METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE

    公开(公告)号:US20180259985A1

    公开(公告)日:2018-09-13

    申请号:US15841734

    申请日:2017-12-14

    CPC classification number: G05D23/1931 G01K13/00 G06F1/206 H05K7/20

    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

    System on chip and temperature control method thereof
    33.
    发明授权
    System on chip and temperature control method thereof 有权
    片上系统及其温度控制方法

    公开(公告)号:US09459680B2

    公开(公告)日:2016-10-04

    申请号:US13948691

    申请日:2013-07-23

    CPC classification number: G06F1/3206 G05D23/1919 G06F1/20 G06F1/324 Y02D10/126

    Abstract: A temperature control method of a semiconductor device is provided. The temperature control method includes detecting a temperature of the semiconductor device; activating a reverse body biasing operation in which a body bias voltage applied to a function block of the semiconductor device is regulated, when the detected temperature is greater than a first temperature level; and activating a thermal throttling operation in which at least one of a frequency of a driving clock provided to a function block of the semiconductor device and a driving voltage applied to the function block of the semiconductor device is regulated, when the detected temperature is greater than a second temperature level that is different than the first temperature level.

    Abstract translation: 提供了一种半导体器件的温度控制方法。 温度控制方法包括检测半导体器件的温度; 当检测到的温度大于第一温度水平时,激活施加到半导体器件的功能块的体偏置电压的反向体偏置操作; 以及激活热调节操作,其中当检测到的温度大于所述热节流操作时,提供给所述半导体器件的功能块的驱动时钟的频率中的至少一个和施加到所述半导体器件的功能块的驱动电压被调节 与第一温度水平不同的第二温度水平。

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