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    Polyethylene composition containing di-alpha-cumyl peroxide, silica, and a stabilizer, and process of making same
    32.
    发明授权
    Polyethylene composition containing di-alpha-cumyl peroxide, silica, and a stabilizer, and process of making same 失效
    含有二-α-枯基过氧化物，二氧化硅和稳定剂的聚乙烯组合物及其制备方法

    公开(公告)号：US2928801A

    公开(公告)日：1960-03-15

    申请号：US55462755

    申请日：1955-12-22

    Applicant: GEN ELECTRIC

    Inventor： SAFFORD MOYER M ,  CORRIN MYRON L

    IPC: C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/31

    CPC classification number: C08K5/14 ,  C08K3/11 ,  C08K3/36 ,  C08K5/31 ,  Y10S260/19 ,  C08L23/06

    Abstract: A curable composition comprises (1) polyethylene, (2) silica, (3) from 0,01 to 5% by weight of the total composition of an organic or inorganic base, and (4) di-a -cumyl peroxides. The preferred basic materials are guanidines, e.g. diphenyl or di-tolyl guanidines, but other organic and inorganic bases, e.g. basic lead carbonate, silicate and silicate-sulphate compound, lead, magnesium and zinc oxides, lead maleate, dibasic lead phosphate and phthalate and the lead salt of t.-amyl phenol are mentioned. Fumed silica and high or low pressure polyethylene may be used and the composition is prepared by milling and is press-cured to give products with improved tensile strength and elongation and electrical properties which may be used for films, tapes, laminates or containers and for electrical applications. Specification 653,323 is referred to.

    Polyethylene composition containing organopolysiloxane resin
    33.
    发明授权
    Polyethylene composition containing organopolysiloxane resin 失效
    含有机聚硅氧烷树脂的聚乙烯组合物

    公开(公告)号：US2888419A

    公开(公告)日：1959-05-26

    申请号：US55083455

    申请日：1955-12-05

    Applicant: GEN ELECTRIC

    Inventor： SAFFORD MOYER M

    IPC: C08K3/00 ,  C08L23/06

    CPC classification number: C08L23/06 ,  C08K3/013 ,  C08L83/04 ,  C08L83/00

    Abstract: A composition comprising polyethylene, a filler and 1 to 10 per cent by weight of a curable organopolysiloxane, based on the filled polyethylene, has improved extrusion properties of flow, smooth surface and less nerve, and improved ageing characteristics. Polyethylene of high or low pressure type may be used and the curable organopolysiloxane may be obtained by condensing a liquid organopolysiloxane with 1.9 to 2.1 silicon bonded organic groups per silicon atom, e.g. of formula R2SiO where R is a methyl or phenyl radical, such as (CH3)2SiO or a copolymer of dimethylsiloxane and a minor amount of C6H5(CH3)SiO and (C6H5)2SiO, with condensing agents such as ferric chloride hexahydrate, phenyl phosphoryl chlorides, quaternary phosphonium hydroxides and alkoxides, solid quaternary ammonium hydroxides and potassium and caesium hydroxides and in an example octamethylcyclotetrasiloxane is heated for six hours with potassium hydroxide to form a gum. Fillers may be finely divided silicas, e.g. xerogels, aerogels, fumed and hydrophobic silicas, calcium silicates, aluminas and carbon blacks. Cured compositions may be obtained either by including 0.1 to 20 per cent of a peroxide, such as di-a -cumyl peroxide in the composition and heating at 150 DEG to 200 DEG C.; by extruding the composition into a solution containing a peroxide and heating whereby a bulk extrusion is case hardened or thin films or filaments cured throughout; or by high energy radiation. The compositions may be extruded on wire as insulation, or with carbon blacks used as heat stable heating pads or tapes. Specifications 471,590, 594,481, [both in Group IV], 618,453, 640,067 and 735,807 are referred to.

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