公开(公告)号：US20130255351A1

公开(公告)日：2013-10-03

申请号：US13583748

申请日：2010-12-22

申请人： Tsuyoshi Nanba ,  Hiroshi Imakawa ,  Isao Nojiri

发明人： Tsuyoshi Nanba ,  Hiroshi Imakawa ,  Isao Nojiri

IPC分类号： B30B15/02

CPC分类号： B30B15/02 ,  B21D28/32 ,  B21D37/02 ,  B21D37/10

摘要： A die having adequate flexibility at an entirety thereof while maintaining rigidity of a design surface is presented. A die is a die for a machine press. The die is a die for pressing a work plate together with a contraposed die and forming the work plate into a target shape. The die is provided with a design block, a positioning block, and a plurality of rods. The design block has a design surface for transferring the target shape to the work plate. The positioning block is used for positioning the die relative to the contraposed die. The design block and the positioning block are connected by the plurality of rods.

摘要翻译： 提供了一种在保持设计表面的刚性的同时在整体上具有足够的柔性的模具。 一个模具是机器压机的模具。 模具是用于将工件板与对准的模具一起挤压并将工作板成形为目标形状的模具。 模具设置有设计块，定位块和多个杆。 设计块具有用于将目标形状转移到工作板的设计表面。 定位块用于相对于对准的模具定位模具。 设计块和定位块通过多个杆连接。

公开(公告)号：US07071574B1

公开(公告)日：2006-07-04

申请号：US09654875

申请日：2000-09-05

申请人： Isao Nojiri ,  Ryu Makabe

发明人： Isao Nojiri ,  Ryu Makabe

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/06051 ,  H01L2224/1132 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.

公开(公告)号：US09442325B2

公开(公告)日：2016-09-13

申请号：US13794623

申请日：2013-03-11

申请人： Isao Nojiri ,  Toshiro Taniguchi

发明人： Isao Nojiri ,  Toshiro Taniguchi

IPC分类号： G02F1/1341 ,  G02F1/1339

CPC分类号： G02F1/1339 ,  G02F1/1341

摘要： The present invention includes liquid crystal held between an array substrate including a display area and a color filter substrate, a seal material pasting the both substrates together outside in plan view of the display area, and column spacers between the both substrates. The seal material includes a seal periphery surrounding the display area, and seal extending portions forming an injection port of the liquid crystal by extending the seal periphery outside in plan view of the display area from both end of a partial opening. The seal periphery includes no spacer therein, and the seal extending portions include spacers therein.

摘要翻译： 本发明包括保持在包括显示区域的阵列基板和滤色器基板之间的液晶，在显示区域的平面图中将两个基板粘合在一起的密封材料和两个基板之间的柱间隔件。 密封材料包括围绕显示区域的密封周边，以及通过在部分开口的两端的显示区域的平面图中将密封周边外延伸而形成液晶的注入口的密封延伸部分。 密封周边不包括间隔件，密封件延伸部分包括间隔件。

公开(公告)号：US09392644B2

公开(公告)日：2016-07-12

申请号：US14129662

申请日：2011-07-19

申请人： Isao Nojiri ,  Shinji Ishii

发明人： Isao Nojiri ,  Shinji Ishii

IPC分类号： H05B3/02 ,  B21D37/16 ,  C21D1/40 ,  H05B3/03 ,  C21D7/13 ,  C21D8/00 ,  H05B3/00

CPC分类号： H05B3/023 ,  B21D37/16 ,  C21D1/40 ,  C21D7/13 ,  C21D2261/00 ,  H05B3/0004 ,  H05B3/03

摘要： An electrically heating device is provided with a pair of clamp units serving as electrodes for energization and applying tension to a workpiece to be heated clamped between the clamp units by moving the clamp units in the direction in which the clamp units separate from each other during energization heating. The clamp units each include a facing surface inclined with respect to the moving direction of the clamp units and form, by the facing surface, a preform including an inclined surface inclined with respect to the plane direction of the workpiece in a clamping portion clamped between the clamp units in the workpiece.

