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公开(公告)号:US20230175709A1
公开(公告)日:2023-06-08
申请号:US17950767
申请日:2022-09-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM , Jinwoo HONG , Sungwoo KIM , Jinbaek KIM , Hyojin KIM , Jaehyoung SIM , Seonghyun YOON , Sungjune CHO
IPC: F24F1/0018 , F24F1/0059
CPC classification number: F24F1/0018 , F24F1/0059
Abstract: An air conditioner including: a housing communicating with a space in which a window covering is installed, and including a suction port through which air is suctioned from the space and a discharge port through which air is discharged into an indoor area; a heat exchanger configured to exchange heat with the air suctioned through the suction port; a blower fan allowing air to be suctioned through the suction port or allowing air to be discharged through the discharge port; and a guide panel provided at the suction port to guide the window covering to prevent the window covering from covering the suction port.
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公开(公告)号:US20220164923A1
公开(公告)日:2022-05-26
申请号:US17221105
申请日:2021-04-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunseung LEE , Donghyun KIM , Youngsu MOON , Seungho PARK , Younghoon JEONG
Abstract: An electronic apparatus is disclosed. The electronic apparatus includes a memory configured to store a plurality of neural network models, and a processor connected to the memory and control the electronic apparatus in which the processor is configured to obtain a weight map based on an object area included in an input image, and obtain a plurality of images by inputting the input image to each of the plurality of neural network models, and obtain an output image by weighting the plurality of images based on the weight map, and each of the plurality of neural network models is a model trained to upscale an image.
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公开(公告)号:US20220139900A1
公开(公告)日:2022-05-05
申请号:US17329669
申请日:2021-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: In-Wook OH , Byungyun KANG , Donghyun KIM , Hyungjune KIM , Jaebong JUNG
IPC: H01L27/02 , H01L27/092 , H01L23/48 , H01L23/528 , H01L29/78 , H01L29/08 , H01L29/06 , H01L29/423 , H01L29/786 , H01L21/8238
Abstract: Disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. The first through via is electrically connected to the dummy line. The power delivery network includes a plurality of lower lines and a pad line below the lower lines. The pad line is electrically connected through the lower lines to the first through via.
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公开(公告)号:US20220011048A1
公开(公告)日:2022-01-13
申请号:US17309297
申请日:2019-12-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junkyu JUNG , Donghyun KIM , Kangtae SEO , Yonghwa CHOI
Abstract: A heat exchanger is provided. The heat exchanger comprises: a first header comprising a first globe and a second globe; a second header disposed in parallel with the first header; a tube assembly comprising multiple first tubes for connecting the first header and the second header and causing a refrigerant introduced from the first globe to flow in a first direction toward the position of the second header, and multiple second tubes disposed continuously with the multiple first tubes so as to cause a refrigerant introduced from the second header to flow in a second direction that is opposite to the first direction; and multiple heat exchange-fins individually having multiple insertion portions, into which the multiple first tubes and the multiple second tubes are inserted, respectively, and heat exchange surfaces disposed between the multiple insertion portions. The first heat-exchange fin, which is adjacent to the first header among the multiple heat exchange fins, has a heat-exchange surface including a first surface having a louver formed thereon, and a second surface formed to be flat and adjacent to insertion portions into which multiple second tubes are inserted. The second heat-exchange fin, which is adjacent to the second header, has a heat-exchange surface including a first surface.
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35.
公开(公告)号:US20200304704A1
公开(公告)日:2020-09-24
申请号:US16896651
申请日:2020-06-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wooyong LEE , Kyungyul SEO , Jonghun WON , Changhoon KANG , Donghyun KIM , Sungeun KIM , Daehyun SUNG
Abstract: An electronic device is provided. The electronic device includes at least one processor configured to obtain a plurality of first images as per a first frame rate using the camera based on a signal related to image recording and control the camera to perform focusing of a lens included in the camera on at least one of one or more objects in the plurality of first images while obtaining the plurality of first images, provide a first portion of the plurality of first images as a preview through the display, control the camera to lock the focusing on the at least one object, identify a designated event for slow motion recoding while obtaining the plurality of first images, based at least in part on the designated event, obtain a plurality of second images as per a second frame rate higher than the first frame rate using the camera focusing-locked on the at least one object, and provide a video related to the at least one object using a second portion of the plurality of first images and at least one of the plurality of second images.
