公开(公告)号：US20050099531A1

公开(公告)日：2005-05-12

申请号：US10705379

申请日：2003-11-10

申请人： Jichen Wu ,  Figo Hsieh

发明人： Jichen Wu ,  Figo Hsieh

IPC分类号： H04N5/225 ,  H01L27/00

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

摘要： A multiple chips image sensor module includes a first substrate; a photosensitive chip is arranged at the upper surface of the substrate; a lens holder is mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel is arranged within the lens holder and is formed with a chamber and an opening communicating the chamber; an aspheric and transparent layer placed within the chamber; a second substrate is mounted on the first substrate and is electrically connected the first substrate; and a chip located on the second surface of the second substrate.

摘要翻译： 多芯片图像传感器模块包括第一基板; 感光芯片设置在基板的上表面; 透镜架安装在第一基板的上表面上以封装感光芯片; 透镜镜筒布置在透镜保持器内并且形成有腔室和连通腔室的开口; 置于室内的非球面和透明层; 第二基板安装在第一基板上并与第一基板电连接; 以及位于所述第二基板的第二表面上的芯片。

公开(公告)号：US20050098710A1

公开(公告)日：2005-05-12

申请号：US10705378

申请日：2003-11-10

申请人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

发明人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC分类号： H01L27/00 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00

摘要： The invention provides an image sensor package including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner, each of the metal sheets have a first board and a second board positioned at different heights, the thicken of outside ends of the first board are smaller than the inside ends of the first board, a encapsulate layer encapsulated the plural metal sheets to form a upper surface and a lower surface, so that the outside ends of the first board and the second board are exposed from the encapsulate layer. The frame layer is formed around and under the substrate to form a cavity with the substrate. The photosensitive chip is positioned on upper surface of the substrate and within the cavity. The wires are electrically connecting the outside ends of the first boards to the photosensitive chip. The transparent layer placed on the frame layer to cover the photosensitive chip.

摘要翻译： 本发明提供一种图像传感器封装，其包括基板，框架层，感光芯片，多根导线和透明层。 该基板包括间隔开并交替排列的多个金属片，每个金属片具有位于不同高度的第一板和第二板，第一板的外侧端部的加厚度小于内侧 第一板的端部，封装层封装多个金属板以形成上表面和下表面，使得第一板和第二板的外端从封装层露出。 框架层形成在基底周围和下方，以与衬底形成空腔。 光敏芯片位于基板的上表面和腔内。 导线将第一板的外端电连接到感光芯片。 透明层放置在框架层上以覆盖感光芯片。

公开(公告)号：US06878917B2

公开(公告)日：2005-04-12

申请号：US10321926

申请日：2002-12-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

IPC分类号： H01L27/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

摘要翻译： 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 模制结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一板被第一成型体部分封装。 第二和第三板从第一成型体的底表面和侧表面露出。 芯片安装在腔内。 焊盘形成在芯片上。 电线将焊盘电连接到第一板的输入端。 透明层覆盖第一成型体上以封装芯片。

公开(公告)号：US20050012170A1

公开(公告)日：2005-01-20

申请号：US10621992

申请日：2003-07-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

发明人： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC分类号： H01L31/0203 ,  H01L31/0232

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut-corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

公开(公告)号：US06649834B1

公开(公告)日：2003-11-18

申请号：US10321917

申请日：2002-12-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

IPC分类号： H01L2302

CPC分类号： H01L31/0203 ,  H01L23/057 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

摘要翻译： 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 注塑结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一，第二和第三板从第一成型体的顶部，底部和侧面露出。 感光芯片安装在腔内。 接合焊盘形成在感光芯片上。 导线将接合焊盘电连接到第一板的信号输入端子。 透明层覆盖在第一成型体上以封装感光芯片。

公开(公告)号：US06638097B2

公开(公告)日：2003-10-28

申请号：US10147108

申请日：2002-05-15

申请人： Jichen Wu ,  Burton Yang

发明人： Jichen Wu ,  Burton Yang

IPC分类号： H01R1300

CPC分类号： H01R11/18 ,  H01R2201/20

摘要： A probe structure for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.

公开(公告)号：US06590269B1

公开(公告)日：2003-07-08

申请号：US10114201

申请日：2002-04-01

申请人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

发明人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

IPC分类号： H01L310203

CPC分类号： H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

摘要翻译： 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。