摘要:
A sensor with multiple magnetic field sensing elements for use in current sensing and other applications is presented. The sensor includes an arrangement of two or more magnetic field sensing elements to sense magnetic field associated with a target. The sensor further includes circuitry to generate a sensor output signal based on sensing of at least one of the magnetic field sensing elements of the arrangement. Also included is a programmable misalignment adjustment block to control the circuitry to generate the output signal with compensation for misalignment between the sensor and the target. The programmable misalignment adjustment block can be programmed to select measurement of one of the two or more magnetic field sensing elements, or alternatively, a mathematical combination of measurements of the two or more magnetic field sensing elements, for generating the sensor output signal when a test of the sensor indicates a misalignment.
摘要:
An angle sensor to provide sensor-to-magnet misalignment detection and correction capability in rotation angle measurement applications is presented. The angle sensor has magnetic field sensing elements to sense magnetic field associated with a rotating magnet. The angle sensor includes circuitry to generate signals based on the sensing by the sensing elements. The signals provide information that can be combined according to an error function to provide misalignment detection. The angle sensor can be used with or can be incorporated in an angle measurement device that employs a processing unit to produce a rotation angle value. In one embodiment, the processing unit is configured to implement the error function and correct the angle value for detected misalignment. In another embodiment, the error function is performed by a programming device and detected misalignment is corrected through mechanical adjustment of sensor-to-magnet position.
摘要:
A sensor with multiple magnetic field sensing elements for use in current sensing and other applications is presented. The sensor includes an arrangement of two or more magnetic field sensing elements to sense magnetic field associated with a target. The sensor further includes circuitry to generate a sensor output signal based on sensing of at least one of the magnetic field sensing elements of the arrangement. Also included is a programmable misalignment adjustment block to control the circuitry to generate the output signal with compensation for misalignment between the sensor and the target. The programmable misalignment adjustment block can be programmed to select measurement of one of the two or more magnetic field sensing elements, or alternatively, a mathematical combination of measurements of the two or more magnetic field sensing elements, for generating the sensor output signal when a test of the sensor indicates a misalignment.
摘要:
A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.
摘要:
The invention provides a current sensor that may be folded over a conductor without the need to sever the conductor or thread the conductor through the current sensor. In one embodiment, the current sensor includes an outer body having a first folding portion and a second folding portion coupled to the first folding portion. The current sensor also includes a soft ferromagnetic body disposed within the outer body comprising a first core element and a second core element. The first and second core elements form a lumen when the first and second folding portions are folded. The lumen is configured to receive a conductor. The current sensor also includes a magnetic field detector to sense a current in the conductor. The magnetic field detector is disposed at least partially between the first and second core elements when the first and second folding portions are folded.
摘要:
A magnetoresistive (MR) sensing device includes MR elements electrically connected to form a bridge circuit and one or more non-functional (or “dummy”) MR elements for improved matching of the bridge circuit MR elements.
摘要:
A magnetoresistive (MR) sensing device includes MR elements electrically connected to form a bridge circuit and one or more non-functional (or “dummy”) MR elements for improved matching of the bridge circuit MR elements.
摘要:
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
摘要:
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor position. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.
摘要:
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The integrated circuit includes an overcurrent circuit responsive to a voltage drop generated by a current.