公开(公告)号：US10073495B2

公开(公告)日：2018-09-11

申请号：US15414708

申请日：2017-01-25

Applicant: Intel Corporation

Inventor： Sameer Sharma ,  Douglas Satzger ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Daniel Clifton ,  Philip J. Houdek, II ,  Stanislav Moiseyenko ,  Nathan Isaiah Jauvtis

IPC: G06F1/16 ,  E05D7/00 ,  E05D11/00

CPC classification number: G06F1/1681 ,  E05D7/00 ,  E05D11/0081 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1633 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1669 ,  G06F1/1679 ,  G06F1/1683 ,  G06F1/189 ,  G06F21/31 ,  H01R24/58 ,  H01R43/16 ,  H01R2107/00

Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.

公开(公告)号：USD805068S1

公开(公告)日：2017-12-12

申请号：US29522276

申请日：2015-03-30

Applicant: Intel Corporation

Designer： Douglas Satzger ,  Sameer Sharma ,  Gadi Amit ,  Yoshikazu Hoshino

公开(公告)号：USD788101S1

公开(公告)日：2017-05-30

申请号：US29513138

申请日：2014-12-27

Applicant: Intel Corporation

Designer： Douglas Satzger ,  Sameer Sharma ,  Gadi Amit ,  Yoshikazu Hoshino

公开(公告)号：USD783603S1

公开(公告)日：2017-04-11

申请号：US29531730

申请日：2015-06-29

Applicant: Intel Corporation

Designer： Douglas Satzger ,  David M. Collins ,  Gadi Amit ,  Yoshikazu Hoshino ,  Maura Hoven ,  Jinwoo Kim ,  Luke D. Mastrangelo ,  Kebei Li

公开(公告)号：US09395762B2

公开(公告)日：2016-07-19

申请号：US14965206

申请日：2015-12-10

Applicant: Intel Corporation

Inventor： Sameer Sharma ,  Douglas Satzger ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Daniel Clifton ,  Phil Houdek ,  Stanislav Moiseyenko ,  Nathan Jauvtis

IPC: G06F1/16 ,  E05D15/50 ,  E05D3/12

CPC classification number: G06F1/1683 ,  E05D3/122 ,  E05D15/50 ,  G06F1/1616 ,  G06F1/1632 ,  G06F1/1637 ,  G06F1/1654 ,  G06F1/1662 ,  G06F1/1681 ,  Y10T16/528 ,  Y10T16/541

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a hinge assembly to secure a top portion of the electronic device to an accessory. The hinge assembly is to allow a rotation of the top portion in relation to the accessory. The hinge assembly may include a plurality of discs to receive a plurality of segments of the accessory as the hinge assembly engages to secure the top portion of the electronic device to the accessory.

Abstract translation: 本文描述的特定实施例提供了一种电子设备，例如笔记本电脑或膝上型计算机，其包括耦合到多个电子部件（其包括任何类型的组件，元件，电路等）的电路板。 电子设备还可以包括将电子设备的顶部部分固定到附件的铰链组件。 铰链组件允许顶部部分相对于附件旋转。 当铰链组件接合以将电子设备的顶部固定到附件时，铰链组件可以包括多个盘，以容纳附件的多个段。

公开(公告)号：US09195314B2

公开(公告)日：2015-11-24

申请号：US13719307

申请日：2012-12-19

Applicant: Intel Corporation

Inventor： Sameer Sharma ,  Douglas Satzger ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Phil Houdek ,  Stanislav Moiseyenko ,  Daniel Clifton ,  Nathan Jauvtis

IPC: G06F3/02 ,  G06F1/16 ,  H01H13/85

CPC classification number: G06F3/0202 ,  G06F1/1662 ,  H01H13/85 ,  H01H2221/04 ,  H01H2221/058 ,  H01H2227/036

Abstract: Particular embodiments described herein provide for a keyboard assembly having a plurality of keys that include a key having one or more magnets, which are provided at a substantially outer portion of the key. The keyboard assembly can also include a top plate that comprises a ferrous material to attract the one or more magnets to the top plate.

Abstract translation: 本文所述的特定实施例提供了具有多个键的键盘组件，其包括具有一个或多个磁体的键，所述键设置在键的基本外部。 键盘组件还可以包括顶板，其包括用于将一个或多个磁体吸引到顶板的铁质材料。

公开(公告)号：USD739385S1

公开(公告)日：2015-09-22

申请号：US29477913

申请日：2013-12-28

Applicant: Intel Corporation

Designer： Gregory A. James ,  David G. Payne ,  Michael J. Castillo ,  Fraser Stirling ,  Simon J. Waterfall ,  Gadi Amit ,  Chadwick Harber ,  Julien Rouillac

公开(公告)号：US20150146356A1

公开(公告)日：2015-05-28

申请号：US14583591

申请日：2014-12-27

Applicant: Intel Corporation

Inventor： Sameer Sharma ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Daniel Clifton ,  Kenneth Jasinski

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/162 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1643 ,  G06F1/1654 ,  G06F1/1662 ,  G06F1/1684 ,  G06F1/1686 ,  G06F1/169 ,  G06F1/1692

Abstract: Embodiments of an apparatus, system and method are described for a mobile computing device. A mobile computing device may comprise, for example, an enclosure arranged to support a display and one or more processor circuits, the enclosure having an enlarged portion at one side of the enclosure arranged to allow a user to clutch the enclosure with one hand at the one side, the enlarged portion having a thickness that is larger than a thickness of another portion of the enclosure, and the enlarged portion defining a cavity arranged to support one or more energy storage modules. Other embodiments are described and claimed.

Abstract translation: 针对移动计算设备描述了装置，系统和方法的实施例。 移动计算设备可以包括例如被布置为支持显示器和一个或多个处理器电路的外壳，所述外壳在外壳的一侧具有放大部分，其被布置成允许用户用一只手离开外壳 一侧，所述扩大部分的厚度大于所述外壳的另一部分的厚度，并且所述扩大部分限定设置成支撑一个或多个能量存储模块的空腔。 描述和要求保护其他实施例。

公开(公告)号：USD721700S1

公开(公告)日：2015-01-27

申请号：US29440999

申请日：2012-12-28

Applicant: Intel Corporation

Designer： Douglas Satzger ,  Sameer Sharma ,  Gadi Amit ,  Yoshikazu Hoshino