DISPLAY DEVICE AND PREPARATION METHOD THEREFOR

    公开(公告)号:US20240339459A1

    公开(公告)日:2024-10-10

    申请号:US18580211

    申请日:2023-02-20

    IPC分类号: H01L27/12

    摘要: A display device and a manufacturing method therefor are provided by the present application. The display devices can greatly increase the bonding precision of the chip packaging unit and the display panel, thereby the quantity of the output channels of chip packaging unit are greatly increased, thus the requirements of the high-resolution display products are satisfied. A chip packaging component is formed, wherein the chip packaging component includes at least one chip packaging unit; and the chip packaging unit includes at least a flexible base, a rigid base disposed at one side of the flexible base, and a lead layer disposed at one side of the flexible base away from the rigid base, lead layer includes at least a plurality of first leads, and orthographic projections of the plurality of first leads on the flexible base are located within an orthographic projection of rigid base on the flexible base.