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191 条记录 (耗时 0.031 秒)

    Methods and systems for inkjet drop positioning
    31.
    发明授权
    Methods and systems for inkjet drop positioning 失效
    喷墨定位方法和系统

    公开(公告)号：US07611217B2

    公开(公告)日：2009-11-03

    申请号：US11238636

    申请日：2005-09-29

    申请人： Bassam Shamoun ,  Janusz Jozwiak ,  Eugene Mirro ,  Quanyuan Shang ,  Shinichi Kurita ,  John M. White

    发明人： Bassam Shamoun ,  Janusz Jozwiak ,  Eugene Mirro ,  Quanyuan Shang ,  Shinichi Kurita ,  John M. White

    IPC分类号： B41J29/38

    CPC分类号： B41J29/393

    摘要： Methods and apparatus for inkjet inkjet drop positioning are provided. A first method includes determining an intended deposition location of an ink drop on a substrate, depositing the ink drop on the substrate using an inkjet printing system, detecting a deposited location of the deposited ink drop on the substrate, comparing the deposited location to the intended location, determining a difference between the deposited location and the intended location, and compensating for the difference between the deposited location and the intended location by adjusting a parameter of an inkjet printing system. Numerous other aspects are provided.

    摘要翻译： 提供喷墨喷墨滴定位的方法和装置。 第一种方法包括确定墨滴在基底上的预期沉积位置，使用喷墨印刷系统将墨滴沉积在基底上，检测沉积的墨滴在基底上的沉积位置，将沉积位置与预期的位置进行比较 确定存放位置与预期位置之间的差异，以及通过调整喷墨打印系统的参数来补偿存放位置与预期位置之间的差异。 提供了许多其他方面。

    METHODS AND APPARATUS FOR MINIMIZING THE NUMBER OF PRINT PASSES IN FLAT PANEL DISPLAY MANUFACTURING
    34.
    发明申请
    METHODS AND APPARATUS FOR MINIMIZING THE NUMBER OF PRINT PASSES IN FLAT PANEL DISPLAY MANUFACTURING 审中-公开
    在平板显示器制造中最小化打印通行数量的方法和装置

    公开(公告)号：US20080259101A1

    公开(公告)日：2008-10-23

    申请号：US12054381

    申请日：2008-03-24

    申请人： Shinichi Kurita ,  John M. White

    发明人： Shinichi Kurita ,  John M. White

    IPC分类号： B41J2/01

    CPC分类号： B41J2/2103

    摘要： A system for inkjet printing includes a first set including a first inkjet print head having a first plurality of nozzles adapted to selectively dispense a first ink, and a second inkjet print head having a second plurality of nozzles adapted to selectively dispense a second ink; a second set including a third inkjet print head having a third plurality of nozzles adapted to selectively dispense a third ink and a fourth inkjet print head having a fourth plurality of nozzles adapted to selectively dispense a fourth ink; and a stage adapted to support the substrate and transport the substrate below the first and second sets during a printing pass; wherein the first set is adapted to dispense the first and second inks into respective adjacent color wells of a display pixel on a substrate and the second set is adapted to dispense the third and fourth inks into respective adjacent color wells of a display pixel on a substrate.

    摘要翻译： 一种用于喷墨打印的系统包括：第一组，包括具有适于选择性地分配第一油墨的第一多个喷嘴的第一喷墨打印头;以及具有适于选择性分配第二墨水的第二多个喷嘴的第二喷墨打印头; 第二组包括具有适于选择性地分配第三墨的第三多个喷嘴的第三喷墨打印头和具有适于选择性地分配第四墨的第四多个喷嘴的第四喷墨打印头; 以及适于在打印过程中支撑衬底并将衬底输送到第一和第二组下方的台阶; 其中所述第一组适于将所述第一和第二墨水分配到基板上的显示像素的相应的相邻色阱中，并且所述第二组适于将第三和第四墨水分配到基板上的显示像素的相应相邻色阱中 。

    FLOATING SLIT VALVE FOR TRANSFER CHAMBER INTERFACE
    35.
    发明申请
    FLOATING SLIT VALVE FOR TRANSFER CHAMBER INTERFACE 有权
    浮动接口的浮动阀门

    公开(公告)号：US20080258091A1

    公开(公告)日：2008-10-23

    申请号：US12040291

    申请日：2008-02-29

    申请人： John M. White ,  Shinichi Kurita ,  Takayuki Matsumoto

    发明人： John M. White ,  Shinichi Kurita ,  Takayuki Matsumoto

    IPC分类号： F16K51/00 ,  B21D51/16 ,  F16K25/00

    CPC分类号： F16K51/02 ,  Y10S438/905 ,  Y10T29/49412

    摘要： The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve.

    摘要翻译： 本发明通常包括用于与室连接的浮动狭缝阀。 浮动狭缝阀相对于诸如室的另一物体移动或“浮动”。 狭缝阀可以联接在两个腔室之间。 当与狭缝阀联接的室被加热时，狭缝阀也可以通过传导加热。 当狭缝阀被加热时，它可以热膨胀。 当在室中抽真空时，狭缝阀可能由于真空偏转而变形。 通过在室和狭缝阀之间设置低摩擦材料间隔件，狭缝阀在热膨胀/收缩和/或真空偏转期间可能不会摩擦室，因此不会产生不期望的颗粒污染物。 此外，穿过腔室钻出的狭缝阀可以被定尺寸以适应狭缝阀的热膨胀/收缩和真空偏转。

    Method for transferring substrates in a load lock chamber
    37.
    发明授权
    Method for transferring substrates in a load lock chamber 有权
    在负载锁定室中传送基板的方法

    公开(公告)号：US07316966B2

    公开(公告)日：2008-01-08

    申请号：US11278318

    申请日：2006-03-31

    申请人： Shinichi Kurita ,  Wendell T. Blonigan

    发明人： Shinichi Kurita ,  Wendell T. Blonigan

    IPC分类号： H01L21/20

    CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67748

    摘要： Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.

