Composite pane with electrical contact-making means

    公开(公告)号:US10348011B2

    公开(公告)日:2019-07-09

    申请号:US14416056

    申请日:2013-06-28

    Abstract: A composite pane with electrical contact-making means is described, having: a first pane and a second pane, which panes are connected to one another over their surface by means of a thermoplastic intermediate layer, at least one electrically conductive coating at least on the inner surface of the first pane, at least one busbar on a region of the electrically conductive coating, and at least one electrically conductive contact strip on at least one region of the busbar, wherein the contact strip is connected to at least one electrical feed line, and at least one region of the contact strip is in direct contact with the busbar.

    Disk having an electric connecting element and compensator plates
    35.
    发明授权
    Disk having an electric connecting element and compensator plates 有权
    磁盘具有电连接元件和补偿板

    公开(公告)号:US09572200B2

    公开(公告)日:2017-02-14

    申请号:US14439652

    申请日:2013-07-18

    CPC classification number: H05B3/84 H05B3/06 H05B2203/016

    Abstract: A disk with at least one connecting element having compensator plates, including; a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one compensator plate on at least one partial region of the conductive structure, at least one electric connecting element on at least one partial region of the at least one compensator plate, a lead-free soldering mass which connects the compensator plate via at least one contact surface including; one partial region of the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the compensator plate is less than 5×10−6/° C. and wherein the connecting element comprises copper.

    Abstract translation: 具有至少一个具有补偿板的连接元件的盘,包括: 衬底,其在所述衬底的至少一个部分区域上具有导电结构,在所述导电结构的至少一个部分区域上的至少一个补偿板,所述至少一个的至少一个部分区域上的至少一个电连接元件 补偿板,通过至少一个接触表面连接补偿板的无铅焊料,包括: 所述导电结构的一个部分区域,其中所述基板和所述补偿板的热膨胀系数的差小于5×10 -6 /℃,并且其中所述连接元件包括铜。

Patent Agency Ranking