公开(公告)号：US07714425B2

公开(公告)日：2010-05-11

申请号：US12233663

申请日：2008-09-19

申请人： Masahiro Yamaguchi ,  Hisashi Tanie ,  Naoto Saito

发明人： Masahiro Yamaguchi ,  Hisashi Tanie ,  Naoto Saito

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/4985 ,  H01L24/50 ,  H01L25/105 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/1023 ,  H01L2225/107

摘要： A semiconductor device includes a second semiconductor package, which includes a substrate and at least one semiconductor package. The substrate includes a terminal group formed on a surface thereof. At least one first semiconductor package is stacked on the substrate, and includes a plurality of flexible substrates, each of which includes a wiring group on a surface thereof and each of which is bending-deformable. At least one first semiconductor package includes a plurality of semiconductor elements mounted on a plurality of flexible substrates. Electric conduction through the second semiconductor package is established by connecting the wiring group on each of a plurality of flexible substrates to the terminal group on the substrate. Further, at least one terminal of the terminal group on the substrate is electrically connected to all of the plurality of semiconductor elements on at least one first semiconductor package, and at least one other terminal of the terminal group is electrically connected only to particular semiconductor elements of the plurality of semiconductor elements.

摘要翻译： 半导体器件包括第二半导体封装，其包括衬底和至少一个半导体封装。 基板包括在其表面上形成的端子组。 至少一个第一半导体封装堆叠在基板上，并且包括多个柔性基板，每个柔性基板在其表面上包括布线组，每个可弯曲变形。 至少一个第一半导体封装包括安装在多个柔性基板上的多个半导体元件。 通过将多个柔性基板中的每一个上的布线组连接到基板上的端子组来建立通过第二半导体封装的导电。 此外，衬底上的端子组的至少一个端子与至少一个第一半导体封装上的所有多个半导体元件电连接，并且端子组的至少一个其它端子仅电连接到特定的半导体元件 的多个半导体元件。

公开(公告)号：US20080150115A1

公开(公告)日：2008-06-26

申请号：US11815084

申请日：2006-04-07

申请人： Yuji Watanabe ,  Koji Hosokawa ,  Hisashi Tanie

发明人： Yuji Watanabe ,  Koji Hosokawa ,  Hisashi Tanie

IPC分类号： H01L23/488

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00

摘要： An electronic component such as a semiconductor device is provided which is capable of preventing wiring breakage in a stress concentration region of surface layer wiring lines. In a semiconductor device provided with a support ball (5), no ordinary wiring line is formed in a region (7(A)) in the vicinity of the support ball (5) and a region (7(B)) at the end of the semiconductor chip facing the support ball (5), which are the stress concentration regions of the package substrate (2). Instead, a wiring line (6(C)) is formed away from these regions or a wide wiring line is formed in these regions.

摘要翻译： 提供了能够防止表层布线的应力集中区域的布线断裂的半导体装置等电子部件。 在设置有支撑球（5）的半导体装置中，在支撑球（5）附近的区域（7（A））和末端的区域（7（B））中不形成普通的布线 的面向支撑球（5）的半导体芯片，其是封装衬底（2）的应力集中区域。 相反，布线（6（C））远离这些区域形成，或者在这些区域中形成宽布线。

公开(公告)号：US20070126095A1

公开(公告)日：2007-06-07

申请号：US11607312

申请日：2006-11-30

申请人： Hisashi Tanie

发明人： Hisashi Tanie

IPC分类号： H01L23/495

CPC分类号： H05K1/0366 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/181 ,  H05K2201/0287 ,  H05K2201/068 ,  H05K2201/10734

摘要： A semiconductor device has a semiconductor package with a semiconductor element is mounted on a mounting substrate. The mounting substrate has at least two anisotropic areas which are located at both sides of a semiconductor package mounting area in a way to sandwich it and have an anisotropic linear expansion coefficient. In the anisotropic areas, a linear expansion coefficient in a direction toward a center of the semiconductor package mounting area is larger than a linear expansion coefficient in an in-plane direction of the mounting substrate perpendicular to the direction and larger than a linear expansion coefficient of the semiconductor package mounting area in a direction toward the anisotropic areas. The semiconductor device makes it possible to reduce thermal deformation of a semiconductor package mounting area of a mounting substrate easily and at low cost.

摘要翻译： 具有半导体元件的半导体封装的半导体器件安装在安装基板上。 安装基板具有至少两个各向异性区域，其位于半导体封装安装区域的两侧，以夹持它并具有各向异性线性膨胀系数。 在各向异性区域中，朝向半导体封装安装区域的中心的方向的线膨胀系数大于垂直于方向的安装基板的面内方向的线膨胀系数，大于线膨胀系数 半导体封装安装区域朝向各向异性区域的方向。 半导体器件能够容易地且以低成本降低安装基板的半导体封装安装区域的热变形。