公开(公告)号：US20120241832A1

公开(公告)日：2012-09-27

申请号：US13490369

申请日：2012-06-06

申请人： Mark Fischer

发明人： Mark Fischer

IPC分类号： H01L27/108

CPC分类号： H01L27/108 ,  H01L27/0207 ,  H01L27/10873

摘要： The invention includes methods for utilizing partial silicon-on-insulator (SOI) technology in combination with fin field effect transistor (finFET) technology to form transistors particularly suitable for utilization in dynamic random access memory (DRAM) arrays. The invention also includes DRAM arrays having low rates of refresh. Additionally, the invention includes semiconductor constructions containing transistors with horizontally-opposing source/drain regions and channel regions between the source/drain regions. The transistors can include gates that encircle at least three-fourths of at least portions of the channel regions, and in some aspects can include gates that encircle substantially an entirety of at least portions of the channel regions.

摘要翻译： 本发明包括与鳍式场效应晶体管（finFET）技术结合使用部分绝缘体上硅（SOI）技术的方法，以形成特别适用于动态随机存取存储器（DRAM）阵列的晶体管。 本发明还包括具有低刷新率的DRAM阵列。 另外，本发明包括含有水平相对的源极/漏极区域和在源极/漏极区域之间的沟道区域的晶体管的半导体构造。 晶体管可以包括围绕通道区域的至少部分的至少四分之三的栅极，并且在一些方面可包括围绕通道区域的至少部分的整体的栅极。

公开(公告)号：US08131580B2

公开(公告)日：2012-03-06

申请号：US11832526

申请日：2007-08-01

申请人： Kedar Doshi ,  Mark Fischer ,  Evan Chou

发明人： Kedar Doshi ,  Mark Fischer ,  Evan Chou

IPC分类号： G06Q10/00

CPC分类号： G06Q10/04 ,  G06Q10/0639 ,  G06Q30/0202

摘要： In accordance with embodiments, there are provided mechanisms and methods for selecting a synchronous or asynchronous process to determine a forecast. These mechanisms and methods for such synchronous/asynchronous process selection can enable embodiments to determine forecasts for multiple users (e.g. with hierarchical relationships, etc.) over an arbitrary time interval. The ability of embodiments to provide forecasts that involve such a large amount of data in an effective way can enable forecasting that was otherwise infeasible due to resource limitations.

摘要翻译： 根据实施例，提供了用于选择同步或异步过程以确定预测的机制和方法。 用于这种同步/异步过程选择的这些机制和方法可使得实施例能够在任意时间间隔上确定多个用户的预测（例如，具有层次关系等）。 实施例以有效的方式提供涉及这样大量数据的预测的能力可以使由于资源限制而导致的预测是不可行的。

公开(公告)号：US20110291224A1

公开(公告)日：2011-12-01

申请号：US13198581

申请日：2011-08-04

申请人： Mark Fischer ,  Stephen Russell ,  H.Montgomery Manning

发明人： Mark Fischer ,  Stephen Russell ,  H.Montgomery Manning

IPC分类号： H01L29/02

CPC分类号： H01L29/06 ,  H01L21/0338 ,  H01L21/3088

摘要： Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.

摘要翻译： 通过通过掩模处理衬底来形成集成电路的间距倍增和非间距倍数特征，例如集成电路的阵列，接口和外围区域中的特征。 通过图案化光刻胶层来形成掩模，该光致抗蚀剂层同时限定对应于集成电路的阵列，界面和外围区域中的特征的掩模元件。 将图案转移到无定形碳层。 侧壁间隔物形成在图案化无定形碳层的侧壁上。 沉积一层保护材料，然后将其图案化以暴露阵列区域中的掩模元件和界面或外围区域的选定部分。 除去阵列区域或其它暴露部分中的无定形碳，从而在阵列区域中留下包括独立的，间距倍增的间隔物的图案。 去除保护材料，在阵列区域中留下间距倍数间隔物的图案，并在界面和外围区域留下非间距倍增的掩模元件。 将图案转移到硬掩模层，通过该硬掩模层蚀刻下面的基底。

公开(公告)号：US20110121392A1

公开(公告)日：2011-05-26

申请号：US13017854

申请日：2011-01-31

申请人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

发明人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

IPC分类号： H01L27/12

CPC分类号： H01L29/785 ,  H01L29/66818 ,  H01L29/7853 ,  Y10S438/947

摘要： A process may include first etching a trench isolation dielectric through a dielectric hard mask that abuts the sidewall of a fin semiconductor. The first etch can be carried out to expose at least a portion of the sidewall, causing the dielectric hard mask to recede to a greater degree in the lateral direction than the vertical direction. The process may include second etching the fin semiconductor to achieve a thinned semiconductor fin, which has receded beneath the shadow of the laterally receded hard mask. The thinned semiconductor fin may have a characteristic dimension that can exceed photolithography limits. Electronic devices may include the thinned semiconductor fin as part of a field effect transistor.

