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公开(公告)号:US20240113272A1
公开(公告)日:2024-04-04
申请号:US18529653
申请日:2023-12-05
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Gyu JANG , Ho Joon LEE , Jong Hyeon CHAE
CPC classification number: H01L33/62 , H01L33/08 , H01L33/382 , H01L33/44
Abstract: A method of mounting light emitting devices on a mounting board including steps of forming the light emitting devices spaced apart from one another on a first surface of a substrate, forming a mask pattern on a second surface of the substrate opposite to the first surface, the mask pattern exposing regions of the second surface of the substrate that overlap the light emitting devices to be separated from the substrate, and performing a selective laser lift-off process using the mask pattern to mount the light emitting devices to the mounting board.
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公开(公告)号:US20240055467A1
公开(公告)日:2024-02-15
申请号:US18384884
申请日:2023-10-30
Applicant: Seoul Viosys Co., Ltd.
Inventor: Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE
IPC: H01L27/15 , H01L33/62 , H01L33/40 , H01L33/24 , G09G3/32 , G09G3/20 , H01L25/075 , G09G3/3225
CPC classification number: H01L27/153 , H01L33/62 , H01L33/405 , H01L33/24 , G09G3/32 , G09G3/2003 , H01L25/0753 , G09G3/3225 , G09G2300/0426 , G09G2310/08 , G09G2300/023
Abstract: A light module including a circuit substrate and a light emitter, the light emitter including a light source configured to generate light and including a first epitaxial layer, a second epitaxial layer, and an active layer, an insulation layer covering the light source, a first electrode electrically connected to the first epitaxial layer, a light guide configured to guide light generated from the light source, a transparent material covering the light source, and an angle controller disposed on the transparent material, in which the light guide has a guide hole filled with the transparent material, and a refractive index of the light guide is different from that of the light source.
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公开(公告)号:US20230378240A1
公开(公告)日:2023-11-23
申请号:US18226780
申请日:2023-07-27
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Chung Hoon LEE , Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE
CPC classification number: H01L27/156 , G09G3/32 , G09G3/2003 , H01L33/504 , H01L33/405 , H01L33/30 , H01L25/0756 , G09G2300/0452 , G09G2310/0267 , G09G2310/08 , H01L25/167
Abstract: A display device including a substrate, a light emitting stacked structure disposed on the substrate and including a plurality of epitaxial sub-units disposed one over another, a first adhesive layer bonding the epitaxial sub-units to the substrate; and a line part disposed on the substrate and configured to apply a light emitting signal to each of the epitaxial sub-units, in which the light emitting stacked structure is configured to provide light having various colors by a combination of light emitted from each of the epitaxial sub-units, and the first adhesive layer includes a conductive and non-transparent material.
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公开(公告)号:US20230128703A1
公开(公告)日:2023-04-27
申请号:US18086663
申请日:2022-12-22
Applicant: SEOUL VIOSYS CO, LTD.
Inventor: Chang Yeon KIM , Jong Hyeon CHAE , Jong Min JANG , Ho Joon LEE , Seong Gyu JANG
Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a planarization layer disposed between the first and second LED sub-units and being light transmissive, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.
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公开(公告)号:US20220392950A1
公开(公告)日:2022-12-08
申请号:US17847136
申请日:2022-06-22
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE , Chang Yeon KIM , Chung Hoon LEE
IPC: H01L27/15 , H01L33/62 , H01L25/075 , H01L33/00 , H01L25/13 , H01L33/10 , H01L33/40 , H01L33/42 , H01L33/50
Abstract: A display apparatus including a thin film transistor (TFT) substrate; a first LED sub-unit, a second LED sub-unit, and a third LED sub-unit; first, second, third, and fourth electrode pads disposed between the TFT substrate and the first LED sub-unit; and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first, second, and third sub-units are configured to be independently driven; light generated from the first LED sub-unit is emitted to the outside of the display apparatus by passing through the second and third LED sub-units; light generated from the second LED sub-unit is emitted to the outside of the display apparatus by passing through the third LED sub-unit; and at least one of the connectors includes a first portion electrically connecting a first surface of the first LED sub-unit to the second electrode pad.
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公开(公告)号:US20220367427A1
公开(公告)日:2022-11-17
申请号:US17866249
申请日:2022-07-15
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/58 , H01L33/00 , H01L33/62
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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公开(公告)号:US20210091286A1
公开(公告)日:2021-03-25
申请号:US17115783
申请日:2020-12-08
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Gyu JANG , Ho Joon LEE , Jong-Hyeon CHAE
Abstract: A method of mounting light emitting devices on a mounting board including steps of forming the light emitting devices spaced apart from one another on a first surface of a substrate, forming a mask pattern on a second surface of the substrate opposite to the first surface, the mask pattern exposing regions of the second surface of the substrate that overlap the light emitting devices to be separated from the substrate, and performing a selective laser lift-off process using the mask pattern to mount the light emitting devices to the mounting board.
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公开(公告)号:US20200303451A1
公开(公告)日:2020-09-24
申请号:US16899522
申请日:2020-06-11
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Seang Gyu JANG , Ho Joon LEE , Chang Yeon KIM , Chung Hoon LEE
IPC: H01L27/15 , H01L33/62 , H01L25/075 , H01L33/00 , H01L25/13 , H01L33/10 , H01L33/40 , H01L33/42 , H01L33/50
Abstract: A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.
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公开(公告)号:US20200295228A1
公开(公告)日:2020-09-17
申请号:US16815823
申请日:2020-03-11
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu JANG , Chan Seob SHIN , Seom Geun LEE , Ho Joon LEE
IPC: H01L33/24 , H01L33/62 , H01L25/075
Abstract: A light emitting device for a display including first, second, and third LED stacks, and bump pads disposed on the first LED stack, in which each LED stack includes a first semiconductor layer and a second semiconductor layer exposing a portion of the first semiconductor layer, the first LED stack includes upper through-holes and the second LED stack includes lower through-holes, the bump pads include a first bump pad electrically connected to the second semiconductor layer of the first LED stack, a second bump pad electrically connected to the second semiconductor layer of the second LED stack through the upper through-hole, a third bump pad electrically connected to the second semiconductor layer of the third LED stack through the upper through-hole and the lower through-hole, and a common bump pad electrically connected to the first semiconductor layers of each LED stack in common.
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公开(公告)号:US20190164944A1
公开(公告)日:2019-05-30
申请号:US16198873
申请日:2018-11-22
Applicant: Seoul Viosys Co., Ltd.
Inventor: Jong Hyeon CHAE , Chung Hoon LEE , Chang Yeon KIM , Seong Gyu JANG , Ho Joon LEE , Jong Min JANG
Abstract: A light emitting device for a display including a first substrate, a first LED sub-unit disposed on the first substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a second substrate disposed on the third LED sub-unit, a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad disposed on the second substrate, and through-hole vias electrically connecting the second, third, and fourth electrode pads to the first, second, and third LED sub-units, respectively, in which the first electrode pad is electrically connected to the first LED sub-unit without overlapping any through-hole vias.
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