公开(公告)号：US20190134903A1

公开(公告)日：2019-05-09

申请号：US16094246

申请日：2016-05-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Alejandro Manuel De Pena ,  Sergio Puigardeu Aramendia ,  Jordi Sanroma Garrit

IPC: B29C64/295 ,  B29C35/02 ,  B29C35/08 ,  B29C64/165 ,  B29C64/393

Abstract: In one example, a system for heating lamp calibration can include a plurality of heating lamps over a print bed to heat the print bed over a period of time, a thermal imaging sensor to capture images of the print bed over the period of time, and a computing device coupled to the thermal imaging sensor to determine a surface flux delivered to each of a plurality of zones of the print bed over the period of time and calibrate a heating lamp of the plurality of heating lamps based on a corresponding contribution to the surface flux.

公开(公告)号：US20190009463A1

公开(公告)日：2019-01-10

申请号：US16065464

申请日：2016-03-30

Applicant: Xavier VILAJOSANA ,  Sergio PUIGARDEU ,  Alejandro Manuel PENA ,  David RAMIREZ ,  Pol FORNOS ,  HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Xavier Vilajosana ,  Sergio Puigardeu ,  Alejandro Manuel De Pena ,  David Ramirez ,  Pol Fornos

IPC: B29C64/153 ,  B29C64/165 ,  B29C64/386

Abstract: There is provided a method and apparatus for controlling heat to a build surface. A thermal profile over the build surface is determined. The determined thermal profile over the build surface is compared with an expected thermal profile over the build surface. Based on the comparison, the determined thermal profile over the build surface or the expected thermal profile over the build surface is selected to control an amount of heat provided by a heating module to the build surface.

公开(公告)号：US20180264735A1

公开(公告)日：2018-09-20

申请号：US15542285

申请日：2015-04-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Xavier Vilajosana ,  Sebastia Cortes ,  Alejandro Manuel De Pena

IPC: B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y10/00 ,  B29C64/188 ,  B29C64/165 ,  B28B1/00 ,  B28B17/00 ,  B22F3/105 ,  C03B19/01

CPC classification number: B29C64/393 ,  B22F3/1055 ,  B28B1/001 ,  B28B17/0081 ,  B29C64/153 ,  B29C64/165 ,  B29C64/188 ,  B29C64/205 ,  B29C64/35 ,  B29C64/386 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  C03B19/01

Abstract: A sensor may be to detect a height profile of build material for generating the three-dimensional object. A defect of the build material may be determined to exist based on the height profile of the build material. The defect may be corrected or the defect may be prevented from impacting a component of the system. A portion of a layer of the build material delivered by a build material distributor may be selectively solidified.

公开(公告)号：US20180229301A1

公开(公告)日：2018-08-16

申请号：US15509084

申请日：2014-10-02

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Alejandro Manuel De Pena ,  Fernando Juan ,  Pau Martin

IPC: B22F3/105 ,  B22F3/00 ,  B33Y40/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B22F3/1055 ,  B22F3/003 ,  B22F2003/1057 ,  B29C64/153 ,  B29C64/165 ,  B29C64/20 ,  B29C64/255 ,  B29C64/321 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

Abstract: An integrated build and material supply system (12) for an additive manufacturing apparatus comprises a building compartment (24) adapted to accommodate an object (50) to be formed by means of additive manufacturing and a storage compartment (22) adapted to store a build material for forming said object. A volume of said building compartment and a volume of said storage compartment are variable in size, and said system is adapted to re-allocate at least a portion of a volume previously allocated to said storage compartment to said building compartment.

公开(公告)号：US20180017956A1

公开(公告)日：2018-01-18

申请号：US15545693

申请日：2015-04-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Juan Manuel Garcia Reyero Vinas ,  Sergio Puigardeu Aramendia ,  Alejandro Manuel De Pena ,  David Ramirez Muela

IPC: G05B19/4099

CPC classification number: G05B19/4099 ,  B29C64/386 ,  B33Y50/00 ,  G05B2219/35134 ,  G05B2219/49007 ,  G05B2219/49023 ,  Y02P90/265

Abstract: A method of fabricating a three dimensional object in an additive layer manufacturing process, e.g. 3D printing, wherein a three dimensional design of the three dimensional object is modelled as a plurality of three dimensional pixels or vortexes. For every pixel or vortex, at least one parameter is calculated and is used to select a setting for use when fabricating the three dimensional object. The parameter may be a speed or rate at which heat will diffuse away from the pixel or vortex, or a weighted density surrounding the pixel or vortex. The method provides higher quality fabrication of the three dimensional object.

