公开(公告)号：US06599485B1

公开(公告)日：2003-07-29

申请号：US09329591

申请日：1999-06-10

申请人： Yasuhiro Yamauchi ,  Kan Ogata ,  Naoki Shindo ,  Nobuhiro Hokao ,  Yoshihiko Tsuchiyama ,  Masakazu Tateishi ,  Tadatsugu Fukuzumi

发明人： Yasuhiro Yamauchi ,  Kan Ogata ,  Naoki Shindo ,  Nobuhiro Hokao ,  Yoshihiko Tsuchiyama ,  Masakazu Tateishi ,  Tadatsugu Fukuzumi

IPC分类号： B09B300

CPC分类号： A62D3/38 ,  A62D3/35 ,  A62D2101/22 ,  A62D2203/10 ,  B01D3/14 ,  B01D3/4211

摘要： The present invention provides a PCB decomposing apparatus capable of decomposing PCB efficiently. The PCB decomposing apparatus comprises a PCB extracting container for extracting PCB from a PCB-containing material with an organic solvent. A distilling tower provided on the downstream side of the PCB extracting container distills the organic solvent to separate the PCB. A primary reactor provided on the downstream side of the distilling tower includes a nozzle for supplying aqueous Na2CO3 solution and a nozzle for supplying an oxidizing agent into the container. A liquid cyclone provided on the downstream side of the primary reactor can remove Na2CO3 having a large particle size. A secondary reactor formed by a long pipe is connected to the liquid cyclone. A gas-liquid separator provided on the further downstream side of the secondary reactor can separate a gas from a solution. A film separator separates treated water into purified water and a concentrated solution, and the purified water is supplied as circulating water to the upstream side of a pressure pump.

摘要翻译： 本发明提供能够有效地分解PCB的PCB分解装置。 PCB分解装置包括用于从含有PCB的材料用有机溶剂提取PCB的PCB提取容器。 设置在PCB提取容器下游侧的蒸馏塔蒸馏有机溶剂以分离PCB。 设置在蒸馏塔的下游侧的主反应器包括用于供给Na 2 CO 3水溶液的喷嘴和用于将氧化剂供应到容器中的喷嘴。 设置在初级反应器的下游侧的液体旋风分离器可以除去大粒径的Na 2 CO 3。 由长管形成的二次反应器与液体旋风分离器连接。 设置在次级反应器的更下游侧的气液分离器可以将气体与溶液分离。 膜分离器将经处理的水分离成纯水和浓缩溶液，将纯化水作为循环水供给到压力泵的上游侧。

公开(公告)号：US5922138A

公开(公告)日：1999-07-13

申请号：US911353

申请日：1997-08-07

申请人： Naoki Shindo ,  Miyako Yamasaka ,  Yuji Kamikawa

发明人： Naoki Shindo ,  Miyako Yamasaka ,  Yuji Kamikawa

IPC分类号： B08B3/00 ,  B08B9/02 ,  C03C23/00 ,  G02F1/1333 ,  H01L21/00 ,  B08B3/04

CPC分类号： B08B9/027 ,  B08B3/00 ,  C03C23/0075 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086 ,  G02F1/1333 ,  Y10S134/902

摘要： Disclosed is a liquid treatment for an object to be processed, such as a semiconductor wafer or a glass LCD substrate, which is designed to remove any chemicals remaining in chemical supply nozzles and also improve the rinse capability and throughput. To that end, a processing liquid supply means is configured as jet nozzle pipes 40, a bottom surface 40c of each of the jet nozzle pipes 40 is inclined so as to slope downward from a chemical supply side thereof to an end portion, and the end portion is connected to a drain pipe 55 by a waste liquid orifice 40d and a drain valve 54. A chemical is supplied from nozzle orifices 40b of the jet nozzle pipes 40, the chemical is brought into contact with wafers W, and a treatment is performed thereby. Thereafter, a chemical-removing agent such as pure water or N.sub.2 is supplied through the jet nozzle pipes 40 to remove any remaining chemical from the jet nozzle pipes 40, then pure water is brought into contact with the wafers W to wash them.

公开(公告)号：US5845660A

公开(公告)日：1998-12-08

申请号：US761752

申请日：1996-12-05

申请人： Naoki Shindo ,  Yuuji Kamikawa ,  Shori Mokuo ,  Yoshio Kumagai

发明人： Naoki Shindo ,  Yuuji Kamikawa ,  Shori Mokuo ,  Yoshio Kumagai

IPC分类号： H01L21/00 ,  B08B3/10

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： A substrate washing and drying apparatus comprising a processing section for holding wafers, to which process solution to wash and vapor for drying the wafers are introduced, a supply/discharge port for introducing solution to the process section, and discharging the solution from the process section, a solution supply mechanism for selecting one from a plurality of kinds of solution, a drying vapor generation section having a heater for generation vapor for drying, a discharging solution mechanism having an opening for rapidly discharging the solution from the processing section, resistivity detecting means for detecting a resistivity value of the process solution, and a controller for controlling the supply of solution to the process section based on the resistivity value detected by the resistivity detecting means.

