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    PROCESS MONITOR FOR WAFER THINNING
    31.
    发明申请
    PROCESS MONITOR FOR WAFER THINNING 有权

    公开(公告)号：US20210296138A1

    公开(公告)日：2021-09-23

    申请号：US17340944

    申请日：2021-06-07

    Applicant: Synaptics Incorporated

    Inventor： Stephen L. MOREIN

    IPC: H01L21/321 ,  H01L21/66 ,  B24B49/10 ,  H01L21/683

    Abstract: A system and method for thinning an integrated circuit (IC) wafer. The system includes a support structure to hold the IC wafer and a mechanism to operate on the IC wafer. The support structure includes one or more inductive coils configured to transmit a power signal to the IC wafer and receive a feedback signal from the IC wafer. The system further includes a process controller to control the operation based at least in part on the feedback signal received from the IC wafer.

    INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-DIE INTEGRATION
    32.
    发明申请
    INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-DIE INTEGRATION 审中-公开

    公开(公告)号：US20200075566A1

    公开(公告)日：2020-03-05

    申请号：US16119137

    申请日：2018-08-31

    Applicant: Synaptics Incorporated

    Inventor： Stephen L. MOREIN

    IPC: H01L25/18 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L23/538 ,  H01L23/48

    Abstract: A method for manufacturing an integrated circuit (IC) device. A first IC wafer is diced to obtain a first superdie including a plurality of first die. A second IC wafer is diced to obtain a second superdie including a plurality of second die. The first superdie and the second superdie are placed on an interposer substrate to form at least part of a composite IC wafer, wherein each of the first die is aligned with a respective one of the second die in the composite IC wafer. The composite IC wafer is diced to obtain a plurality of IC devices, where each of the IC devices includes a respective one of the first die and the second die with which it is aligned.

    ARRANGEMENT OF SENSOR PADS AND DISPLAY DRIVER PADS FOR INPUT DEVICE
    34.
    发明申请
    ARRANGEMENT OF SENSOR PADS AND DISPLAY DRIVER PADS FOR INPUT DEVICE 有权
    输入装置的传感器布置和显示驱动器垫的布置

    公开(公告)号：US20170003792A1

    公开(公告)日：2017-01-05

    申请号：US14788596

    申请日：2015-06-30

    Applicant: SYNAPTICS INCORPORATED

    Inventor： Damien BERGET ,  Joseph Kurth REYNOLDS ,  Stephen L. MOREIN

    IPC: G06F3/041 ,  G06F3/044

    CPC classification number: G06F3/0416 ,  G06F3/0412 ,  G06F3/044

    Abstract: The disclosure generally describes input devices with associated processing system configured to perform display updating and capacitive sensing. The processing system includes first and second pluralities of display driver pads coupled with a plurality of source lines, and a plurality of sensor pads disposed between the first and second pluralities of display driver pads and coupled with a plurality of sensor electrodes through a plurality of conductive routing traces. The plurality of sensor electrodes includes at least one common electrode of a display device, the common electrode configured to be driven for display updating and capacitive sensing. The processing system is configured to drive the plurality of source lines for display updating, and to drive the plurality of sensor electrodes for capacitive sensing.

    Abstract translation: 本公开一般地描述具有被配置为执行显示更新和电容感测的相关处理系统的输入设备。 处理系统包括与多个源极线耦合的第一和第二多个显示驱动器焊盘以及设置在第一和第二多个显示驱动器焊盘之间的多个传感器焊盘，并且通过多个导电的多个传感器电极 路由跟踪 多个传感器电极包括显示装置的至少一个公共电极，该公共电极被配置为被驱动以进行显示更新和电容感测。 处理系统被配置为驱动多个源极线用于显示更新，并且驱动用于电容感测的多个传感器电极。

    REGULAR VIA PATTERN FOR SENSOR-BASED INPUT DEVICE
    35.
    发明申请
    REGULAR VIA PATTERN FOR SENSOR-BASED INPUT DEVICE 有权
    通过基于传感器的输入设备的图案

    公开(公告)号：US20170003791A1

    公开(公告)日：2017-01-05

    申请号：US14788575

    申请日：2015-06-30

    Applicant: SYNAPTICS INCORPORATED

    Inventor： Damien BERGET ,  Joseph Kurth REYNOLDS ,  Stephen L. MOREIN

    IPC: G06F3/041 ,  G06F3/044

    CPC classification number: G06F3/0416 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04111

