公开(公告)号：US20060180927A1

公开(公告)日：2006-08-17

申请号：US11057696

申请日：2005-02-14

申请人： Daisuke Takai ,  Masami Aihara ,  Koichi Takahashi

发明人： Daisuke Takai ,  Masami Aihara ,  Koichi Takahashi

IPC分类号： H01L23/48

CPC分类号： H05K3/4092 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/13099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32014 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83907 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0379 ,  H05K2201/0397 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0104 ,  H01L2924/00014 ,  H01L2924/00

摘要： A contact structure includes contact members having leg portions which are deflected using internal stresses. Since the internal stress is used, the leg portions of the contact members are easily and reliably deflected even when the size of the contact members is reduced in accordance with the size reduction of an electronic component. Since the leg portions are elastically deformed and function as elastic contacts, a strain caused by a difference in coefficient of thermal expansion between the electronic component and the substrate can be absorbed by the contact members. In addition, since a plurality of elastic contacts are provided, even if there is a displacement between the electronic component and the substrate, an electrical connection between the electronic component and the substrate is reliably obtained.

摘要翻译： 接触结构包括具有使用内部应力偏转的腿部的接触构件。 由于使用内部应力，即使当根据电子部件的尺寸减小而减小接触构件的尺寸时，接触构件的腿部也容易且可靠地偏转。 由于腿部弹性变形并且起到弹性接触的作用，所以由电子部件和基板之间的热膨胀系数的差异引起的应变可被接触部件吸收。 此外，由于设置了多个弹性触点，所以即使电子部件与基板之间存在位移，也可以可靠地获得电子部件与基板之间的电连接。

公开(公告)号：US5987243A

公开(公告)日：1999-11-16

申请号：US919779

申请日：1997-08-29

申请人： Masami Aihara

发明人： Masami Aihara

IPC分类号： G06F11/28 ,  G06F17/50

CPC分类号： G06F17/5022

摘要： The disclosed hardware and software co-simulator can execute two simulations effectively between two simulators each for executing simulation independently, by eliminating the idle times for waiting the execution end of the opposite simulator. The co-simulator is constructed in such a way that the time data generated at which the events transferred between a fist simulator and a second simulator occur can be extracted by analyzing the simulation data; and the expected occurrence times of the events to be transferred between the simulators are previously indicated to each simulator on the basis of the event occurrence time data.

摘要翻译： 所公开的硬件和软件协同仿真器可以在两个模拟器之间有效地执行两个模拟器，用于独立地执行仿真，通过消除等待相对模拟器的执行端的空闲时间。 协同仿真器的构造方式是通过分析模拟数据来提取在第一模拟器和第二模拟器之间传送的事件所产生的时间数据; 并且根据事件发生时间数据预先向每个模拟器指示要在模拟器之间传送的事件的预期发生时间。

公开(公告)号：US5921559A

公开(公告)日：1999-07-13

申请号：US829455

申请日：1997-03-28

申请人： Masami Aihara

发明人： Masami Aihara

IPC分类号： B01J3/03 ,  C23C14/24 ,  C23C14/56 ,  C23C16/44 ,  F16J15/08 ,  H01L21/203 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065

CPC分类号： C23C16/4409 ,  F16J15/0806 ,  H01J2237/166 ,  H01J2237/32 ,  Y10S277/941

摘要： A sealing structure for an airtight chamber includes a first division member and a second division member being repeatedly joined and disjoined. The first and second chamber members are joined together to define the chamber between them and disjoined to allow access to the chamber. The structure also includes a sealing member pressed between the first and second division members to keep the chamber airtight against a pressure difference between the exterior and the interior of the chamber while the first and second division members are joined. The first and second division members are made of a material with hardness lower than that of the sealing member and are formed with a groove. The structure also includes seat members being embedded in the grooves and pressed against the sealing member while the first and second division members are joined. The seat member is made of a material harder than the division member and welded in said groove only along its contacting surfaces with the groove.

