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公开(公告)号：US07425838B2
公开(公告)日：2008-09-16
申请号：US11485624
申请日：2006-07-13
IPC分类号： G01R31/02
CPC分类号： H01L21/67109 , G01R31/2865 , G01R31/2877
摘要： According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the chuck top, wherein the supporting member has a bottom portion facing to the chuck top, a cavity portion is formed between the chuck top and the bottom portion of the supporting member, and there is provided, in the cavity portion, at least a portion of a cooling mechanism for cooling at least one of the chuck top and the supporting member. Further, there is provided a wafer prober using the wafer holding member.
摘要翻译： 根据本发明，提供一种晶片保持构件，用于检查半导体晶片的晶片保持构件，该半导体晶片包括卡盘顶部和用于支撑卡盘顶部的支撑构件，其中支撑构件具有面向卡盘的底部 顶部，在支撑构件的卡盘顶部和底部之间形成空腔部分，并且在空腔部分中设置有用于冷却卡盘顶部和支撑件中的至少一个的冷却机构的至少一部分 会员。 此外，提供了使用晶片保持构件的晶片探测器。
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32.发明申请Wafer holder and semiconductor manufacturing apparatus equipped with wafer holder 审中-公开晶圆架和半导体制造装置配有晶圆座公开(公告)号：US20080083979A1
公开(公告)日：2008-04-10
申请号：US11544725
申请日：2006-10-10
IPC分类号： H01L23/12
CPC分类号： H01J37/32559 , H01J37/32091 , H01J2237/2001
摘要： A wafer holder for a semiconductor manufacturing apparatus is provided with which a film may be evenly formed over the entire wafer surface and the incidence of particle generation is low, as well as a semiconductor manufacturing apparatus equipped with same.The wafer holder of the present invention is a ceramic wafer holder in which a heating body and a high-frequency electrode are embedded, and a diameter of the high-frequency electrode embedded in the ceramic is greater than the diameter of an upper high-frequency electrode disposed opposite the high-frequency electrode. A main component of the ceramic is preferably aluminum nitride, and the high-frequency electrode is preferably in the form of a film.
摘要翻译： 提供了一种半导体制造装置的晶片保持器，其中可以在整个晶片表面上均匀地形成膜并且颗粒产生的发生率低，以及配备其的半导体制造装置。 本发明的晶片保持器是嵌入加热体和高频电极的陶瓷晶片保持器，嵌入陶瓷的高频电极的直径大于上部高频的直径 电极与高频电极相对设置。 陶瓷的主要成分优选为氮化铝，高频电极优选为膜状。
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33.发明申请Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith 审中-公开晶片支架，以及提供的晶圆探测器和半导体制造装置公开(公告)号：US20070182433A1
公开(公告)日：2007-08-09
申请号：US11699043
申请日：2007-01-29
IPC分类号： G01R31/02
CPC分类号： G01R31/2877
摘要： A wafer holder that includes a cooling module for rapid cooling, that can further improve the heating uniformity of a wafer, and that can be appropriately used with a wafer prober, a coater/developer, or the like. The wafer holder includes a mounting stage arranged to mount a wafer on a mounting surface, a heat generator 1 arranged to heat the mounting stage, and a cooling module arranged to cool the mounting stage, wherein an outside diameter of the cooling module is smaller than an outside diameter of the mounting stage, and the heat generator 1 attached to the mounting stage is positioned further to the outside than the cooling module. Along with the heat generator 1, a supplementary heat generator may be positioned between the cooling module and the mounting stage or on a surface of the cooling module opposite the mounting stage.
摘要翻译： 包括用于快速冷却的冷却模块的晶片保持器，其可以进一步提高晶片的加热均匀性，并且可以与晶片探测器，涂布机/显影剂等适当地使用。 晶片保持器包括安装台，用于将晶片安装在安装表面上，布置成加热安装台的热发生器1和布置成冷却安装台的冷却模块，其中冷却模块的外径小于 安装台的外径和附接到安装台的发热体1比冷却模块更靠外侧。 与发热体1一起，辅助热发生器可以位于冷却模块和安装台之间或冷却模块的与安装台相对的表面上。
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公开(公告)号：US20070133964A1
公开(公告)日：2007-06-14
申请号：US11636495
申请日：2006-12-11
IPC分类号： H05B3/78
CPC分类号： H05B3/265 , F24H1/102 , H05B3/141 , H05B2203/003
摘要： The invention provides a fluid heater in which the efficiency of heat transfer to a fluid is improved, downsizing of the heater itself can be achieved, and the rise time until warm water heated to a necessary temperature is supplied is shortened, which results in reduction of the power consumption. The heater includes a flat ceramic substrate (1) and a heating element formed on one surface of or in the interior of the ceramic substrate (1). The ceramic substrate (1) is made of A1N, etc. or silicon nitride, whose thermal conductivity is 50W/m·K or more. A zigzag water channel is formed by walls 6, etc., on the fluid-heating surface of the ceramic substrate (1). A plurality of fins 5 are fixed in the water channel. A heat insulating material 8 can be mounted so as to cover a surface excluding the fluid-heating surface of the ceramic substrate (1).
