公开(公告)号：US11956931B2

公开(公告)日：2024-04-09

申请号：US17178657

申请日：2021-02-18

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G05D23/00 ,  F28F13/00 ,  F28F27/00 ,  H05K7/20

CPC classification number: H05K7/20836 ,  F28F13/00 ,  F28F27/00 ,  H05K7/20254 ,  H05K7/2079

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.

公开(公告)号：US11953957B2

公开(公告)日：2024-04-09

申请号：US17137661

申请日：2020-12-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B19/416 ,  G06N3/04

CPC classification number: G06F1/20 ,  G05B19/416 ,  G06N3/04 ,  G05B2219/41303 ,  G05B2219/49216

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to adjust one or more flow control valves, of a liquid cooling system for a data center, to control a variation in liquid flow rate across the data center.

公开(公告)号：US11895809B2

公开(公告)日：2024-02-06

申请号：US17318865

申请日：2021-05-12

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G05B13/02 ,  H05K7/20

CPC classification number: H05K7/20836 ,  G05B13/027 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a sensor string is associated with a first fluid line having a first flow controller and with a second fluid line having a second flow controller, so that sections of such a sensor string are enabled to maintain electrical connectivity there through by a mechanical coupling of a first flow controller and a second flow controller.

公开(公告)号：US11822398B2

公开(公告)日：2023-11-21

申请号：US17107128

申请日：2020-11-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-air heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

公开(公告)号：US20230240052A1

公开(公告)日：2023-07-27

申请号：US17582568

申请日：2022-01-24

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20272 ,  H05K7/20327 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20818 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

公开(公告)号：US20230056610A1

公开(公告)日：2023-02-23

申请号：US17404098

申请日：2021-08-17

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.

公开(公告)号：US20230008636A1

公开(公告)日：2023-01-12

申请号：US17371878

申请日：2021-07-09

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: F24F11/49 ,  H05K7/20

Abstract: Systems and methods for cooling in a datacenter are disclosed. In at least one embodiment, a thermal load bank (TLB) system to test a hybrid datacenter cooling system includes one or more thermal features to generate heat within a TLB system and includes one or more hybrid cooling features to provide air and liquid cooling responses to such heat generated by one or more thermal features.

公开(公告)号：US20220369519A1

公开(公告)日：2022-11-17

申请号：US17318790

申请日：2021-05-12

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14 ,  G06N10/00 ,  G06N3/02

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant-to-refrigerant heat exchanger (R2RHX) interfaces between a first refrigerant cooling loop and a second refrigerant cooling loop to enable transfer of heat from a cold plate of a first refrigerant cooling loop to a second refrigerant cooling loop using a first condenser unit, and so that a second refrigerant cooling loop enables dissipation of heat to an ambient environment from a second condenser unit.

公开(公告)号：US20220361375A1

公开(公告)日：2022-11-10

申请号：US17307762

申请日：2021-05-04

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Configurations for cooling systems are disclosed. In at least one embodiment, one or more distribution manifolds are formed within at least one panel of a server unit housing to receive a liquid and direct the liquid to one or more outlets, the one or more outlets to couple to one or more cold plates.

公开(公告)号：US20220346265A1

公开(公告)日：2022-10-27

申请号：US17237802

申请日：2021-04-22

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/26 ,  H05K7/14 ,  H01M8/04089 ,  H01M8/04119

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, a power delivery system includes one or more fuel cells to provide a source of electrical power for a datacenter, where waste heat produced by a fuel cell is to be captured and provided to an absorption chiller to produce a cooled liquid for use in a cooling system for this datacenter.