公开(公告)号：US20210337664A1

公开(公告)日：2021-10-28

申请号：US16498032

申请日：2019-04-22

申请人： JX Nippon Mining & Metals Corporation

发明人： Nobuaki Miyamoto ,  Atsushi Miki

IPC分类号： H05K1/09 ,  H05K3/38 ,  H05K3/02

摘要： A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

公开(公告)号：US10925171B2

公开(公告)日：2021-02-16

申请号：US15936600

申请日：2018-03-27

申请人： JX Nippon Mining & Metals Corporation

发明人： Yuki Ori ,  Hideta Arai ,  Atsushi Miki ,  Ryo Fukuchi

IPC分类号： B32B15/04 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02 ,  B32B15/20 ,  B32B27/38 ,  C25D7/06 ,  C23C18/16 ,  C25D5/48 ,  C25D7/00 ,  C25D1/04 ,  B32B15/08 ,  B32B15/09 ,  B32B15/088 ,  H05K3/20 ,  C25D3/38 ,  C25D5/02 ,  C25D3/58

摘要： The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 μm, a roughness Rz is 1.00 to 2.00 μm, a roughness Sq is 0.16 to 0.30 μm, a roughness Ssk is −0.6 to −0.35, a roughness Sa is 0.12 to 0.23 μm, a roughness Sz is 2.20 to 3.50 μm, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

公开(公告)号：US10820414B2

公开(公告)日：2020-10-27

申请号：US15827056

申请日：2017-11-30

申请人： JX Nippon Mining & Metals Corporation

发明人： Hideta Arai ,  Ryo Fukuchi ,  Atsushi Miki

IPC分类号： B21C37/00 ,  H05K1/09 ,  H05K3/06 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42

摘要： Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 μg/dm2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 μg/dm2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 μg/dm2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

公开(公告)号：US10529992B2

公开(公告)日：2020-01-07

申请号：US15884451

申请日：2018-01-31

申请人： JX Nippon Mining & Metals Corporation

发明人： Hideta Arai ,  Atsushi Miki

IPC分类号： H01M4/66

摘要： The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles.The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 μm or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

公开(公告)号：US20160286665A1

公开(公告)日：2016-09-29

申请号：US15178620

申请日：2016-06-10

申请人： JX Nippon Mining & Metals Corporation

发明人： Hideta Arai ,  Atsushi Miki

IPC分类号： H05K3/38 ,  H05K3/20 ,  H05K1/09 ,  C25D15/00 ,  C25D5/16

CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/12 ,  C25D5/16 ,  C25D9/04 ,  C25D15/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/384 ,  H05K2203/0307 ,  Y10T428/12028

摘要： A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

摘要翻译： 通过在铜箔的表面上形成铜的一次粒子层，然后在一次粒子层上形成基于由铜，钴和镍构成的三元合金的二次粒子层，制作印刷电路用铜箔。 初级粒子层的平均粒径为0.25〜0.45μm，由铜，钴，镍构成的三元合金的二次粒子层的平均粒径为0.05〜0.25μm。 提供一种用于印刷电路的铜箔，其中可以减少从铜箔掉落的粉末，并且可以通过在铜箔的表面上形成铜的一次粒子层来改善剥离强度和耐热性，然后形成 在一次粒子层上基于铜 - 钴 - 镍合金电镀的二次粒子层。