摘要翻译： 一种基板清洗和干燥装置，其特征在于，包括用于保持晶片的处理部，向所述处理部引入用于将所述晶片干燥的处理液和用于干燥所述晶片的蒸气，用于将所述溶液导入所述处理部的供给排出口， 用于从多种溶液中选择一种的溶液供给机构，具有用于产生干燥产生蒸气的加热器的干燥蒸汽发生部，具有用于从处理部快速排出溶液的开口的排出溶液机构，电阻率检测装置 用于检测处理溶液的电阻率值;以及控制器，用于基于由电阻率检测装置检测的电阻率值来控制对处理部分的溶液的供应。

公开(公告)号：US5823008A

公开(公告)日：1998-10-20

申请号：US647941

申请日：1996-07-19

申请人： Isao Nikai ,  Motohisa Uda ,  Naoki Shindo ,  Takeshi Fuse

发明人： Isao Nikai ,  Motohisa Uda ,  Naoki Shindo ,  Takeshi Fuse

IPC分类号： F24F5/00 ,  F25B9/00 ,  F28D9/00 ,  F28F13/12 ,  F25D9/00

CPC分类号： F24F5/0085 ,  F25B9/004 ,  F28D9/0037 ,  F28F13/12

摘要： A mobile cold air supply unit which comprises, as housed in a single casing, an air compressor-expander constituted of an integral combination of a motor, an air compressor and an air expander, an air-to-water heat exchanger and an air-to-air heat exchanger, is furnished in the casing with air tubing for interconnecting the aforesaid components at an air pressure not higher than 5 kg/cm.sup.2, and is provided with a cold air discharge connection, a return air intake connection, a cooling water outlet connection and a cooling water intake connection.

摘要翻译： PCT No.PCT / JP95 / 02031 Sec。 371日期：1996年7月19日 102（e）日期1996年7月19日PCT提交1995年10月4日PCT公布。 公开号WO96 / 11367 日期：1996年04月18日移动式冷气供给单元，其由容纳在单个壳体内的空气压缩机 - 膨胀机构成，其由电动机，空气压缩机和空气膨胀机的一体组合构成，空气 - 水热 交换器和空气 - 空气热交换器，在壳体中设置有用于在不高于5kg / cm 2的空气压力下将前述部件互连的空气管，并且设置有冷空气排放连接，回气进气口 连接，冷却水出口连接和冷却水进水连接。

公开(公告)号：US09691602B2

公开(公告)日：2017-06-27

申请号：US13546372

申请日：2012-07-11

申请人： Norihiro Ito ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya ,  Takashi Nagai

发明人： Norihiro Ito ,  Kazuhiro Aiura ,  Naoki Shindo ,  Yosuke Hachiya ,  Takashi Nagai

IPC分类号： H01L21/02 ,  H01L21/67

CPC分类号： H01L21/02041 ,  H01L21/67051 ,  H01L21/6719 ,  Y02E60/34 ,  Y10T137/0318 ,  Y10T137/598

摘要： A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.

公开(公告)号：US09190311B2

公开(公告)日：2015-11-17

申请号：US13351653

申请日：2012-01-17

申请人： Jiro Higashijima ,  Yosuke Hachiya ,  Kazuhiro Aiura ,  Norihiro Itoh ,  Naoki Shindo ,  Yuki Ito

发明人： Jiro Higashijima ,  Yosuke Hachiya ,  Kazuhiro Aiura ,  Norihiro Itoh ,  Naoki Shindo ,  Yuki Ito

IPC分类号： H01L21/687 ,  B08B3/04 ,  H01L21/67

CPC分类号： H01L21/68728 ,  B08B3/04 ,  B08B3/041 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6719 ,  H01L21/68742

摘要： Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a nozzle supporting arm that supports a nozzle. The liquid processing apparatus of the present disclosure includes: a processing chamber having a substrate holding unit configured to hold a substrate and a cup disposed around the substrate holding unit; a nozzle configured to supply a fluid to the substrate held by the substrate holding unit; and a nozzle supporting arm configured to support the nozzle. An arm cleaning unit configured to clean the nozzle supporting arm is installed in the liquid processing apparatus.

