公开(公告)号：US11897193B2

公开(公告)日：2024-02-13

申请号：US16488956

申请日：2017-10-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Thomas Anthony ,  Lihua Zhao

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y70/10 ,  B22F3/10 ,  B22F1/10 ,  B22F10/14 ,  B22F10/16 ,  B22F12/67 ,  B22F12/10 ,  B22F12/41 ,  B22F12/42 ,  B22F12/50 ,  B22F12/63 ,  B22F12/90 ,  B22F10/36

CPC classification number: B29C64/165 ,  B22F1/10 ,  B22F3/1021 ,  B22F10/14 ,  B22F10/16 ,  B22F12/67 ,  B33Y10/00 ,  B33Y70/10 ,  B22F10/36 ,  B22F12/10 ,  B22F12/41 ,  B22F12/42 ,  B22F12/50 ,  B22F12/63 ,  B22F12/90

Abstract: An example of a build material slurry includes metallic particles having an individual particle size up to 20 μm, from about 0.01 wt % up to 1 wt % of a water-soluble binder, based on a weight of the metallic particles, and water. The build material slurry is a ready-to-use three-dimensional (3D) printing build material.

公开(公告)号：US11845128B2

公开(公告)日：2023-12-19

申请号：US16605423

申请日：2018-06-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： John Samuel Dilip Jangam ,  Thomas Anthony ,  Krzysztof Nauka ,  Kristopher J. Erickson

IPC: B33Y70/10 ,  B22F9/04 ,  B22F1/05 ,  B22F1/142 ,  B33Y70/00 ,  B22F10/14 ,  B33Y10/00 ,  B29C64/165

CPC classification number: B22F10/14 ,  B22F1/05 ,  B22F1/142 ,  B22F9/04 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y70/10 ,  B22F2009/043 ,  B22F2304/10 ,  B29C64/165 ,  B22F2999/00 ,  B22F1/142 ,  B22F2207/11 ,  B22F2009/043 ,  B22F1/05 ,  B22F2998/10 ,  B22F10/14 ,  B22F9/18 ,  B22F3/10

Abstract: A powder bed material can include from 80 wt % to 100 wt % metal particles having a D50 particle size distribution value from 4 μm to 150 μm. From 10 wt % to 100 wt % of the metal particles can be surface-activated metal particles having in intact inner volume and an outer volume with structural defects. The structural defects can exhibit an average surface grain density of 50,000 to 5,000,000 per mm2.

公开(公告)号：US11311942B2

公开(公告)日：2022-04-26

申请号：US15764871

申请日：2016-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J Erickson ,  Krzysztof Nauka ,  Thomas Anthony ,  Lihua Zhao ,  Howard S Tom

IPC: B22F10/10 ,  B33Y10/00 ,  C23C18/30 ,  C23C24/08 ,  C23C24/10 ,  B82B1/00 ,  B82B3/00 ,  C23C18/08

Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

公开(公告)号：US11167374B2

公开(公告)日：2021-11-09

申请号：US16098075

申请日：2016-07-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Thomas Anthony ,  Kristopher J. Erickson ,  Krzysztof Nauka

IPC: B23K26/342 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y30/00 ,  C22C1/04 ,  B22F12/00 ,  B33Y50/02 ,  B23K26/0622 ,  B23K26/352 ,  B23K26/00 ,  B23K26/06 ,  B23K26/08 ,  B23K26/14 ,  B23K26/18 ,  B22F10/10

Abstract: In a three-dimensional printing method example, a metallic build material is applied. A positive masking agent is selectively applied on at least a portion of the metallic build material. The positive masking agent includes a radiation absorption amplifier that is compatible with the metallic build material. The metallic build material is exposed to radiation from a spatially broad, high energy light source to melt the portion of the metallic build material in contact with the positive masking agent to form a layer. The radiation absorption amplifier i) has an absorbance for the radiation that is higher than an absorbance for the radiation of the metallic build material, or ii) modifies a surface topography of the at least the portion of the metallic build material to reduce specular reflection of the radiation off of the at least the portion of the metallic build material, or both i) and ii).

公开(公告)号：US20210197268A1

公开(公告)日：2021-07-01

申请号：US16606299

申请日：2018-06-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Krzysztof Nauka ,  Thomas Anthony

IPC: B22F10/10 ,  B22F10/20 ,  B22F10/40 ,  B29C64/40 ,  B22F3/10 ,  B22F12/00

Abstract: A system for forming a part with a support including: a liquid reservoir to hold a support material to form the support; an ejector to receive support material from the liquid reservoir and deposit the support material into a build area; an actuator to provide relative motion between the ejector and the build area; and a spreader to form a layer of metal particles in the build area, wherein the support provides support for the part during sintering.

公开(公告)号：US20200246865A1

公开(公告)日：2020-08-06

申请号：US16488956

申请日：2017-10-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Thomas Anthony ,  Lihua Zhao

IPC: B22F1/00 ,  B33Y10/00 ,  B33Y70/10 ,  B22F3/00 ,  B22F3/10

Abstract: An example of a build material slurry includes metallic particles having an individual particle size up to 20 μm, from about 0.01 wt % up to 1 wt % of a water-soluble binder, based on a weight of the metallic particles, and water. The build material slurry is a ready-to-use three-dimensional (3D) printing build material.

公开(公告)号：US20190160533A1

公开(公告)日：2019-05-30

申请号：US16264676

申请日：2019-02-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Krzysztof Nauka ,  Thomas Anthony ,  Lihua Zhao ,  Howard S. Tom

IPC: B22F3/00 ,  B82B1/00 ,  C23C24/10 ,  B33Y10/00 ,  C23C18/30 ,  B82B3/00 ,  C23C24/08

Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

公开(公告)号：US20190160532A1

公开(公告)日：2019-05-30

申请号：US16264658

申请日：2019-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kristopher J. Erickson ,  Krzysztof Nauka ,  Thomas Anthony ,  Lihua Zhao ,  Howard S. Tom

IPC: B22F3/00 ,  B82B1/00 ,  C23C24/10 ,  B33Y10/00 ,  C23C18/30 ,  B82B3/00 ,  C23C24/08

Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

公开(公告)号：US10254676B2

公开(公告)日：2019-04-09

申请号：US15243311

申请日：2016-08-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Seongsik Chang ,  Thomas Anthony ,  Michael H. Lee ,  Omer Gila ,  Anthony William McLennan

IPC: G03G15/02

Abstract: A charge roller includes a body having a metal external surface and an inorganic outer resistive coating.

公开(公告)号：US20180321618A1

公开(公告)日：2018-11-08

申请号：US15773962

申请日：2016-01-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Guang Jin Li ,  Stanley J. Kozmiski ,  Seongsik Chang ,  Daniel Tanchangco ,  David Sabo ,  Thomas Anthony ,  Omer Gila

IPC: G03G15/10 ,  G03G15/08 ,  G03G15/02 ,  G03G13/10 ,  C08L75/04

CPC classification number: G03G15/10 ,  C08L75/04 ,  G03G13/10 ,  G03G15/0233 ,  G03G15/0818 ,  G03G2215/0861

Abstract: The present disclosure relates to a liquid electrophotographic ink developer unit. The unit comprises a developer roller, and a secondary roller that co-operates with the developer roller. The developer roller is formed of a material having a specific resistivity of less than 1×106 Ω·cm. The secondary roller is formed of a material having a specific resistivity of 1×104 to 1×109 Ω·cm.