Plasma process for removing excess molding material from a substrate
    34.
    发明授权
    Plasma process for removing excess molding material from a substrate 有权
    用于从基底去除多余成型材料的等离子体工艺

    公开(公告)号:US07842223B2

    公开(公告)日:2010-11-30

    申请号:US11021341

    申请日:2004-12-22

    摘要: A method for removing thin layers of a two-component molding material from areas on a substrate. The method includes using a plasma formed using a first gas mixture for removing one component of the molding material and a plasma formed using a different second gas mixture for removing the other component of the molding material. For filled epoxies commonly used as molding materials, the first gas mixture may be an oxygen-rich mixture of an oxygen-containing gas species and a fluorine-containing gas species, and the second gas mixture may be a fluorine-rich mixture of the same gases.

    摘要翻译: 一种从基板上的区域去除双组分成型材料薄层的方法。 该方法包括使用使用第一气体混合物形成的等离子体,以除去模制材料的一个组分,以及使用不同的第二气体混合物形成的等离子体,以除去模制材料的其它组分。 对于通常用作成型材料的填充环氧树脂,第一气体混合物可以是含氧气体物质和含氟气体物质的富氧混合物,并且第二气体混合物可以是其富含氟的混合物 气体。