公开(公告)号：US20050077607A1

公开(公告)日：2005-04-14

申请号：US10683837

申请日：2003-10-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L25/065 ,  H01L23/02 ,  H01L23/34

CPC分类号： H01L23/3107 ,  H01L23/13 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

摘要翻译： 小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有多个通孔，然后将多个存储芯片安装在基板上， 可以显示从通槽的存储芯片的多个边界焊盘，并且使用电连接到基板的多根电线，最后同时使用封装多个存储芯片的胶层。 因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

公开(公告)号：US07126219B2

公开(公告)日：2006-10-24

申请号：US10683837

申请日：2003-10-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

IPC分类号： H01L23/02

CPC分类号： H01L23/3107 ,  H01L23/13 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding pads of the memory chip are exposed from through slot, the plurality of wires are electrically connected to the substrate, the glue layer is encapsulated the plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

摘要翻译： 小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有基板的多个通孔，然后将多个存储芯片安装在基板上， 使得存储芯片的多个边界焊盘从通孔露出，多条电线电连接到基板上，胶层同时封装多个存储芯片。 因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

公开(公告)号：US06878917B2

公开(公告)日：2005-04-12

申请号：US10321926

申请日：2002-12-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Worrell Tsai

IPC分类号： H01L27/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

摘要翻译： 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 模制结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一板被第一成型体部分封装。 第二和第三板从第一成型体的底表面和侧表面露出。 芯片安装在腔内。 焊盘形成在芯片上。 电线将焊盘电连接到第一板的输入端。 透明层覆盖第一成型体上以封装芯片。

公开(公告)号：US20050012025A1

公开(公告)日：2005-01-20

申请号：US10621986

申请日：2003-07-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Abnet Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Abnet Chen

IPC分类号： H01L27/00 ,  H01L31/00 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.

摘要翻译： 图像传感器包括下部和上部金属片组，密封剂，感光芯片，导线和透明层。 下金属片组包括多个下金属片和中间板，并与下金属片齐平。 上部金属片组分别包括堆叠在下部金属片上的多个上部金属片。 密封剂封装上，下金属片和中间板，上板的上表面，下片的下表面，以及从密封剂暴露的中间板的上表面和下表面，以及围绕 上部板材定义一个室。 芯片安装在中间板并位于腔室内。 电线将芯片电连接到上金属片。 透明层布置在框架层上以覆盖芯片。

公开(公告)号：US06680525B1

公开(公告)日：2004-01-20

申请号：US10340251

申请日：2003-01-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

IPC分类号： H01L2302

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

摘要翻译： 要安装到印刷电路板的图像传感器。 该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。 基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。 每个金属片具有连接到印刷电路板的第一板和第二板。 在基底下方形成槽。 集成电路布置在槽内并与衬底电连接。 芯片放在中间板上。 电线将第一板电连接到芯片。 透明层被放置在框架层上以覆盖芯片。

公开(公告)号：US06747261B1

公开(公告)日：2004-06-08

申请号：US10340333

申请日：2003-01-09

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Jack Chuang

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Jack Chuang

IPC分类号： H01L2348

CPC分类号： H01L31/0203 ,  H01L23/49861 ,  H01L27/14601 ,  H01L2224/16245

摘要： An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a second board. A chamber is defined under the substrate to accommodate the chip. Each pad is arranged between first boards. The frame layer is formed on a periphery and the bottom surface to encapsulate the chip. The bottom faces of the second boards are electrically connected to a printed circuit board. Each wire has a first terminal and a second terminal. The first terminals are electrically connected to the pads, and the second terminals are electrically connected to the first boards, respectively.

摘要翻译： 具有缩短电线的图像传感器。 图像传感器包括由矩阵状的金属板构成的基板，感光芯片，芯片上的接合焊盘，框架层，布线和布置在框架层上的透明层。 每个金属板具有第一板和第二板。 在基底下方限定一个腔室以容纳芯片。 每个垫布置在第一板之间。 框架层形成在周边和底面上以封装芯片。 第二板的底面电连接到印刷电路板。 每条线具有第一端子和第二端子。 第一端子电连接到焊盘，并且第二端子分别电连接到第一板。

公开(公告)号：US06649834B1

公开(公告)日：2003-11-18

申请号：US10321917

申请日：2002-12-16

申请人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

发明人： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen ,  Kevin Chang

IPC分类号： H01L2302

CPC分类号： H01L31/0203 ,  H01L23/057 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The injection molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first, second, and third boards are exposed from top, bottom, side surfaces of the first molded body. The photosensitive chip is mounted within the cavity. The bonding pads are formed on the photosensitive chip. The wires electrically connect the bonding pads to signal input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the photosensitive chip.