    摘要翻译： 本文提供了一种基板处理系统，其包括盒式装载台; 负载锁定室; 位于中心的传送室; 以及位于传送室的周边周围的一个或多个处理室。 负载锁定室包括在相同位置构造的双重双槽加载锁。 这种系统可用于处理用于半导体制造的衬底。

    METHODS AND APPARATUS FOR MAINTAINING INKJET PRINT HEADS USING PARKING STRUCTURES
    38.
    发明申请
    METHODS AND APPARATUS FOR MAINTAINING INKJET PRINT HEADS USING PARKING STRUCTURES 审中-公开
    使用停车结构维护喷码头的方法和装置

    公开(公告)号：US20070263026A1

    公开(公告)日：2007-11-15

    申请号：US11741723

    申请日：2007-04-28

    申请人： Quanyuan Shang ,  Shinichi Kurita ,  Lizhong Sun

    发明人： Quanyuan Shang ,  Shinichi Kurita ,  Lizhong Sun

    IPC分类号： B41J2/165

    CPC分类号： B41J2/16552 ,  B41J2/16508 ,  B41J3/28

    摘要： The invention provides a print head parking structure that includes a solvent and/or surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath or pool to dissolve or wash away any ink that has been deposited on the print heads.

    摘要翻译： 本发明提供了一种打印头停车结构，其包括用于喷墨打印头的溶剂和/或表面处理浴。 在印刷一个或多个印刷之后，和/或经常足以防止油墨干燥或堵塞打印头，印刷头可以在印刷基板之后返回打印头停车结构。 一旦密封在打印头停车结构中，打印头（或其一部分）可以浸入溶剂浴或池中以溶解或洗掉已经沉积在打印头上的任何油墨。

    DIELECTRIC MATERIAL SEPARATED-TYPE, HIGH BREAKDOWN VOLTAGE SEMICONDUCTOR CIRCUIT DEVICE, AND PRODUCTION METHOD THEREOF
    39.
    发明申请
    DIELECTRIC MATERIAL SEPARATED-TYPE, HIGH BREAKDOWN VOLTAGE SEMICONDUCTOR CIRCUIT DEVICE, AND PRODUCTION METHOD THEREOF 有权

    公开(公告)号：US20070210408A1

    公开(公告)日：2007-09-13

    申请号：US11684032

    申请日：2007-03-09

    申请人： Atsuo Watanabe ,  Mitsutoshi Honda ,  Norio Ishitsuka ,  Masahiro Ito ,  Toshihito Tabata ,  Shinichi Kurita ,  Hidekazu Kamioka

    发明人： Atsuo Watanabe ,  Mitsutoshi Honda ,  Norio Ishitsuka ,  Masahiro Ito ,  Toshihito Tabata ,  Shinichi Kurita ,  Hidekazu Kamioka

    IPC分类号： H01L29/00

    CPC分类号： H01L21/76286 ,  H01L29/7394 ,  H01L29/7824

    摘要： It is an object of the present invention to provide an integrated circuit device structured to uniformly apply a voltage to side oxide films formed in a trench at both sides in an SOI substrate.The semiconductor integrated circuit device of the present invention comprises a substrate which supports a first insulation layer below an active device region, trench formed in the active device region to come into contact with the first insulation layer, second insulation film formed on the trench side wall, polycrystalline silicon with which the trench is filled, and third insulation film formed on the polycrystalline silicon, wherein the thickness ratio of the third insulation film to the first insulation film is 0.25 or more to uniformly apply a voltage to the oxide insulation films formed in the trench at both sides.It is another object of the present invention to provide a dielectrically isolated semiconductor device of high reliability by realizing a fine and deep element isolating region which can prevent dislocation of an oxide film as an insulation layer by oxidation-induced stress. It is still another object to provide a process for fabrication of the above device.The dielectrically isolated semiconductor device of the present invention comprises a substrate supporting single-crystalline silicon via an oxide film (SOI substrate), the substrate supporting an active element layer deeper than an expanded distance of a depletion layer subjected to the highest voltage applied to the device, and element isolating region which encloses the active element layer. The element isolating region contains a deep trench which comes into contact with the insulation layer on the SOI substrate, and is filled with n heavily doped layers on both side walls, second insulation films each adjacent to the n heavily doped layer and polycrystalline semiconductor layer formed between the second insulation films.

    METHOD FOR TRANSFERRING SUBSTRATES IN A LOAD LOCK CHAMBER
    40.
    发明申请
    METHOD FOR TRANSFERRING SUBSTRATES IN A LOAD LOCK CHAMBER 有权
    用于在负载锁箱中传送衬底的方法

    公开(公告)号：US20060182615A1

    公开(公告)日：2006-08-17

    申请号：US11278318

    申请日：2006-03-31

    申请人： Shinichi Kurita ,  Wendell Blonigan

    发明人： Shinichi Kurita ,  Wendell Blonigan

    IPC分类号： B65H1/00

    CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67748

    摘要： Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.

    摘要翻译： 本文提供了一种基板处理系统，其包括盒装载台; 负载锁定室; 位于中心的传送室; 以及位于传送室的周边周围的一个或多个处理室。 负载锁定室包括在相同位置构造的双重双槽加载锁。 这种系统可用于处理用于半导体制造的衬底。