公开(公告)号：US20170341307A1

公开(公告)日：2017-11-30

申请号：US15535833

申请日：2015-01-30

Applicant: Xavier Vilajosana ,  Alejandro Manuel De Pena ,  Sebastia Cortes i Herms ,  HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Xavier Vilajosana ,  Alejandro Manuel De Pena ,  Sebastia Cortes i Herms

IPC: B29C64/393 ,  B29C35/02 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y30/00 ,  B29C64/291 ,  B29C64/165 ,  B29K101/12

CPC classification number: B29C64/393 ,  B29C35/0288 ,  B29C64/165 ,  B29C64/291 ,  B29C64/386 ,  B29K2101/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/00 ,  B33Y50/02

Abstract: A method of heating a surface while fabricating a 3-D object is disclosed wherein a first temperature feedback signal from a first location on the surface is used to control the energy radiated by an energy source during a first stage of the fabrication process. A second temperature feedback signal from a second location on the surface is used to control the energy radiated by an energy source during a second stage of the fabrication process.

公开(公告)号：US20170326799A1

公开(公告)日：2017-11-16

申请号：US15520826

申请日：2015-01-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hou T. Ng ,  Alejandro Manuel De Pena

IPC: B29C64/291 ,  B29C64/188 ,  B33Y50/02 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y30/00 ,  B29C64/393 ,  B29C64/153

CPC classification number: B29C64/291 ,  B29C64/153 ,  B29C64/165 ,  B29C64/188 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00

Abstract: In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to inhibit build material in an overlying layer of build material from fusing with a first slice formed in an underlying layer of build material.

公开(公告)号：US20170043535A1

公开(公告)日：2017-02-16

申请号：US15306480

申请日：2014-09-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hou T. Ng ,  Alejandro Manuel De Pena

IPC: B29C67/00 ,  B33Y50/02 ,  B33Y30/00 ,  B33Y10/00

Abstract: In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to inhibit build material from coalescing in an area of a first layer of build material where a second slice of an object will overhang a first slice of the object formed in the first layer of build material.

Abstract translation: 在一个示例中，其中具有指令的非暂时处理器可读介质在执行时导致添加剂制造机器禁止构建材料在构建材料的第一层的区域中聚结，其中对象的第二切片将悬挂在第一切片 在第一层建筑材料中形成的物体。

公开(公告)号：US20160325496A1

公开(公告)日：2016-11-10

申请号：US15110947

申请日：2014-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Alejandro Manuel De Pena ,  Esteve Comas ,  Sergio Puigardeu

IPC: B29C67/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y10/00

CPC classification number: B33Y30/00 ,  B29C64/00 ,  B29C64/165 ,  B29C64/386 ,  B29C64/40 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y50/02

Abstract: A three-dimensional object may be generated. A temperature sensor may be to measure a temperature distribution of build material delivered to a support member. A processor may be to mask a masking region of the measured temperature distribution or correct the measured temperature distribution, based on emissivity data of the build material. A heater may be to heat the build material to a target temperature distribution based on the corrected or masked measured temperature distribution. An energy source may be to apply energy to the build material to cause a portion of the build material to coalesce.

Abstract translation: 可以生成三维物体。 温度传感器可以是测量传送到支撑构件的建筑材料的温度分布。 处理器可以基于建立材料的发射率数据来掩蔽测量的温度分布的掩蔽区域或校正测量的温度分布。 加热器可以基于校正或掩蔽的测量温度分布将构建材料加热到目标温度分布。 能量源可以是将能量施加到建筑材料上以使建筑材料的一部分聚结。

公开(公告)号：US11673314B2

公开(公告)日：2023-06-13

申请号：US16253007

申请日：2019-01-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Esteve Comas ,  Alejandro Manuel De Pena ,  Howard S. Tom ,  Hou T. Ng

IPC: B29C64/00 ,  B29C64/165 ,  B29C64/386 ,  B29C35/16 ,  B29C35/08 ,  B29C64/40 ,  B33Y30/00 ,  B33Y10/00

CPC classification number: B29C64/00 ,  B29C35/0805 ,  B29C35/16 ,  B29C64/165 ,  B29C64/386 ,  B29C64/40 ,  B29C2035/0822 ,  B29C2035/0838 ,  B29C2035/1616 ,  B33Y10/00 ,  B33Y30/00

Abstract: In one example, an apparatus for generating a three-dimensional object includes an energy source to apply energy to a layer of build material to cause a first portion of the layer to coalesce and solidify, an agent distributor to selectively deliver a cooling agent onto a second portion of the layer, and a controller to control the energy source to apply energy to the layer to cause the first portion to coalesce and solidify in a first pattern and to control the agent distributor to selectively deliver the cooling agent onto the second portion of the layer in a second pattern independent of the first pattern.