-
公开(公告)号：US09684128B2
公开(公告)日：2017-06-20
申请号：US15232067
申请日：2016-08-09
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
CPC classification number: G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.
-
32.发明申请公开(公告)号：US20160246018A1
公开(公告)日：2016-08-25
申请号：US15144611
申请日：2016-05-02
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Sherif Abdalla , Mark Peterson , Gianlorenzo Masini
CPC classification number: G02B6/428 , G02B6/12004 , G02B6/34 , G02B6/4295 , G02B2006/12107 , G02B2006/12123 , G02F1/2255 , G02F1/2257 , G02F2001/212 , H01L21/84 , H01L25/0652 , H01L27/0688 , H01L27/1203 , H01L2224/73265 , H01L2225/06541 , H04B10/27
Abstract: Methods and systems for hybrid integration of optical communication systems may comprise in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects: receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects; receiving modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die; generating electrical signals in said silicon photonics die based on said received modulated optical signals; and communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.
Abstract translation: 用于光通信系统的混合集成的方法和系统可以包括在光通信系统中，所述光通信系统包括硅光子管芯和利用金属互连结合到所述硅光子管芯的一个或多个电子管芯：接收一个或多个连续波（CW） 所述硅光子学中的光信号从所述硅光子管芯外部的光源射出; 使用经由所述金属互连从所述一个或多个电子管芯接收的电信号来调制所述硅光子管芯中的所述一个或多个接收的CW未调制的光信号; 从耦合到所述硅光子管芯的一个或多个光纤接收所述硅光子管芯中的调制光信号; 基于所述接收的调制光信号在所述硅光子管芯中产生电信号; 以及经由所述金属互连将所述产生的电信号传送到所述一个或多个电子管芯中的至少一个。
-
公开(公告)号：US09109948B2
公开(公告)日：2015-08-18
申请号：US14513886
申请日：2014-10-14
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
CPC classification number: G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip in a photonic transceiver, wherein photonic, electronic, or optoelectronic devices may be integrated in layers on a front surface of the CMOS photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The optical signals may be coupled to the optical couplers via a light path etched in the chips, which may be refilled with silicon dioxide. The chips may be bonded to a second chip. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.
Abstract translation: 公开了一种用于将光信号耦合到硅光电芯片的方法和系统，并且可以包括将一个或多个光信号耦合到光子收发器中的CMOS光子芯片的背表面，其中光子，电子或光电器件可以集成在层 在CMOS光子芯片的正面上。 诸如光栅耦合器的光耦合器可以在前表面中接收光信号。 光信号可以经由光纤和/或光源组件耦合到芯片的后表面中。 光信号可以经由在芯片中蚀刻的光路耦合到光耦合器，其可以用二氧化硅再填充。 芯片可以结合到第二芯片。 光信号可以经由金属反射器反射回到光耦合器，金属反射器可以集成在芯片上的电介质层中。
-
公开(公告)号：USRE45214E1
公开(公告)日：2014-10-28
申请号：US13772155
申请日：2013-02-20
Applicant: Luxtera, Inc.
Inventor： Peter De Dobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn, III
CPC classification number: H04B10/40 , G02B6/12004 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4295 , G02B2006/12121
Abstract: A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via a semiconductor laser and one or more photodetectors. The optical and optoelectronic devices may include waveguides, modulators, multiplexers, switches, and couplers. The photodetector may be integrated in the CMOS chip. The photodetector and the semiconductor laser may be mounted on the CMOS chip. The optical signals may be communicated out of and in to a top surface of the CMOS chip. A transceiver on a CMOS chip including optical and optoelectronic devices, and electronic circuitry, may be operable to communicate optical signals between the CMOS chip and optical fibers coupled to the CMOS chip via grating couplers. The optical signals may be communicated out of and in to a top surface of the CMOS chip.
Abstract translation: 包括光学和光电子器件的CMOS芯片上的收发器和电子电路可以用于在CMOS芯片和经由半导体激光器和一个或多个光电探测器耦合到CMOS芯片的光纤之间传送光信号。 光学和光电器件可以包括波导，调制器，多路复用器，开关和耦合器。 光电检测器可以集成在CMOS芯片中。 光检测器和半导体激光器可以安装在CMOS芯片上。 光信号可以在CMOS芯片的顶表面之外传送出去。 包括光学和光电子器件以及电子电路的CMOS芯片上的收发器可以用于在CMOS芯片和经由光栅耦合器耦合到CMOS芯片的光纤之间传送光信号。 光信号可以在CMOS芯片的顶表面之外传送出去。
-
公开(公告)号：US10578892B2
公开(公告)日：2020-03-03
申请号：US16267545
申请日：2019-02-05
Applicant: Luxtera, Inc.
Inventor： Ali Ayazi , Gianlorenzo Masini , Subal Sahni , Attila Mekis , Thierry Pinguet
Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include in an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have fingers of p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide. Contacts may be formed on the fingers of p-doped and n-doped regions. The fingers of p-doped and n-doped regions may be arranged symmetrically about the PN junction waveguide or staggered along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.
-
Patent Agency Ranking
公开(公告)号：US20190342006A1
公开(公告)日：2019-11-07
申请号：US16460479
申请日：2019-07-02
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Steffen Gloeckner , Sherif Abdalla , Sina Mirsaidi , Peter De Dobbelaere , Lawrence C. Gunn, III
Abstract: Methods and systems for optoelectronics transceivers of a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers, which may include a guard ring. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.
-
公开(公告)号：US10454586B2
公开(公告)日：2019-10-22
申请号：US16189661
申请日：2018-11-13
Applicant: Luxtera, Inc.
Inventor： Peter DeDobbelaere , Thierry Pinguet , Mark Peterson , Mark Harrison , Alexander G. Dickinson , Lawrence C. Gunn
Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.
-
公开(公告)号：US20190154916A1
公开(公告)日：2019-05-23
申请号：US16253000
申请日：2019-01-21
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
CPC classification number: G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.
-
公开(公告)号：US10209540B2
公开(公告)日：2019-02-19
申请号：US16036409
申请日：2018-07-16
Applicant: Luxtera, Inc.
Inventor： Ali Ayazi , Gianlorenzo Masini , Subal Sahni , Attila Mekis , Thierry Pinguet
Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include fabricating an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide, and portions of the p-doped and n-doped regions may be removed. Contacts may be formed on remaining portions of the p-doped and n-doped regions. Portions of the p-doped and n-doped regions may be removed symmetrically about the PN junction waveguide. Portions of the p-doped and n-doped regions may be removed in a staggered fashion along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.
-
公开(公告)号：US10185086B2
公开(公告)日：2019-01-22
申请号：US15901483
申请日：2018-02-21
Applicant: Luxtera, Inc.
Inventor： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.
-
-
-
-
-
-
-
-
-
Search Results
50
records
(took 0.015 seconds)