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公开(公告)号:US20170125471A1
公开(公告)日:2017-05-04
申请号:US15333382
申请日:2016-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM , Doowon KWON
IPC: H01L27/146
CPC classification number: H01L27/14634 , H01L27/14621 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/1469
Abstract: A stack-type semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower interconnection on the lower substrate, a lower pad on the lower interconnection, and a lower interlayer insulating layer covering side surfaces of the lower interconnection and the lower pad. The upper device includes an upper substrate, an upper interconnection under the upper substrate, an upper pad under the upper interconnection, and an upper interlayer insulating layer covering side surfaces of the upper interconnection and the upper pad. Each of the pads has a thick portion and a thin portion. The thin portions of the pads are bonded to each other, the thick portion of the lower pad contacts the bottom of the upper interlayer insulating layer, and the thick portion of the upper pad contacts the top of the lower interlayer insulating layer.
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37.
公开(公告)号:US20160014719A1
公开(公告)日:2016-01-14
申请号:US14860351
申请日:2015-09-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donghyun KIM
CPC classification number: H04M1/0268 , G06F1/1626 , G06F1/165 , G06F1/1652 , G06F1/1694 , G09G3/2092 , G09G5/14 , H01H2219/039 , H04M1/0281 , H04M1/22 , H04M1/57 , H04M3/42042 , H04M19/04 , H04M2201/38 , H04M2250/12 , H04W4/12 , H04W68/00 , H04W68/02
Abstract: A portable terminal is provided having a front surface and a curved side surface in which the portable terminal is operated in a general mode in which an application is displayed on a main display area of the front surface, and in response to the occurrence of the event while in the general mode, the display is controlled to display event information related to the event on an auxiliary display area of the curved side surface and display the application on the main display area.
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公开(公告)号:US20240266740A1
公开(公告)日:2024-08-08
申请号:US18640585
申请日:2024-04-19
Applicant: Samsung Electronics Co., Ltd. , INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY
Inventor: Yongsik NAM , Taehyun WOO , Youngjoong YOON , Donghyun KIM , Chanyeong PARK , Myeounghyeoun DO , Taegyeong HAN
CPC classification number: H01Q7/00 , H01Q1/2291 , H01Q1/273 , H01Q5/25
Abstract: A wearable electronic device is provided. The wearable electronic device includes a housing, a printed circuit board disposed inside the housing and including wireless communication circuitry and a ground part, and an antenna disposed inside the housing and electrically connected to the wireless communication circuitry, wherein the antenna includes a conductive pattern, a feeding member electrically connected to the wireless communication circuitry through a feeding point and configured to electrically connect a first point of the conductive pattern and a first point of the ground part, a short-circuit member configured to electrically connect a second point of the conductive pattern and a second point of the ground part, and a capacitive loading member disposed between the feeding member and the short-circuit member having a first part operatively coupled to a third point of the conductive pattern and a second part electrically connected to a third point of the ground part.
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公开(公告)号:US20240247835A1
公开(公告)日:2024-07-25
申请号:US18627106
申请日:2024-04-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Donghyun KIM , Jinwoo HONG , Gahyun KIM , Sungwoo KIM , Joonho YOON , Mingu JEON , Mingi CHO
IPC: F24F13/20 , F24F1/0047
CPC classification number: F24F13/20 , F24F1/0047
Abstract: Disclosed herein is a ceiling-type air conditioner including: an upper housing having a cylindrical shape, a heat exchanger having in an annular shape and disposed inside the upper housing, a blowing fan disposed on the inside of the heat exchanger and configured to draw in air and heat exchange the drawn-in air with the heat exchanger. In addition, the ceiling-type air conditioner may include a lower housing including an outlet disposed on a radially outer side of the heat exchanger and configured to discharge the heat exchanged air to the outside of the upper housing and having an annular shape and an inlet panel through which external air is drawn in by the blowing fan, the lower housing movable in a vertical direction between a first position and a second position different from the first position, and a middle housing disposed between the upper housing and the lower housing and including a plurality of discharge holes disposed outside the outlet in a radial direction of the lower housing, wherein the lower housing is configured to open the outlet when placed in the first position, and to close the outlet when placed in the second position, so that the air heat exchanged with the heat exchanger is discharged through the plurality of discharge holes.
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公开(公告)号:US20240234492A1
公开(公告)日:2024-07-11
申请号:US18407040
申请日:2024-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haeryong KIM , Jinho LEE , Donghyun KIM , Beomseok KIM , Cheheung KIM , Jooho LEE
IPC: H01L29/06 , H01L27/06 , H01L29/423 , H10B12/00
CPC classification number: H01L29/0607 , H01L27/0629 , H01L28/65 , H01L28/75 , H01L29/4236 , H10B12/30
Abstract: Provided are a capacitor and an electronic device including the same. The capacitor includes a first electrode layer, a second electrode layer, a dielectric layer disposed between the first electrode layer and the second electrode layer, and an interlayer disposed between the first electrode layer and the dielectric layer. The interlayer includes a first interface material, the first interface material includes at least one Group 13 element, and the at least one Group 13 element is not aluminum (Al).
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