摘要翻译： 工艺可以包括首先通过与散热片半导体的侧壁邻接的电介质硬掩模蚀刻沟槽隔离电介质。 可以执行第一蚀刻以暴露侧壁的至少一部分，使得电介质硬掩模在横向方向上比垂直方向更大程度地退回。 该方法可以包括第二蚀刻鳍式半导体以实现减薄的半导体鳍片，其已经在横向后退的硬掩模的阴影之下后退。 减薄的半导体鳍片可以具有可超过光刻极限的特征尺寸。 电子器件可以包括作为场效应晶体管的一部分的变薄的半导体鳍片。

公开(公告)号：US20110086470A1

公开(公告)日：2011-04-14

申请号：US12972232

申请日：2010-12-17

申请人： Terry McDaniel ,  James Green ,  Mark Fischer

发明人： Terry McDaniel ,  James Green ,  Mark Fischer

IPC分类号： H01L21/8229

CPC分类号： H01L27/105 ,  H01L21/823475 ,  H01L21/823871 ,  H01L27/1052 ,  H01L27/10894 ,  H01L27/10897 ,  H01L27/11531 ,  H01L29/66545

摘要： Memory devices, such as DRAM memory devices, may include one or more metal layers above a local interconnect of the DRAM memory that make contact to lower gate regions of the memory device. As the size of semiconductor components decreases and circuit densities increase, the density of the metal routing in these upper metal layers becomes increasingly difficult to fabricate. By providing additional metal routing in the lower gate regions that may be coupled to the upper metal layers, the spacing requirements of the upper metal layers may be eased, while maintaining the size of the semiconductor device. In addition, the additional metal routing formed in the gate regions of the memory devices may be disposed parallel to other metal contacts in a strapping configuration, thus reducing a resistance of the metal contacts, such as buried digit lines of a DRAM memory cell.

摘要翻译： 诸如DRAM存储器件的存储器件可以包括与存储器件的下部栅极区域接触的DRAM存储器的局部互连上方的一个或多个金属层。 随着半导体元件的尺寸减小和电路密度增加，这些上层金属层中的金属布线的密度越来越难于制造。 通过在可以耦合到上金属层的下栅极区域中提供额外的金属布线，可以在保持半导体器件的尺寸的同时，缓和上金属层的间隔要求。 此外，形成在存储器件的栅极区域中的附加金属布线可以以带状构造平行于其它金属触点设置，从而降低金属触点（例如DRAM存储器单元的掩埋数字线）的电阻。

公开(公告)号：US07880232B2

公开(公告)日：2011-02-01

申请号：US11591627

申请日：2006-11-01

申请人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

发明人： Mark Fischer ,  T. Earl Allen ,  H. Montgomery Manning

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/785 ,  H01L29/66818 ,  H01L29/7853 ,  Y10S438/947

摘要： A process may include first etching a trench isolation dielectric through a dielectric hard mask that abuts the sidewall of a fin semiconductor. The first etch can be carried out to expose at least a portion of the sidewall, causing the dielectric hard mask to recede to a greater degree in the lateral direction than the vertical direction. The process may include second etching the fin semiconductor to achieve a thinned semiconductor fin, which has receded beneath the shadow of the laterally receded hard mask. The thinned semiconductor fin may have a characteristic dimension that can exceed photolithography limits. Electronic devices may include the thinned semiconductor fin as part of a field effect transistor.

摘要翻译： 工艺可以包括首先通过与散热片半导体的侧壁邻接的电介质硬掩模蚀刻沟槽隔离电介质。 可以执行第一蚀刻以暴露侧壁的至少一部分，使得电介质硬掩模在横向方向上比垂直方向更大程度地退回。 该方法可以包括第二蚀刻鳍式半导体以实现减薄的半导体鳍片，其已经在横向后退的硬掩模的阴影之下后退。 减薄的半导体鳍片可以具有可超过光刻极限的特征尺寸。 电子器件可以包括作为场效应晶体管的一部分的变薄的半导体鳍片。

公开(公告)号：US20100148234A1

公开(公告)日：2010-06-17

申请号：US12713125

申请日：2010-02-25

申请人： Kevin J. Torek ,  Mark Fischer ,  Robert J. Hanson

发明人： Kevin J. Torek ,  Mark Fischer ,  Robert J. Hanson

IPC分类号： H01L27/06 ,  H01L29/78

CPC分类号： H01L29/7851 ,  H01L27/10808 ,  H01L27/10826 ,  H01L27/10879 ,  H01L29/66795 ,  H01L29/7853 ,  H01L29/7854

摘要： Novel etch techniques are provided for shaping silicon features below the photolithographic resolution limits. FinFET devices are defined by recessing oxide and exposing a silicon protrusion to an isotropic etch, at least in the channel region. In one implementation, the protrusion is contoured by a dry isotropic etch having excellent selectivity, using a downstream microwave plasma etch.