    Abstract: This disclosure generally describes an input device, a display device having an integrated capacitive sensing device, and an assembly for an input device. The input device comprises a plurality of sensor electrodes disposed in a first layer, and a processing system configured to detect presence of input objects in a sensing region defined proximate to the plurality of sensor electrodes. The input device further comprises a plurality of routing traces disposed in a second layer and coupled with the processing system, and a plurality of vias arranged in a regular pattern within an areal extent of the sensing region, wherein at least a portion of the plurality of vias couple the plurality of sensor electrodes with the plurality of routing traces.

    Abstract translation: 本公开总体上描述了输入设备，具有集成电容感测设备的显示设备和用于输入设备的组件。 所述输入装置包括布置在第一层中的多个传感器电极以及被配置为检测在靠近所述多个传感器电极定义的感测区域中输入物体的存在的处理系统。 所述输入装置还包括设置在第二层中并与所述处理系统耦合的多个路由迹线，以及以规则图案布置在所述感测区域的区域范围内的多个通孔，其中所述多个 通孔将多个传感器电极与多个路由迹线耦合。

    POINT TO POINT INTERFACE COMMUNICATION AND REFERENCE
    37.
    发明申请
    POINT TO POINT INTERFACE COMMUNICATION AND REFERENCE 有权
    要点接口通信和参考

    公开(公告)号：US20160195977A1

    公开(公告)日：2016-07-07

    申请号：US14788636

    申请日：2015-06-30

    Applicant: SYNAPTICS INCORPORATED

    Inventor： Joseph Kurth REYNOLDS ,  Stephen L. MOREIN ,  Jeffrey LUKANC

    IPC: G06F3/041 ,  G06F3/044

    CPC classification number: G06F3/0416 ,  G06F3/03547 ,  G06F3/044 ,  G06F2203/04108

    Abstract: This disclosure generally provides a processing system that includes a first controller coupled with a second controller via a first communication link. The first controller is configured to transmit display data to the second controller via the first communication link. The second controller is configured to drive, using the display data, one or more coupled display electrodes for performing display updating. The second controller is further configured to operate one or more coupled sensor electrodes to acquire capacitive sensing data, and to transmit the capacitive sensing data to the first controller via the first communication link.

    Abstract translation: 本公开通常提供一种处理系统，其包括经由第一通信链路与第二控制器耦合的第一控制器。 第一控制器被配置为经由第一通信链路将显示数据发送到第二控制器。 第二控制器被配置为使用显示数据来驱动用于执行显示更新的一个或多个耦合的显示电极。 第二控制器还被配置为操作一个或多个耦合的传感器电极以获取电容感测数据，并且经由第一通信链路将电容性感测数据发送到第一控制器。

    COMBINING SENSOR ELECTRODES IN A MATRIX SENSOR
    38.
    发明申请
    COMBINING SENSOR ELECTRODES IN A MATRIX SENSOR 有权
    在基体传感器中组合传感器电极

    公开(公告)号：US20160092000A1

    公开(公告)日：2016-03-31

    申请号：US14502905

    申请日：2014-09-30

    Applicant: Synaptics Incorporated

    Inventor： Stephen L. MOREIN ,  Jeffrey A. SMALL ,  Christopher A. LUDDEN ,  Joseph Kurth REYNOLDS

    IPC: G06F3/044 ,  G06F3/041

    CPC classification number: G06F3/044 ,  G06F3/0412 ,  G06F3/0416

    Abstract: A display device having a capacitive sensing device, a processing system, and a method are provided for detecting presence of an input object using a capacitive sensing device having a plurality of sensor electrodes arranged in a matrix. The described technique programmatically combines multiple sensor electrodes into a larger sensor electrode for absolute capacitive sensing. The sets of sensor electrodes that are combined may be selectively coupled based a window size and a step size associated with a number of sensor electrodes in common between the sets.