摘要翻译： 注塑图像传感器包括以矩阵形式布置的金属片，注射成型结构，感光芯片，接合焊盘，电线和透明层。 每个金属片具有第一板，第二板和第三板以形成形结构。 注塑结构体通过注射成型封装金属片，并具有第一成型体和第二成型体。 注塑结构具有U形结构并且形成有空腔。 第一，第二和第三板从第一成型体的顶部，底部和侧面露出。 感光芯片安装在腔内。 接合焊盘形成在感光芯片上。 导线将接合焊盘电连接到第一板的信号输入端子。 透明层覆盖在第一成型体上以封装感光芯片。

公开(公告)号：US5427296A

公开(公告)日：1995-06-27

申请号：US326932

申请日：1994-10-21

申请人： Bruce Chen

发明人： Bruce Chen

IPC分类号： B25C5/02 ,  B25C5/16 ,  B25C1/06 ,  B27F7/36

CPC分类号： B25C5/1696 ,  B25C5/0228

摘要： A power stapler including a cover shell, a base, a frame, a circuit board assembly, an electromagnetic valve, a magazine and tie plate assembly, an anvil, a micro-switch, a presser case assembly, a staple magazine constraint control device, an adjusting rod, and a linkage, wherein the valve block of the electromagnetic valve is controlled by the circuit board to drive the linkage causing the presser case assembly reciprocated to achieve a striking in driving a staple through the sheets of paper to be fastened; the adjusting rod is turned to move the circuit board assembly in changing the position of the micro-switch so that the binding position is adjusted.

摘要翻译： 一种动力订书机，包括盖壳，基座，框架，电路板组件，电磁阀，盒和夹板组件，砧座，微动开关，压紧壳体组件，钉仓限制控制装置， 调节杆和联动装置，其中电磁阀的阀块由电路板控制以驱动联动装置，使压紧壳体组件往复运动，以在通过要紧固的纸张驱动订书钉时实现打击; 转动调节杆以改变电路板组件以改变微动开关的位置，从而调整装订位置。

公开(公告)号：US07158850B2

公开(公告)日：2007-01-02

申请号：US10172089

申请日：2002-06-14

申请人： Chien-Fei Cheng ,  Bruce Chen ,  Yuan-Ching Lu ,  Li-Ren Lin ,  Shi-Ming Wang ,  Pei-Chen Yeh

发明人： Chien-Fei Cheng ,  Bruce Chen ,  Yuan-Ching Lu ,  Li-Ren Lin ,  Shi-Ming Wang ,  Pei-Chen Yeh

IPC分类号： G06F19/00

CPC分类号： G06Q10/06

摘要： A semiconductor fabrication enterprise includes fabrication equipment, transportable containers for work—in—process and an enterprise information system. The transportable containers have associated radio frequency tags having identification codes uniquely identifying the carriers in the fabrication process. The enterprise information system contains data corresponding to each such identification code. The identification codes are read by a radio frequency interrogation device, and the radio frequency interrogation device carries out transactions with the enterprise data system to transfer the data corresponding to the identification codes to the radio frequency interrogation device. The radio frequency tags may be adapted for read/write functionality allowing for writing data to the radio frequency tags and synchronization of radio frequency tag data and enterprise information system data.

摘要翻译： 半导体制造企业包括制造设备，在制品运输容器和企业信息系统。 可移动容器具有相关联的射频标签，其具有唯一地识别制造过程中的载体的识别码。 企业信息系统包含与每个这样的识别码对应的数据。 识别码由射频询问装置读取，射频询问装置与企业数据系统进行交易，将与识别码对应的数据传送给射频询问装置。 射频标签可以适于读/写功能，允许向射频标签写入数据，并且对射频标签数据和企业信息系统数据进行同步。