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公开(公告)号:US20250062295A1
公开(公告)日:2025-02-20
申请号:US18936534
申请日:2024-11-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu JANG , Yong Woo RYU , Seom Geun LEE , Cha E KIM
Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.
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2.
公开(公告)号:US20230387085A1
公开(公告)日:2023-11-30
申请号:US18231614
申请日:2023-08-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Ik Kyu YOU , Seom Geun LEE , Seong Kyu JANG , Yong Woo RYU
IPC: H01L25/075 , H01L33/62 , H01L23/00
CPC classification number: H01L25/0753 , H01L33/62 , H01L24/16 , H01L2224/16505 , H01L2224/16227
Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.
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3.
公开(公告)号:US20220367427A1
公开(公告)日:2022-11-17
申请号:US17866249
申请日:2022-07-15
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/58 , H01L33/00 , H01L33/62
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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公开(公告)号:US20220336428A1
公开(公告)日:2022-10-20
申请号:US17722369
申请日:2022-04-17
Applicant: SEOUL VIOSYS CO, LTD.
Inventor: Seong Kyu JANG , Yong Woo RYU , Seom Geun LEE , Cha E KIM
IPC: H01L25/075 , H01L25/16 , H01L33/00 , H01L33/46 , H01L33/38
Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.
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公开(公告)号:US20200295228A1
公开(公告)日:2020-09-17
申请号:US16815823
申请日:2020-03-11
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seong Kyu JANG , Chan Seob SHIN , Seom Geun LEE , Ho Joon LEE
IPC: H01L33/24 , H01L33/62 , H01L25/075
Abstract: A light emitting device for a display including first, second, and third LED stacks, and bump pads disposed on the first LED stack, in which each LED stack includes a first semiconductor layer and a second semiconductor layer exposing a portion of the first semiconductor layer, the first LED stack includes upper through-holes and the second LED stack includes lower through-holes, the bump pads include a first bump pad electrically connected to the second semiconductor layer of the first LED stack, a second bump pad electrically connected to the second semiconductor layer of the second LED stack through the upper through-hole, a third bump pad electrically connected to the second semiconductor layer of the third LED stack through the upper through-hole and the lower through-hole, and a common bump pad electrically connected to the first semiconductor layers of each LED stack in common.
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公开(公告)号:US20240282803A1
公开(公告)日:2024-08-22
申请号:US18600228
申请日:2024-03-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Seom Geun LEE , Seong Kyu JANG , Yong Woo RYU
IPC: H01L27/15 , H01L25/075 , H01L33/38 , H01L33/62
CPC classification number: H01L27/156 , H01L25/0753 , H01L33/382 , H01L33/62
Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.
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7.
公开(公告)号:US20240105686A1
公开(公告)日:2024-03-28
申请号:US18535545
申请日:2023-12-11
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/00 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/0093 , H01L33/58 , H01L33/62 , H01L2933/0058 , H01L2933/0066
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.
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8.
公开(公告)号:US20200343227A1
公开(公告)日:2020-10-29
申请号:US16855258
申请日:2020-04-22
Applicant: Seoul Viosys Co., Ltd
Inventor: Seong Kyu JANG , Seom Geun LEE , Chan Seob SHIN , Ho Joon LEE
IPC: H01L25/075 , H01L33/58 , H01L33/62 , H01L33/00
Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board, and a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices
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公开(公告)号:US20200152829A1
公开(公告)日:2020-05-14
申请号:US16745758
申请日:2020-01-17
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Kyu JANG , Hong Suk Cho , Kyu Ho Lee , Chi Hyun In
Abstract: A light emitting device including a substrate, a first semiconductor layer, a mesa disposed thereon and including a second semiconductor layer and an active layer, a first contact electrode contacting the first semiconductor layer exposed around the mesa, a second contact electrode contacting the second semiconductor layer, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode and having openings disposed on the first and second contact electrodes, and first and second bump electrodes electrically connected to the first and second contact electrodes through the openings, respectively, in which the mesa has indentations in plan view, the first contact electrode is spaced apart from the mesa by a predetermined distance, surrounds the mesa, and contacts the first semiconductor layer in the indentations, and each of the first and second bump electrodes covers one of the openings of the passivation layer and a portion thereof.
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公开(公告)号:US20180182921A1
公开(公告)日:2018-06-28
申请号:US15851468
申请日:2017-12-21
Applicant: Seoul Viosys Co., Ltd.
Inventor: Seong Kyu JANG , Ju Yong PARK , Kyu Ho LEE , Joon Hee LEE
CPC classification number: H01L33/405 , H01L33/06 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62 , H01L2933/0016 , H01L2933/0066
Abstract: A semiconductor light emitting device includes a first semiconductor layer, an active layer disposed on the first semiconductor layer to emit ultraviolet light, a second semiconductor layer disposed on the active layer, and a first electrode disposed on the first semiconductor layer and being in Ohmic contact with a portion of the first semiconductor layer, the first electrode including a contact electrode including aluminum (Al) and at least one other material and having a first region adjacent to the first semiconductor layer and a second region, with each region having an Al composition ratio defined by the amount of Al relative to the amount of the at least one other material, wherein the Al composition ratio of the first region is greater than the Al composition ratio of the second region, and a metal layer disposed on the contact electrode.
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