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31.发明授权公开(公告)号：US11867426B2
公开(公告)日：2024-01-09
申请号：US17887192
申请日：2022-08-12
Applicant: Inertech IP LLC
Inventor： John Costakis , Ming Zhang , Earl Keisling , Ken Nguyen
IPC: F24F5/00 , F24F11/83 , F25B25/00 , F25B23/00 , F24F11/84 , F24F11/85 , F24F110/12 , F24F140/50 , F24F11/46 , F24F13/22 , F28C1/00
CPC classification number: F24F5/0007 , F24F5/001 , F24F5/0003 , F24F5/0035 , F24F11/83 , F24F11/84 , F24F11/85 , F25B23/006 , F25B25/00 , F25B25/005 , F24F11/46 , F24F2013/225 , F24F2110/12 , F24F2140/50 , F25B2339/041 , F25B2339/047 , F25B2700/197 , F25B2700/21163 , F28C2001/006 , Y02B30/54
Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.
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公开(公告)号：US20230363106A1
公开(公告)日：2023-11-09
申请号：US18118357
申请日：2023-03-07
Applicant: INERTECH IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
CPC classification number: H05K7/20218 , H05K5/02 , H05K7/20736 , H05K7/20781 , H05K7/20145 , H05K7/20609 , H05K7/20745 , H05K7/2079
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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公开(公告)号：US11602074B2
公开(公告)日：2023-03-07
申请号：US16653509
申请日：2019-10-15
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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34.发明授权公开(公告)号：US11306959B2
公开(公告)日：2022-04-19
申请号：US14534957
申请日：2014-11-06
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
Abstract: A cooling system is provided including a first evaporator coil in thermal communication with an air intake flow to a heat load, a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit, a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in the thermal communication with the air intake flow to the heat load, a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit, a water loop in thermal communication with the first fluid circuit and second fluid circuit, and a chiller loop in thermal communication with the water loop.
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Patent Agency Ranking
35.发明申请公开(公告)号：US20170268792A1
公开(公告)日：2017-09-21
申请号：US15398512
申请日：2017-01-04
Applicant: INERTECH IP LLC
Inventor： John Costakis , Ming Zhang , Earl Keisling , Ken Nguyen
CPC classification number: F24F5/0007 , F24F5/0003 , F24F5/001 , F24F5/0035 , F24F11/46 , F24F11/83 , F24F2013/225 , F24F2110/12 , F24F2140/50 , F25B23/006 , F25B25/00 , F25B25/005 , F25B2339/041 , F25B2339/047 , F25B2700/197 , F25B2700/21163 , F28C2001/006 , Y02B30/542
Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.
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公开(公告)号：USD744996S1
公开(公告)日：2015-12-08
申请号：US29449647
申请日：2013-03-15
Applicant: INERTECH IP LLC
Designer： Earl Keisling , John Costakis , Michael Welch
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公开(公告)号：US20150195958A1
公开(公告)日：2015-07-09
申请号：US14665866
申请日：2015-03-23
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20
CPC classification number: H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
Abstract translation: 用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。 第一热交换器联接到第一支撑构件，其构造成将第一热交换器与至少一个服务器的热传递关系定位。 第一热交换器不连接到至少一个服务器机架。 模块化服务器机架冷却结构还应用于包括至少第一机架和至少彼此相对设置的第二机架以形成热通道或冷通道的系统。 公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力要求而不需要额外空间的方法。
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38.发明申请COOLING SYSTEMS AND METHODS USING TWO CIRCUITS WITH WATER FLOW IN SERIES AND COUNTER FLOW ARRANGEMENT 审中-公开冷却系统和方法使用两个电路与水流在系列和逆流装置公开(公告)号：US20150192345A1
公开(公告)日：2015-07-09
申请号：US14534957
申请日：2014-11-06
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
CPC classification number: F25D17/02 , F25B1/00 , F25B1/005 , F25B25/005 , F25B2339/047
Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。
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公开(公告)号：US20150176865A1
公开(公告)日：2015-06-25
申请号：US14520322
申请日：2014-10-21
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
CPC classification number: F25B29/003 , F25B2339/047 , H05K7/20827
Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。
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