more atomic force microscopy (AFM) tips protruding from a first surface of the first body. The device further comprises a second body comprising one or more electrical contacts on a second surface of the second body. The second surface faces the first surface. The one or more electrical contacts pierced by the AFM tips of the first surface to prevent a lateral motion between the first body and the second body.
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40.发明授权公开(公告)号：US10763135B2
公开(公告)日：2020-09-01
申请号：US15884243
申请日：2018-01-30
发明人： Pooya Saketi , Karsten Moh , Tilman Zehender
IPC分类号： H01L33/44 , H01L21/67 , H01L33/06 , H01L33/24 , H01L33/40 , H01L33/00 , H01L25/075 , H01J37/32 , H01L33/10 , H01L21/784 , H01L27/15 , H01L21/683 , B65G47/90 , H01S5/183
摘要： Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.
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