公开(公告)号：US20240138066A1

公开(公告)日：2024-04-25

申请号：US18483929

申请日：2023-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Hideo NAKAGOSHI ,  Hiroki YOSHIMORI

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K2201/0379 ,  H05K2201/10507 ,  H05K2201/10977

Abstract: An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

公开(公告)号：US20230413429A1

公开(公告)日：2023-12-21

申请号：US18325149

申请日：2023-05-30

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi DEGUCHI

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K3/108 ,  H05K2203/0723 ,  H05K2203/072 ,  H05K2201/0379

Abstract: A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings formed such that each of the outer wirings has the undercut part on the side surface facing an adjacent one of the wirings is smaller than the undercut part on the side surface farther from the adjacent one of the wirings.

公开(公告)号：US20170223828A1

公开(公告)日：2017-08-03

申请号：US15014096

申请日：2016-02-03

Applicant: THE BOEING COMPANY

Inventor： Minas H. Tanielian

IPC: H05K1/09 ,  H05K3/16 ,  C25D5/54 ,  H05K3/18 ,  C23C14/34 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05K1/09 ,  C23C14/18 ,  C23C28/322 ,  C23C28/34 ,  C23C28/42 ,  C25D5/54 ,  H01B1/04 ,  H01B1/24 ,  H05K1/097 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0379

Abstract: A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

公开(公告)号：US09437535B2

公开(公告)日：2016-09-06

申请号：US14388349

申请日：2014-01-29

Applicant: PANASONIC CORPORATION

Inventor： Maki Nakamura ,  Suguru Fujita

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/66 ,  H05K3/36 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/1533 ,  H01L2924/18161 ,  H05K1/144 ,  H05K1/186 ,  H05K3/368 ,  H05K3/4614 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10234 ,  H05K2203/061

Abstract: Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.

Abstract translation: 提供了可以使其尺寸更小的无线模块。 无线模块包括：第一基板，其上安装天线; 第二基板，其与所述第一基板相对并且安装有电子部件; 以及多个电导体，其连接所述第一基板和所述第二基板，并且在所述天线和所述电子部件之间传输信号，其中，所述多个电导体以基本垂直的方式串联设置在所述第一基板和所述第二基板之间 相对于第一基板和第二基板的安装表面的方向。

公开(公告)号：US20150332997A1

公开(公告)日：2015-11-19

申请号：US14388349

申请日：2014-01-29

Applicant: PANASONIC CORPORATION

Inventor： Maki Nakamura ,  Suguru Fujita

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/1533 ,  H01L2924/18161 ,  H05K1/144 ,  H05K1/186 ,  H05K3/368 ,  H05K3/4614 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10234 ,  H05K2203/061

Abstract: Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.

Abstract translation: 提供了可以使其尺寸更小的无线模块。 无线模块包括：第一基板，其上安装天线; 第二基板，其与所述第一基板相对并且安装有电子部件; 以及多个电导体，其连接所述第一基板和所述第二基板，并且在所述天线和所述电子部件之间传输信号，其中，所述多个电导体以基本垂直的方式串联设置在所述第一基板和所述第二基板之间 相对于第一基板和第二基板的安装表面的方向。

公开(公告)号：US09183488B2

公开(公告)日：2015-11-10

申请号：US13138918

申请日：2010-04-28

Applicant: Hiroyoshi Gotou

Inventor： Hiroyoshi Gotou

IPC: G06K19/06 ,  G06K19/077 ,  H05K3/40

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet, includes: a pressing step in which an overlapped portion of an antenna coil and/or a connection pattern formed from a metal material and provided on one surface of a substrate formed from a thermoplastic resin, and a conductive member formed from a metal material and provided on the other surface of the substrate is pressed using a pressing unit at least from the surface of one side of the substrate; and a welding steps in which the overlapped portion of the antenna coil and/or the connection pattern and the conductive member is welded.

Abstract translation: 一种天线片的制造方法，其特征在于，包括：加压工序，在所述加压工序中，将由天线线圈和/或由金属材料形成的连接图案的重叠部分设置在由热塑性树脂形成的基板的一个表面上， 由金属材料形成的并且设置在基板的另一个表面上的部件至少从基板的一侧的表面使用压制单元进行加压; 以及其中焊接天线线圈和/或连接图案和导电构件的重叠部分的焊接步骤。

公开(公告)号：US20150302291A1

公开(公告)日：2015-10-22

申请号：US14753843

申请日：2015-06-29

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Hiroyoshi GOTOU

IPC: G06K19/077 ,  H05K3/40

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other.

Abstract translation: 一种天线片的制造方法。 该方法用于将天线线圈和连接图案中的至少一个连接到导电构件。 天线线圈和连接图案中的至少一个设置在基板的一个表面上，并且导电构件设置在基板的另一个表面上。 该方法包括对基板形成第一通孔进行压制处理，其中第一通孔穿过基板，并使天线线圈和连接图案中的至少一个与导电部件接触 彼此。 该方法还包括将天线线圈和连接图案中的至少一个和导电构件彼此熔化的熔化过程。

公开(公告)号：US20140338964A1

公开(公告)日：2014-11-20

申请号：US14354997

申请日：2013-08-10

Applicant: INCO INNOVATION

Inventor： Jan Berglund

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

Abstract translation: 一种动力链，包括链条，该链条包括以至少两层安装在电路板上的导电元件的链接，并且使得包括在动力链中的元件被组合移位和重叠并且彼此电接触。

公开(公告)号：US20140254124A1

公开(公告)日：2014-09-11

申请号：US13790141

申请日：2013-03-08

Applicant: Milind Raje ,  Robert Bennett ,  Andrew Mudie ,  Gary Mark Ignacio

Inventor： Milind Raje ,  Robert Bennett ,  Andrew Mudie ,  Gary Mark Ignacio

IPC: H05K5/06 ,  B23K26/20 ,  H05K13/04

CPC classification number: H05K13/0465 ,  A61N1/36032 ,  A61N1/36036 ,  A61N1/3754 ,  B23K1/06 ,  B23K20/004 ,  B23K26/21 ,  H01L2224/78301 ,  H01L2924/0002 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0379 ,  H05K2201/0979 ,  H05K2201/10318 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/107 ,  H01L2924/0001

Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

Abstract translation: 这里呈现的是用于将细长导体（例如导线或针）电连接到接合焊盘的凸起焊接技术。 多个柱形凸起结合到接合焊盘的表面上，并且细长电导体位于多个柱形凸起附近。 细长导体结合到一个或多个螺柱凸块。

公开(公告)号：US08541291B2

公开(公告)日：2013-09-24

申请号：US13159773

申请日：2011-06-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

Abstract translation: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。