摘要翻译： 本发明提供了一种流体加热器，其中提高了对流体的传热效率，可以实现加热器本身的小型化，并且提供加热到必要温度的温水的上升时间缩短，从而导致 功耗。 加热器包括平坦陶瓷基板（1）和形成在陶瓷基板（1）的内表面上或其内部的加热元件。 陶瓷基板（1）由A 1 N等或氮化硅制成，其导热率为50W / m·K以上。 在陶瓷基板（1）的流体加热表面上由壁6等形成锯齿形的水通道。 多个翅片5固定在水通道中。 绝热材料8可以安装成覆盖除了陶瓷基板（1）的流体加热表面之外的表面。
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35.发明申请Wafer holder, and heating unit and wafer prober provided with the wafer holder 审中-公开晶片支架，以及配有晶片支架的加热单元和晶圆探测器公开(公告)号：US20070126457A1
公开(公告)日：2007-06-07
申请号：US11603233
申请日：2006-11-22
IPC分类号： G01R31/26
CPC分类号： G01R31/2893
摘要： A wafer holder is provided with a mounting stage having a mounting surface for mounting a wafer, and a holding member for holding the mounting stage, wherein relationships are established such that K1>K2 and Y1 K3, where K3 is the thermal conductivity of the holding member.
摘要翻译： 晶片保持器设置有具有用于安装晶片的安装表面的安装台和用于保持安装台的保持构件，其中建立K 1> K 2和Y 1
K 3，其中K 3是保持构件的热导率。 -
公开(公告)号：US07177536B2
公开(公告)日：2007-02-13
申请号：US10169249
申请日：2001-10-19
IPC分类号： F24H1/10
CPC分类号： H05B3/265 , F24H1/102 , H05B3/141 , H05B2203/003
摘要： The invention provides a fluid heater in which the efficiency of heat transfer to a fluid is improved, downsizing of the heater itself can be achieved, and the rise time until warm water heated to a necessary temperature is supplied is shortened, which results in reduction of the power consumption. The heater includes a flat ceramic substrate (1) and a beating element formed on one surface of or in the interior of the ceramic substrate (1). The ceramic substrate (1) is made of AlN, etc. or silicon nitride, whose thermal conductivity is 50 W/m·K or more. A zigzag water channel is formed by walls 6, etc., on the fluid-heating surface of the ceramic substrate (1). A plurality of fins 5 are fixed in the water channel. A heat insulating material 8 can be mounted so as to cover a surface excluding the fluid-heating surface of the ceramic substrate (1).
摘要翻译： 本发明提供了一种流体加热器，其中提高了对流体的传热效率，可以实现加热器本身的小型化，并且提供加热到必要温度的温水的上升时间缩短，这导致 功耗。 加热器包括平坦陶瓷基板（1）和形成在陶瓷基板（1）的内表面上或其内部的打浆元件。 陶瓷基板（1）由AlN等或氮化硅制成，其导热率为50W / m·K以上。 在陶瓷基板（1）的流体加热表面上由壁6等形成锯齿形的水通道。 多个翅片5固定在水通道中。 绝热材料8可以安装成覆盖除了陶瓷基板（1）的流体加热表面之外的表面。
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37.发明申请Chuck top, wafer holder having the chuck top, and wafer prober having the chuck top 审中-公开卡盘顶部，具有卡盘顶部的晶片架，以及具有卡盘顶部的晶片探测器公开(公告)号：US20070024313A1
公开(公告)日：2007-02-01
申请号：US11493920
申请日：2006-07-27
IPC分类号： G01R31/26
CPC分类号： G01R31/2893
摘要： A chuck top allowing reliable recognition of a wafer mounted on a wafer-mounting surface or on a chuck top conductive layer by a camera such as a CCD and hence allowing wafer inspection without problem is provided. The chuck top is used for a wafer prober mounting a wafer on the wafer-mounting surface for inspection, in which reflectance of a portion other than the portion for mounting the wafer of the wafer-mounting surface or the chuck top conductive layer is smaller than the reflectance of a peripheral end portion of the wafer to be inspected. The portion other than the portion for mounting the wafer of the wafer-mounting surface or the chuck top conductive layer of chuck top preferably has surface roughness Ra of at least 0.0001 μm and at most 0.05 μm.