摘要翻译： 提供了新颖的蚀刻技术，用于在低于光刻分辨率极限的条件下成形硅特征。 FinFET器件通过凹陷氧化物和至少在沟道区域中将硅突起暴露于各向同性蚀刻来限定。 在一个实施方案中，使用下游微波等离子体蚀刻，通过具有优异选择性的干各向同性蚀刻来形成突起。

公开(公告)号：US20080086358A1

公开(公告)日：2008-04-10

申请号：US11832526

申请日：2007-08-01

申请人： Kedar Doshi ,  Mark Fischer ,  Evan Chou

发明人： Kedar Doshi ,  Mark Fischer ,  Evan Chou

IPC分类号： G06F17/30

CPC分类号： G06Q10/04 ,  G06Q10/0639 ,  G06Q30/0202

摘要： In accordance with embodiments, there are provided mechanisms and methods for selecting a synchronous or asynchronous process to determine a forecast. These mechanisms and methods for such synchronous/asynchronous process selection can enable embodiments to determine forecasts for multiple users (e.g. with hierarchical relationships, etc.) over an arbitrary time interval. The ability of embodiments to provide forecasts that involve such a large amount of data in an effective way can enable forecasting that was otherwise infeasible due to resource limitations.

摘要翻译： 根据实施例，提供了用于选择同步或异步过程以确定预测的机制和方法。 用于这种同步/异步过程选择的这些机制和方法可使得实施例能够在任意时间间隔上确定多个用户的预测（例如，具有层次关系等）。 实施例以有效的方式提供涉及这样大量数据的预测的能力可以使由于资源限制而导致的预测是不可行的。

公开(公告)号：US20050208733A1

公开(公告)日：2005-09-22

申请号：US11126102

申请日：2005-05-10

申请人： Zhiping Yin ,  Mark Fischer

发明人： Zhiping Yin ,  Mark Fischer

IPC分类号： H01L21/027 ,  H01L21/318 ,  H01L21/76

CPC分类号： H01L21/3105 ,  H01L21/0274 ,  H01L21/3185

摘要： The present invention includes a method for preventing distortion in semiconductor fabrication. The method comprises providing a substrate comprising a film comprising silicon nitride. The substrate is treated in a vacuum of about 3.0-6.5 Torr in an atmosphere comprising oxygen plasma wherein the oxygen plasma flow rate is at least about 300 sccm oxygen. A resist is applied to the treated substrate and the resist is patterned over the treated substrate.

摘要翻译： 本发明包括一种用于防止半导体制造中的变形的方法。 该方法包括提供包含含氮化硅的膜的衬底。 在包含氧等离子体的气氛中，在约3.0-6.5乇的真空中处理衬底，其中氧等离子体流速为至少约300sccm的氧气。 将抗蚀剂施加到经处理的基底上，并且将抗蚀剂图案化在经处理的基底上。

公开(公告)号：US06635530B2

公开(公告)日：2003-10-21

申请号：US09057148

申请日：1998-04-07

申请人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

发明人： Mark A. Helm ,  Mark Fischer ,  John T. Moore ,  Scott Jeffrey DeBoer

IPC分类号： H01L21336

CPC分类号： H01L29/7881 ,  H01L21/28273 ,  H01L29/511

摘要： The invention includes a method of forming a gated semiconductor assembly. A first transistor gate layer is formed over a substrate. A silicon nitride layer is formed over the first transistor gate layer. The silicon nitride layer comprises a first portion and a second portion elevationally displaced above the first portion. The first portion has less electrical resistance than the second portion and a different stoichiometric composition than the second portion. The first portion is physically against the second portion. A second transistor gate layer is formed over the silicon nitride layer.

摘要翻译： 本发明包括一种形成门控半导体组件的方法。 在衬底上形成第一晶体管栅极层。 在第一晶体管栅极层上形成氮化硅层。 氮化硅层包括第一部分和在第一部分上方向上移位的第二部分。 第一部分具有比第二部分更少的电阻和不同于第二部分的化学计量组成。 第一部分物理地抵靠第二部分。 在氮化硅层上形成第二晶体管栅极层。