公开(公告)号：US20220190223A1

公开(公告)日：2022-06-16

申请号：US17506359

申请日：2021-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Joonyong PARK ,  Seogwoo HONG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/00 ,  H01L33/46

Abstract: A display apparatus and a method of manufacturing the display method are provided. The display apparatus includes a transfer substrate, and micro display elements spaced apart from each other in units of sub-pixels on the transfer substrate, wherein each of the micro display elements includes a micro light emitting unit and a drive unit, wherein the drive unit includes drive electrodes and drives the micro light emitting unit.

公开(公告)号：US20220189931A1

公开(公告)日：2022-06-16

申请号：US17483103

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Seogwoo HONG ,  Kyungwook HWANG

IPC: H01L25/075 ,  H01L33/20 ,  H01L33/00 ,  H01L33/62 ,  H01L33/50

Abstract: A display transferring structure includes a transfer substrate including a plurality of recesses, each of the plurality of recesses including a first trap having a space in which a predetermined object can be moved and a second trap connected to the first trap and having a shape and size in which the object can be seated; and a micro-semiconductor chip positioned in the second trap. The micro-semiconductor chip may be self-aligned in a correct position by the display transferring structure.

公开(公告)号：US20220139887A1

公开(公告)日：2022-05-05

申请号：US17399683

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Joonyong PARK ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a micro-light-emitting diode (LED) array includes: providing a first substrate including a plurality of circular grooves formed on a first surface thereof; supplying a plurality of micro-LEDs onto the first surface of the first substrate; and aligning the plurality of micro-LEDs with the plurality of circular grooves, wherein at least two electrodes are formed on a second surface of each of the plurality of micro-LEDs to be apart from each other, and the at least two electrodes include a first electrode formed to be relatively close to a center of the second surface and at least one second electrode formed at an edge of the second surface.

公开(公告)号：US20220115359A1

公开(公告)日：2022-04-14

申请号：US17232964

申请日：2021-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Joonyong PARK ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L25/16

Abstract: Provided is a micro-LED display, a micro-LED transferring substrate, and a method of transferring micro-LEDs using the micro-LED transferring substrate. The micro-LED includes a backplane substrate; and a plurality of sub-pixels provided on the backplane substrate, wherein at least one sub-pixel from among the plurality of sub-pixels includes a first micro-LED; and a second micro-LED different from the first micro-LED.

公开(公告)号：US20220077346A1

公开(公告)日：2022-03-10

申请号：US17194942

申请日：2021-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Seogwoo HONG

IPC: H01L33/04 ,  H01L33/32 ,  H01L33/62 ,  H01L25/075

Abstract: Provided is a micro light emitting device and a display apparatus having the micro light emitting device. The micro light emitting device includes a first-type semiconductor layer provided on a substrate, a superlattice layer provided on the first-type semiconductor layer, a current blocking layer provided on a side portion of the superlattice layer, an active layer provided on the superlattice layer and the current blocking layer, and a second-type semiconductor layer provided on the active layer.

公开(公告)号：US20220013400A1

公开(公告)日：2022-01-13

申请号：US17324609

申请日：2021-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62

Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

公开(公告)号：US20200176426A1

公开(公告)日：2020-06-04

申请号：US16593635

申请日：2019-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoyoung AHN ,  Junhee CHOI ,  Kyungwook HWANG ,  Jinjoo PARK

IPC: H01L25/13 ,  H01L33/10 ,  H01L33/50 ,  H01L33/38 ,  H01L33/22

Abstract: A display device includes a substrate, an emission layer provided on the substrate and a reflective layer provided on the emission layer. The emission layer has an emission region that emits light, the reflective layer has a first opening, the emission region overlaps the first opening in a direction perpendicular to an upper surface of the substrate and a first width of the emission region is smaller than a second width of the first opening.

公开(公告)号：US20250069919A1

公开(公告)日：2025-02-27

申请号：US18941170

申请日：2024-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US20240322097A1

公开(公告)日：2024-09-26

申请号：US18424222

申请日：2024-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Hakyeol KIM ,  Jaewook PARK ,  Sanghoon SONG ,  Jungwoon SHIN ,  Keunsik LEE ,  Eungyeong LEE

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/38 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A display device having a perpendicular electrode structure and a method of manufacturing the display device are provided. The display device includes a display substrate including wiring therein, a first pad provided on the display substrate and connected to the wiring, a second pad provided on the display substrate, spaced apart from the first pad, and connected to the wiring, and a micro-semiconductor chip including a first electrode, a p-type semiconductor layer provided on the first electrode, an active layer provided on the p-type semiconductor layer, an n-type semiconductor layer provided on the active layer, and a second electrode provided on the n-type semiconductor layer, wherein the micro-semiconductor chip is constituted by a perpendicular electrode chip, the first electrode is connected to the first pad, and the second electrode is connected to the second pad.

公开(公告)号：US20240322068A1

公开(公告)日：2024-09-26

申请号：US18433068

申请日：2024-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Dongho KIM ,  Joonyong PARK ,  Junsik HWANG ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L33/005 ,  H01L21/67132 ,  H01L21/67333

Abstract: A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.