摘要翻译： 用于气密室的密封结构包括重复地接合和分离的第一分隔构件和第二分隔构件。 第一和第二室构件连接在一起以在它们之间限定室，并且被分开以允许进入室。 该结构还包括被压在第一和第二分隔构件之间的密封构件，以在第一和第二分隔构件接合的同时使腔室气密地抵抗腔室的外部和内部之间的压力差。 第一和第二分割构件由硬度低于密封构件的材料制成，并形成有凹槽。 该结构还包括嵌入槽中的座构件，并且在第一和第二分隔构件接合时被压靠在密封构件上。 座构件由比分割构件更硬的材料制成，并且仅沿着与槽的接触表面焊接在所述槽中。

公开(公告)号：US5907007A

公开(公告)日：1999-05-25

申请号：US820005

申请日：1997-03-18

申请人： Naoki Ito ,  Masanori Takemoto ,  Masami Aihara ,  Tatsushi Onishi

发明人： Naoki Ito ,  Masanori Takemoto ,  Masami Aihara ,  Tatsushi Onishi

IPC分类号： B23K35/363 ,  B23K35/36 ,  H05K3/34

CPC分类号： B23K35/3613 ,  B23K35/3618

摘要： A non-washing soldering flux which is capable of minimizing corrosion and insulation defects due to precipitation of metal salts and cracking of the base resin is disclosed. The flux includes an activator including a dibasic acid with a molecular weight of 250 or less, and a monobasic acid with a molecular weight of from 150 to 300 and/or a dibasic acid with a molecular weight of from 300 to 600. The dibasic acid of molecular weight 250 or less in the flux exhibits sufficient activity, thus ensuring satisfactory solderability. The monobasic acid of molecular weight from 150 to 300 and the dibasic acid of molecular weight from 300 to 600 which are combined therewith promote the activity while also uniformly dispersing the metal salt of the low molecular weight dibasic acid in the flux residue, allowing it to be enveloped by the hydrophobic base resin. For greater cracking resistance, the flux includes at least an acrylic resin of molecular weight 10,000 or less and an activator.

摘要翻译： 公开了一种能够最小化由于金属盐沉淀和基体树脂破裂引起的腐蚀和绝缘缺陷的非洗涤助焊剂。 助熔剂包括活化剂，其包括分子量为250以下的二元酸和分子量为150〜300的一元酸和/或分子量为300〜600的二元酸。二元酸 在助熔剂中分子量为250或更小的活性表现出足够的活性，从而确保令人满意的可焊性。 分子量为150〜300的一元酸和分子量为300〜600的二元酸与其结合可促进活性，同时还将低分子量二元酸的金属盐均匀分散在助熔剂残渣中， 被疏水性基础树脂包围。 为了更好的抗开裂性，助熔剂至少包含分子量为10,000以下的丙烯酸树脂和活化剂。

公开(公告)号：US5167729A

公开(公告)日：1992-12-01

申请号：US667409

申请日：1991-05-15

申请人： Masanori Takemoto ,  Tatsushi Onishi ,  Masami Aihara

发明人： Masanori Takemoto ,  Tatsushi Onishi ,  Masami Aihara

IPC分类号： B23K35/363 ,  B23K35/36

CPC分类号： B23K35/3613

摘要： Disclosed is a soldering flux which prevents a release of an active ion contained in an activator when exposed to a high-temperature atmosphere maintaining at a temperature higher than 80.degree. C., for example, an atmosphere of an engine room of an automobile, and thus makes washing unnecessary. This soldering flux comprises, together with an activator, (1) a thermoplastic resin having a softening point not lower than 80.degree. C., and/or (2) an epoxy group-containing compound, a radical-polymerizable unsaturated double bond-containing compound or a blocked isocyanate group-containing compound, or (3) a thermosetting resin composed of a carboxyl group-containing resin and an epoxy resin and/or a thermosetting resin containing carboxy and epoxy groups.

摘要翻译： PCT No.PCT / JP90 / 01013 Sec。 371日期1991年5月15日 102（e）日期1991年5月15日PCT提交1990年8月8日PCT公布。 出版物WO91 / 01844 日期1991年2月21日。公开了一种助焊剂，其在暴露于保持在高于80℃的温度的高温气氛中时，防止活化剂中包含的活性离子的释放，例如， 汽车的发动机室，因此不需要洗涤。 该助焊剂与活化剂一起包含（1）软化点不低于80℃的热塑性树脂和/或（2）含环氧基的化合物，可自由基聚合的不饱和双键的 化合物或封端异氰酸酯基化合物，或（3）由含羧基的树脂和环氧树脂组成的热固性树脂和/或含羧基和环氧基的热固性树脂。