摘要翻译： 提供了一种卡盘头，其允许通过诸如CCD的照相机安装在晶片安装表面或卡盘顶部导电层上的晶片可靠地识别，并且因此允许晶片检查没有问题。 卡盘顶部用于将晶片安装在晶片安装表面上用于检查的晶片探测器，其中除了用于安装晶片安装表面或卡盘顶部导电层的晶片的部分之外的部分的反射率小于 要检查的晶片的外周端部的反射率。 除了用于安装晶片安装表面的晶片或卡盘顶板的导电层的部分之外的部分优选具有至少0.0001μm的表面粗糙度Ra和至多0.05μm的表面粗糙度Ra。
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公开(公告)号：US20070024299A1
公开(公告)日：2007-02-01
申请号：US11485624
申请日：2006-07-13
CPC分类号： H01L21/67109 , G01R31/2865 , G01R31/2877
摘要： According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the chuck top, wherein the supporting member has a bottom portion facing to the chuck top, a cavity portion is formed between the chuck top and the bottom portion of the supporting member, and there is provided, in the cavity portion, at least a portion of a cooling mechanism for cooling at least one of the chuck top and the supporting member. Further, there is provided a wafer prober using the wafer holding member.
摘要翻译： 根据本发明，提供一种晶片保持构件，用于检查半导体晶片的晶片保持构件，该半导体晶片包括卡盘顶部和用于支撑卡盘顶部的支撑构件，其中支撑构件具有面向卡盘的底部 顶部，在支撑构件的卡盘顶部和底部之间形成空腔部分，并且在空腔部分中设置有用于冷却卡盘顶部和支撑件中的至少一个的冷却机构的至少一部分 会员。 此外，提供了使用晶片保持构件的晶片探测器。
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39.发明申请公开(公告)号：US20060186904A1
公开(公告)日：2006-08-24
申请号：US11287847
申请日：2005-11-29
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2891
摘要： The invention provides a wafer-prober wafer holder that allows positional precision and temperature uniformity to be increased, and also allows the chip to be heated and cooled rapidly, and a wafer prober device provided with the same. The wafer-prober wafer holder of the invention is constituted by a chuck top having a chuck top conducting layer on its surface, and a support member for supporting the chuck top, and has a cavity in a portion between the chuck top and the support member. The chuck top preferably is provided with a heating member.
摘要翻译： 本发明提供了一种能够提高位置精度和温度均匀性的晶片探针晶片保持器，并且还允许芯片被快速加热和冷却，以及提供其的晶片探测器装置。 本发明的晶片探针晶片保持器由其表面上具有卡盘顶部导电层的卡盘顶板和用于支撑卡盘顶部的支撑件构成，并且在卡盘顶部和支撑件之间的部分中具有空腔 。 卡盘顶部优选地设置有加热构件。
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公开(公告)号：US20050028739A1
公开(公告)日：2005-02-10
申请号：US10710841
申请日：2004-08-06
IPC分类号： C23C16/00 , C23C16/458 , H01L21/68 , H01L21/683
CPC分类号： C23C16/4586 , C23C16/4581
摘要： According to the present invention, a wafer holder is supported by support pieces mounted on a pedestal and is installed within the processing chamber of a semiconductor manufacturing device, wherein the lift pins are set up anchored to the semiconductor-manufacturing-device chamber and the pedestal is driven vertically, thereby running the wafer holder up/down to thrust the lift pins out from, or retract them into, the top side of the wafer holder, which makes it possible to dechuck wafers from and pocket them into the holder. Consequently, leveling the height of the tip ends of the plurality of lift pins is facilitated and synchronization problems are completely eliminated besides, which thus makes it possible to prevent wafer drop-off during wafer dechucking/pocketing. And since a mechanism for synchronously driving the plural lift pins up/down is unnecessary, the device overall can be made more compact.
摘要翻译： 根据本发明，晶片保持器由安装在基座上的支撑件支撑并安装在半导体制造装置的处理室内，其中提升销被固定在半导体制造装置室和基座 被垂直驱动，从而使晶片保持器上/下移动以将提升销推出或者将其退回到晶片保持器的顶侧，这使得可以将晶片从其中取出并将其包入保持器中。 因此，除了多个提升销的顶端的高度以外，还能够完全消除同步问题，从而可以防止晶片脱胶/贴片期间的晶片脱落。 并且，由于不需要同时驱动多个提升销的机构，因此能够使装置整体更加紧凑。
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