摘要翻译： 电加热装置设置有一对夹持单元，用作通电的电极，并且通过在通电期间夹紧单元彼此分离的方向移动夹持单元，向被夹持在夹具单元之间的待加热工件施加张力 加热。 所述夹紧单元各自包括相对于所述夹紧单元的移动方向倾斜的面对表面，并且由所述面对表面形成预制件，所述预制件包括相对于所述工件的平面方向倾斜的倾斜表面， 夹紧单元在工件上。

公开(公告)号：US20140069163A1

公开(公告)日：2014-03-13

申请号：US14117776

申请日：2011-05-16

申请人： Isao Nojiri ,  Shinji Ishii

发明人： Isao Nojiri ,  Shinji Ishii

IPC分类号： B21D22/02 ,  B21D37/20

CPC分类号： B21D22/022 ,  B21D37/16 ,  B21D37/20 ,  B21J1/06 ,  C21D1/673

摘要： A hot-pressing die and a method for manufacturing the hot-pressing die are disclosed. The die which presses and cools a heated workpiece at the same time to form a product with a hat-shape includes a lower die and an upper die. The lower die has a protrusion which protrudes from the forming surface thereof, and the upper die has a recess corresponding to the protrusion. The lower die is modified into a modified lower die by forming, on the forming surface of the protruding end of the protrusion, a buildup part with a convex shape to gradually change in position in the protruding direction of the protrusion toward the middle thereof.

摘要翻译： 公开了一种热压模及其制造方法。 同时挤压和加热加热的工件以形成具有帽子形状的产品的模具包括下模和上模。 下模具有从其成形表面突出的突起，并且上模具有与突起相对应的凹部。 下模通过在突起的突出端的成形表面上形成具有凸形的积聚部分，在突起的突出方向上朝向其中间逐渐变化的位置，将下模改造成修改的下模。

公开(公告)号：US20130291614A1

公开(公告)日：2013-11-07

申请号：US13879632

申请日：2011-01-28

申请人： Naoki Ichijo ,  Yoshiya Sato ,  Isao Nojiri

发明人： Naoki Ichijo ,  Yoshiya Sato ,  Isao Nojiri

IPC分类号： B21D22/02

CPC分类号： B21D22/02 ,  B21D37/10 ,  B21D37/20 ,  B30B15/02

摘要： A lightweight mold for press forming is presented. Molds are characterized in that design forming portions thereof, these design forming portions making contact with a workpiece at the time of press forming and thereby forming a target design on the workpiece, are constructed of rod shaped members (design forming rods). By having the design forming portions be constructed of rod shaped members, the weight of the mold is reduced. It is preferred that the molds are further provided with supporting rods which support the design forming rods, these rod members constituting a framework structure.

摘要翻译： 提出了一种用于冲压成型的轻质模具。 模具的特征在于，其设计形成部分，这些在压制成型时与工件接触并由此在工件上形成目标设计的设计形成部分由杆形构件（设计成型杆）构成。 通过使设计形成部分由棒状构件构成，模具的重量减小。 优选地，模具还设置有支撑杆，支撑杆支撑设计形成杆，这些杆构件构成框架结构。

公开(公告)号：US20080023848A1

公开(公告)日：2008-01-31

申请号：US11902827

申请日：2007-09-26

申请人： Isao Nojiri ,  Ryu Makabe

发明人： Isao Nojiri ,  Ryu Makabe

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/06051 ,  H01L2224/1132 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.

公开(公告)号：US20080023847A1

公开(公告)日：2008-01-31

申请号：US11902826

申请日：2007-09-26

申请人： Isao Nojiri ,  Ryu Makabe

发明人： Isao Nojiri ,  Ryu Makabe

IPC分类号： H01L23/49

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/06051 ,  H01L2224/1132 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.

摘要翻译： 安装在母板上的半导体器件具有位于母板上的电路板和位于电路板上的半导体芯片。 电路板具有连接焊盘，与连接焊盘间隔开的继电器焊盘，以及在支撑半导体芯片的电路板的表面上连接在连接焊盘和继电器焊盘之间的电线。 此外，半导体芯片具有与形成在电路板上的连接焊盘相对应的连接焊盘。 此外，电路板上的连接焊盘和半导体芯片上的连接焊盘通过接合线彼此电连接。

公开(公告)号：US06504761B2

公开(公告)日：2003-01-07

申请号：US09931758

申请日：2001-08-20

申请人： Yoshihide Kai ,  Atsushi Ohba ,  Isao Nojiri

发明人： Yoshihide Kai ,  Atsushi Ohba ,  Isao Nojiri

IPC分类号： G11C1600

CPC分类号： G11C16/28 ,  G11C16/26

摘要： In the non-volatile semiconductor memory device, for a current mirror for reading out data of a memory cell, a diode-connected transistor and a cut transistor are provided. The diode-connected transistor makes a precharged voltage level lower than a power supply voltage level. The cut transistor reduces current consumption.