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    OPTOELECTRONIC DEVICE
    31.
    发明申请
    OPTOELECTRONIC DEVICE 有权

    公开(公告)号：US20210135069A1

    公开(公告)日：2021-05-06

    申请号：US17071603

    申请日：2020-10-15

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

    IPC: H01L33/54 ,  H01L33/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

    ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP PROVIDED WITH AN OPTICAL CABLE
    32.
    发明申请
    ELECTRONIC DEVICE COMPRISING AN ELECTRONIC CHIP PROVIDED WITH AN OPTICAL CABLE 审中-公开

    公开(公告)号：US20200174206A1

    公开(公告)日：2020-06-04

    申请号：US16701355

    申请日：2019-12-03

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Florian PERMINJAT ,  Romain COFFY ,  Jean-Michel RIVIERE

    IPC: G02B6/43 ,  H05K1/02

    Abstract: A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.

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