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公开(公告)号：US20170205119A1
公开(公告)日：2017-07-20
申请号：US15479588
申请日：2017-04-05
Applicant: Inertech IP LLC
Inventor： Ming Zhang , John Costakis
CPC classification number: F25B7/00 , F25B25/005 , F25B41/04 , F25B49/02 , F25B2500/18 , H05K7/20827
Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.
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公开(公告)号：US20170079165A1
公开(公告)日：2017-03-16
申请号：US15362487
申请日：2016-11-28
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20
CPC classification number: H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
Abstract translation: 用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。 第一热交换器联接到第一支撑构件，其构造成将第一热交换器与至少一个服务器的热传递关系定位。 第一热交换器不连接到至少一个服务器机架。 模块化服务器机架冷却结构还应用于包括至少第一机架和至少彼此相对设置的第二机架以形成热通道或冷通道的系统。 公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力要求而不需要额外空间的方法。
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公开(公告)号：US20250024648A1
公开(公告)日：2025-01-16
申请号：US18779868
申请日：2024-07-22
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
Abstract: A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.
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公开(公告)号：US20240268082A1
公开(公告)日：2024-08-08
申请号：US18407424
申请日：2024-01-08
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
CPC classification number: H05K7/20745 , F21V33/0092 , F21W2131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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公开(公告)号：US11871544B2
公开(公告)日：2024-01-09
申请号：US18086577
申请日：2022-12-21
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
CPC classification number: H05K7/20745 , F21V33/0092 , F21W2131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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Patent Agency Ranking
36.发明授权公开(公告)号：US11867426B2
公开(公告)日：2024-01-09
申请号：US17887192
申请日：2022-08-12
Applicant: Inertech IP LLC
Inventor： John Costakis , Ming Zhang , Earl Keisling , Ken Nguyen
IPC: F24F5/00 , F24F11/83 , F25B25/00 , F25B23/00 , F24F11/84 , F24F11/85 , F24F110/12 , F24F140/50 , F24F11/46 , F24F13/22 , F28C1/00
CPC classification number: F24F5/0007 , F24F5/001 , F24F5/0003 , F24F5/0035 , F24F11/83 , F24F11/84 , F24F11/85 , F25B23/006 , F25B25/00 , F25B25/005 , F24F11/46 , F24F2013/225 , F24F2110/12 , F24F2140/50 , F25B2339/041 , F25B2339/047 , F25B2700/197 , F25B2700/21163 , F28C2001/006 , Y02B30/54
Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.
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公开(公告)号：US20230363106A1
公开(公告)日：2023-11-09
申请号：US18118357
申请日：2023-03-07
Applicant: INERTECH IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
CPC classification number: H05K7/20218 , H05K5/02 , H05K7/20736 , H05K7/20781 , H05K7/20145 , H05K7/20609 , H05K7/20745 , H05K7/2079
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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公开(公告)号：US11602074B2
公开(公告)日：2023-03-07
申请号：US16653509
申请日：2019-10-15
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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39.发明授权公开(公告)号：US11306959B2
公开(公告)日：2022-04-19
申请号：US14534957
申请日：2014-11-06
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
Abstract: A cooling system is provided including a first evaporator coil in thermal communication with an air intake flow to a heat load, a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit, a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in the thermal communication with the air intake flow to the heat load, a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit, a water loop in thermal communication with the first fluid circuit and second fluid circuit, and a chiller loop in thermal communication with the water loop.
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公开(公告)号：US10739042B2
公开(公告)日：2020-08-11
申请号：US15479588
申请日：2017-04-05
Applicant: Inertech IP LLC
Inventor： Ming Zhang , John Costakis
Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.
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