公开(公告)号：US20150352651A1

公开(公告)日：2015-12-10

申请号：US14831581

申请日：2015-08-20

Applicant: GENERAL ELECTRIC COMPANY

Inventor： David Edward SCHICK ,  Srikanth Chandrudu KOTTILINGAM ,  Benjamin Paul LACY ,  John Wesley HARRIS, JR. ,  Brian Lee TOLLISON

IPC: B23K1/00 ,  B23K31/02 ,  B23K1/20

CPC classification number: B23K1/0018 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K31/02 ,  B23K2101/001

Abstract: A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate.

公开(公告)号：US20150068629A1

公开(公告)日：2015-03-12

申请号：US14020997

申请日：2013-09-09

Applicant: General Electric Company

Inventor： Srikanth Chandrudu KOTTILINGAM ,  Victor John MORGAN ,  Benjamin Paul LACY ,  John Wesley HARRIS, Jr. ,  David Edward SCHICK

IPC: F15D1/00 ,  B23K26/34 ,  F25B9/04 ,  B29C67/00

CPC classification number: F15D1/0015 ,  B22F3/1055 ,  B22F5/009 ,  B29C64/153 ,  B33Y10/00 ,  B33Y80/00 ,  F01D5/18 ,  F01D11/24 ,  F05D2240/127 ,  F05D2240/81 ,  F05D2260/204 ,  F05D2260/221 ,  F05D2260/2212 ,  F25B9/04 ,  Y02P10/295 ,  Y10T137/2087

Abstract: A three-dimensional printing process, a swirling device, and a thermal management process are disclosed. The three-dimensional printing process includes distributing a material to a selected region, selectively laser melting the material, and forming a swirling device from the material. The swirling device is printed by selective laser melting. The thermal management process includes providing an article having a swirling device printed by selective laser melting, and cooling a portion of the article by transporting air through the swirling device.

Abstract translation: 公开了三维打印处理，旋转装置和热管理过程。 三维印刷工艺包括将材料分配到所选择的区域，选择性地激光熔化材料，以及从材料形成旋转装置。 旋转装置通过选择性激光熔化印刷。 热管理方法包括提供具有通过选择性激光熔化印刷的旋转装置的制品，以及通过将空气输送通过旋转装置来冷却制品的一部分。

公开(公告)号：US20140369741A1

公开(公告)日：2014-12-18

申请号：US14477389

申请日：2014-09-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Yan CUI ,  Srikanth Chandrudu KOTTILINGAM ,  Brian Lee TOLLISON ,  Dechao LIN ,  David Edward SCHICK

IPC: B23K1/00 ,  B23K20/12

CPC classification number: B23K1/0018 ,  B23K20/12 ,  B23K20/1205 ,  B23K20/129 ,  B23K28/02 ,  B23K2101/001 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  Y10T403/478

Abstract: A joining process and a joined article are disclosed. The joining process includes positioning an article having a base material, and friction joining a pre-sintered preform to the base material. The pre-sintered preform forms a feature on the article. The joined article includes a feature joined to a base material by friction joining of a pre-sintered preform.

Abstract translation: 公开了接合工艺和接合制品。 接合过程包括定位具有基材的制品，以及将预烧结的预成型件摩擦连接到基材。 预烧结的预制件在制品上形成一个特征。 接合制品包括通过预烧结预制件的摩擦接合而连接到基材的特征。

公开(公告)号：US20140220376A1

公开(公告)日：2014-08-07

申请号：US13758458

申请日：2013-02-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： David Edward SCHICK ,  Dean William MORRISON ,  Yan CUI ,  Bill Damon JOHNSTON ,  Srikanth Chandrudu KOTTILINGAM

IPC: B23K31/00 ,  B32B15/01

CPC classification number: B32B15/01 ,  B23K1/0018 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0238 ,  B23K2101/001 ,  B23P6/002 ,  F01D5/005 ,  F05D2230/237 ,  Y10T428/12493

Abstract: A brazing process, a braze arrangement, and a brazed article are disclosed. The brazing process includes brazing an article with a braze arrangement. The braze arrangement includes a first braze material and a second braze material, the first braze material having a first melting point and the second braze material having a second melting point, the first melting point differing from the second melting point. The brazed article includes a treatment region, a first brazed material positioned within the treatment region, and a second brazed material positioned distal from the article in comparison to the first brazed material. The first brazed material is formed by the first braze material and the second brazed material is formed by the second braze material.

Abstract translation: 公开了钎焊工艺，钎焊布置和钎焊制品。 钎焊工艺包括钎焊具有钎焊布置的物品。 所述钎焊布置包括第一钎焊材料和第二钎焊材料，所述第一钎焊材料具有第一熔点，所述第二钎焊材料具有第二熔点，所述第一熔点与所述第二熔点不同。 钎焊制品包括处理区域，位于处理区域内的第一钎焊材料和与第一钎焊材料相比位于远离制品的第二钎焊材料。 第一钎焊材料由第一钎焊材料形成，第二钎焊材料由第二钎焊材料形成。

公开(公告)号：US20140212208A1

公开(公告)日：2014-07-31

申请号：US13755930

申请日：2013-01-31

Applicant: GENERAL ELECTRIC COMPANY

Inventor： David Edward SCHICK ,  Srikanth Chandrudu KOTTILINGAM ,  Johnie Franklin McCONNAUGHHAY ,  Brian Lee TOLLISON ,  Yan CUI

IPC: B23K1/20

CPC classification number: B23K1/20 ,  B23K1/0012 ,  B23K1/0018 ,  B23K1/008 ,  B23K11/11 ,  B23K37/04 ,  B23K2103/02 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/26 ,  F05D2230/237 ,  F23R3/286 ,  F23R2900/00018 ,  F28F9/185 ,  F28F2265/26 ,  F28F2275/045 ,  Y10T403/479

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract translation: 公开了钎焊工艺和板组件。 钎焊工艺包括将钎焊箔定位在第一工件上，然后将钎焊箔固定到第一工件上以形成可钎焊部件，然后将第二工件靠近可钎焊部件定位，然后将第二工件钎焊到可钎焊部件。 另外或替代地，钎焊工艺包括将钎焊箔定位在管上，然后将钎焊箔固定到管上以形成可钎焊管，然后将板组件的板定位在可钎焊管附近，然后将板钎焊到 可钎管。 板组件包括板和通过固定到管的钎焊箔钎焊到板的管。