    Abstract translation: 提供一种具有电容感测装置，处理系统和方法的显示装置，用于使用具有以矩阵布置的多个传感器电极的电容感测装置来检测输入对象的存在。 所描述的技术通过编程方式将多个传感器电极组合成用于绝对电容感测的较大传感器电极。 组合的传感器电极组可以基于与组之间共同的多个传感器电极相关联的窗口尺寸和步长来选择性地耦合。

    MATRIX SENSOR FOR IMAGE TOUCH SENSING
    39.
    发明申请
    MATRIX SENSOR FOR IMAGE TOUCH SENSING 有权
    MATRIX传感器用于图像触摸感应

    公开(公告)号：US20150286330A1

    公开(公告)日：2015-10-08

    申请号：US14747405

    申请日：2015-06-23

    Applicant: SYNAPTICS INCORPORATED

    Inventor： Petr SHEPELEV ,  Christopher A. LUDDEN ,  Jeffrey LUKANC ,  Stephen L. MOREIN ,  Greg P. SEMERARO ,  Joseph Kurth REYNOLDS

    IPC: G06F3/041 ,  G06F3/044

    CPC classification number: G06F3/0418 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04101 ,  G06F2203/04104 ,  G06F2203/04106 ,  G06F2203/04107 ,  G06F2203/04111 ,  G06F2203/04112

    Abstract: Embodiments described herein include an input device, a display device having a capacitive sensing device, a processing system and a method for detecting presence of an input object using a capacitive sensing device. In one embodiment, an input device includes a plurality of sensor electrodes arranged in a planar matrix array. Each sensor electrode is coupled to unique routing trace and has an identical geometric plan form that is symmetrical about a center of area of the sensor electrode. The geometric plan form of each sensor electrode includes core and a plurality of protrusions extending outward from the core. The protrusions are configured to overlap with protrusions extending outward from each adjacent sensor electrode of the matrix array.

    Abstract translation: 本文描述的实施例包括输入装置，具有电容感测装置的显示装置，处理系统和用于使用电容感测装置检测输入对象的存在的方法。 在一个实施例中，输入装置包括以平面矩阵阵列排列的多个传感器电极。 每个传感器电极耦合到独特的路线迹线，并且具有与传感器电极的面积中心对称的相同的几何平面形式。 每个传感器电极的几何平面形式包括芯和从芯部向外延伸的多个突起。 这些突起构造成与从矩阵阵列的每个相邻传感器电极向外延伸的突起重叠。

    THROUGH SILICON VIAS FOR BACKSIDE CONNECTION
    40.
    发明申请
    THROUGH SILICON VIAS FOR BACKSIDE CONNECTION 审中-公开
    用于背面连接的硅胶

    公开(公告)号：US20150286318A1

    公开(公告)日：2015-10-08

    申请号：US14675671

    申请日：2015-03-31

    Applicant: Synaptics Incorporated

    Inventor： Stephen L. MOREIN ,  Joseph Kurth REYNOLDS

    IPC: G06F3/044 ,  H01L23/48 ,  H01L21/311 ,  H01L21/768 ,  H01L21/304

    CPC classification number: G06F3/044 ,  G06F2203/04101 ,  G06F2203/04103 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In an example, a method of processing an integrated circuit (IC) die including active circuitry formed on a substrate and a front side having a plurality of metal layers formed on the substrate. The method includes forming vias in a substrate of the IC die using a laser configured to drill the vias from the front side of the IC die. The method includes forming metal contacts on first metal pads, and metal interconnects between second metal pads and the vias, using an single electroplating process, where the first metal pads and the second metal pads are exposed parts of a top layer of the plurality of metal layers, and where the metal interconnects at least partially fill the vias. The method includes thinning the substrate of the IC die to expose the metal interconnects in the vias at a back side of the IC die opposite the front side.

    Abstract translation: 在一个示例中，一种处理集成电路（IC）裸片的方法，该集成电路（IC）芯片包括形成在衬底上的有源电路和在衬底上形成有多个金属层的正面。 该方法包括使用配置为从IC芯片的前侧钻通孔的激光器在IC芯片的基板中形成通孔。 该方法包括使用单个电镀工艺在第一金属焊盘上形成金属触点，以及在第二金属焊盘和通孔之间的金属互连，其中第一金属焊盘和第二金属焊盘是多个金属的顶层的暴露部分 并且金属互连至少部分地填充通孔的位置。 该方法包括使IC芯片的基板变薄，以暴露在与前侧相对的IC芯片背面的通路中的金属互连。

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