摘要翻译： 公开了一种液体处理装置和液体处理方法，其可以防止处理室中的基板由于附着到支撑喷嘴的喷嘴支撑臂上的污染而被污染。 本公开的液体处理装置包括：处理室，具有被配置为保持基板的基板保持单元和设置在基板保持单元周围的杯子; 喷嘴，被配置为将流体供给到由所述基板保持单元保持的所述基板; 以及配置成支撑喷嘴的喷嘴支撑臂。 构造成清洁喷嘴支撑臂的手臂清洁单元安装在液体处理装置中。

公开(公告)号：US08303724B2

公开(公告)日：2012-11-06

申请号：US13206186

申请日：2011-08-09

申请人： Koukichi Hiroshiro ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

发明人： Koukichi Hiroshiro ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

IPC分类号： B08B3/00

CPC分类号： H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67057

摘要： Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

摘要翻译： 公开了一种用于清洗和干燥诸如半导体晶片的衬底的衬底处理装置。 该基板处理装置包括：液体处理单元，用于通过将基板浸渍在储存的净化水中来处理基板;干燥单元，布置在液体处理单元上方并构造成干燥基板;基板输送装置，用于在液体处理 单元和干燥单元，用于将含有纯净水的蒸气或雾的挥发性有机溶剂的蒸气或雾的流体混合物供给到干燥单元的流体供给机构，以及用于控制流体混合物的供给的控制器。

公开(公告)号：US08197606B2

公开(公告)日：2012-06-12

申请号：US12707098

申请日：2010-02-17

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Hiroki Ohno ,  Kenji Sekiguchi

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Hiroki Ohno ,  Kenji Sekiguchi

IPC分类号： B08B7/02

CPC分类号： H01L21/67051 ,  B24C7/0046 ,  H01L21/02057 ,  Y10S134/902

摘要： Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

摘要翻译： 公开了一种用于防止对在基板上形成的图案的损坏的基板清洗方法。 基板清洗方法包括通过将干燥空气或惰性气体中携带的清洁微粒冲击到基板的表面上并清除清洁颗粒来清洁基板。

公开(公告)号：US20110290280A1

公开(公告)日：2011-12-01

申请号：US13206186

申请日：2011-08-09

申请人： Koukichi HIROSHIRO ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

发明人： Koukichi HIROSHIRO ,  Yuji Kamikawa ,  Takayuki Toshima ,  Naoki Shindo

IPC分类号： B08B3/00

CPC分类号： H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67057

摘要： Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

摘要翻译： 公开了一种用于清洗和干燥诸如半导体晶片的衬底的衬底处理装置。 该基板处理装置包括：液体处理单元，用于通过将基板浸渍在储存的净化水中来处理基板;干燥单元，布置在液体处理单元上方并构造成干燥基板;基板输送装置，用于在液体处理 单元和干燥单元，用于将含有纯净水的蒸气或雾的挥发性有机溶剂的蒸气或雾的流体混合物供给到干燥单元的流体供给机构，以及用于控制流体混合物的供给的控制器。

公开(公告)号：US20080308120A1

公开(公告)日：2008-12-18

申请号：US12213011

申请日：2008-06-12

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Kazuyoshi Eshima

IPC分类号： B08B3/12 ,  B08B13/00

CPC分类号： H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of reducing non-uniformity of a removal efficiency of particles between lots with a simple procedure. The substrate cleaning method comprises: a step of supplying a gas into a cleaning tank, while an irradiation of ultrasonic waves to the cleaning liquid in the cleaning tank is being stopped, so as to increase a dissolved gas concentration of the gas dissolved in the cleaning liquid in the cleaning tank to a saturated concentration; and a step of irradiating ultrasonic waves to the cleaning liquid in the cleaning tank so as to clean a substrate immersed in the cleaning liquid in the cleaning tank. In the step of increasing the dissolved gas concentration to the saturated concentration, the gas is supplied to the cleaning tank so as to increase the dissolved gas concentration of the cleaning liquid in the cleaning tank to the saturated concentration. In addition, in the step of increasing the dissolved gas concentration to the saturated concentration, the irradiation of the ultrasonic waves to the cleaning liquid in the cleaning tank is stopped.

摘要翻译： 本发明提供一种能够以简单的方法降低批次之间的颗粒去除效率的不均匀性的基板清洗方法。 基板清洗方法包括：在停止向清洗槽中的清洗液体照射超声波的同时向清洗槽供给气体的步骤，以增加溶解在清洗液中的气体的溶解气体浓度 清洗液中的液体达到饱和浓度; 以及向清洗槽内的清洗液照射超声波以清洗浸在清洗槽内的清洗液中的基板的工序。 在将溶解气体浓度提高到饱和浓度的步骤中，将气体供给至清洗槽，以将清洗槽内的清洗液的溶解气体浓度提高至饱和浓度。 此外，在将溶解气体浓度提高到饱和浓度的步骤中，超声波向清洗槽内的清洗液的照射停止。