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    PANE WITH ELECTRICAL CONNECTION ELEMENT AND CONNECTION BRIDGE
    4.
    发明申请
    PANE WITH ELECTRICAL CONNECTION ELEMENT AND CONNECTION BRIDGE 有权
    带电气连接元件和连接桥的面板

    公开(公告)号：US20150296615A1

    公开(公告)日：2015-10-15

    申请号：US14439852

    申请日：2013-07-16

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Klaus Schmalbuch ,  Bernhard Reul ,  Mitja Rateiczak ,  Lothar Lesmeister

    IPC: H05K1/09 ,  H05K1/11 ,  H05K1/03 ,  H05B3/84 ,  H01Q1/12

    CPC classification number: H05K1/09 ,  H01Q1/1271 ,  H01Q1/1278 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0306 ,  H05K1/11

    Abstract: A disk with at least one connecting element having a connecting bridge, including; a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one electric connecting element on at least one partial region of the electrically conductive structure, a connecting bridge on at least one partial region of the connecting element and a lead-free solder mass that connects the electric connecting element in at least one partial region with the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the connecting element is less than 5×10−6/° C., wherein the connecting bridge is formed in a massive manner and contains copper and wherein the material compositions of the connecting element and the connecting bridge differ.

    Abstract translation: 具有至少一个具有连接桥的连接元件的盘，包括： 在衬底的至少一个部分区域上具有导电结构的衬底，在导电结构的至少一个部分区域上的至少一个电连接元件，连接元件的至少一个部分区域上的连接桥和 将至少一个部分区域中的电连接元件与导电结构连接的无铅焊料质量，其中基板和连接元件的热膨胀系数之差小于5×10-6 /℃。 其中，所述连接桥形成为大块状并且包含铜，并且其中所述连接元件和所述连接桥的材料组成不同。

    Disc having at least two electrical connection elements and connecting conductors
    5.
    发明授权
    Disc having at least two electrical connection elements and connecting conductors 有权

    公开(公告)号：US10609768B2

    公开(公告)日：2020-03-31

    申请号：US15031712

    申请日：2014-10-07

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch ,  Bernd Stelling

    IPC: H05B1/02 ,  H05B3/84 ,  H05B3/20

    Abstract: A pane having at least two connection elements and one connecting conductor is described. The pane comprising a substrate with an electrically conductive structure on at least one subregion of the substrate, at least two electrical connection elements on at least one subregion of the electrically conductive structure, at least one contact area on the bottom of each connection element, a solder compound, which connects the contact areas of the electrical connection elements in at least one subregion to the electrically conductive structure, and a connecting conductor, which electrically conductively connects the connection elements to one another, wherein the contact areas of adjacent connection elements, which contact areas are closest to one another, are at a distance of at least 70 mm.

    PANE HAVING AN ELECTRICAL CONNECTION ELEMENT
    9.
    发明申请
    PANE HAVING AN ELECTRICAL CONNECTION ELEMENT 有权
    具有电气连接元件的面板

    公开(公告)号：US20150236438A1

    公开(公告)日：2015-08-20

    申请号：US14421993

    申请日：2013-07-24

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: H01R13/02 ,  B23K1/00 ,  B23K1/20 ,  H01R43/02

    CPC classification number: H01R13/02 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/26 ,  H01R43/02 ,  H01R43/0235 ,  H05B3/06 ,  H05B3/84 ,  Y10T29/49169

    Abstract: A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.

    Abstract translation: 具有连接元件的窗格，具有： 在所述基板的至少一个子区域上具有导电结构的基板，所述导电结构的至少一个子区域上的所述电连接元件以及将所述电连接元件连接到所述导电结构的无铅焊接化合物 至少一个子区域，其中无铅焊料化合物含有58至62重量％的铟，35至38重量％的锡，1至3.5重量％的银和0.5至2重量％的铜。

    Pane having an electrical connection element
    10.
    发明授权
    Pane having an electrical connection element 有权

    公开(公告)号：US11456546B2

    公开(公告)日：2022-09-27

    申请号：US16428236

    申请日：2019-05-31

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

    IPC: H01R4/62 ,  H05B3/84 ,  H01R4/02

    Abstract: A pane, includes a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of the at least one electrical connection element on the solder material, wherein the at least two soldering points form at least one contact surface between the at least one electrical connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.

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