High speed, high resolution, three dimensional solar cell inspection system
    31.
    发明授权
    High speed, high resolution, three dimensional solar cell inspection system 有权
    高速,高分辨率,三维太阳能电池检测系统

    公开(公告)号:US08388204B2

    公开(公告)日:2013-03-05

    申请号:US12886784

    申请日:2010-09-21

    IPC分类号: F21V8/00

    摘要: An optical inspection system and method are provided. A workpiece transport moves a workpiece in a nonstop manner. An illuminator includes a light pipe and is configured to provide a first and second strobed illumination field types. First and second arrays of cameras are arranged to provide stereoscopic imaging of the workpiece. The first array of cameras is configured to generate a first plurality of images of the workpiece with the first illumination field and a second plurality of images of the feature with the second illumination field. The second array of cameras is configured to generate a third plurality of images of the workpiece with the first illumination field and a fourth plurality of images of the feature with the second illumination field. A processing device stores at least some of the first, second, third, and fourth pluralities of images and provides the images to an other device.

    摘要翻译: 提供光学检查系统和方法。 工件传送以不间断的方式移动工件。 照明器包括光管并且被配置为提供第一和第二选通照明场类型。 照相机的第一和第二阵列被布置成提供工件的立体成像。 第一阵列相机被配置为利用第一照明场和具有第二照明场的特征的第二多个图像来生成工件的第一多个图像。 第二阵列相机被配置为利用第一照明场和具有第二照明场的特征的第四多个图像来生成工件的第三多个图像。 处理装置存储第一,第二,第三和第四多个图像中的至少一些,并将图像提供给另一个装置。

    Solder paste inspection system
    32.
    发明授权
    Solder paste inspection system 有权
    焊膏检测系统

    公开(公告)号:US06750899B1

    公开(公告)日:2004-06-15

    申请号:US09524133

    申请日:2000-03-10

    IPC分类号: H04N718

    摘要: A novel inspection system for inspecting an article of manufacture, such as a printed circuit board, is disclosed, where the system includes a strobed illuminator adapted to project light through a reticle so as to project a pattern of light onto an area of the printed circuit board. A board transport responsively positions the board to at least two distinct positions, where each position corresponding to a different phase of the projected light. Also included is a detector adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. An encoder monitors the movement of the board and outputs a position output, and a processor connected to the encoder, the board transport, the illuminator and the detector controlledly energizes the illuminator to expose the area as a function of the position output, the processor co-siting the at least two images and constructing a height map image with the co-sited images.

    摘要翻译: 公开了一种用于检查诸如印刷电路板的制品的新型检查系统,其中系统包括频闪照明器,其适用于通过掩模版投射光以将光线投射到印刷电路的区域上 板。 板传输响应地将板定位到至少两个不同的位置,其中每个位置对应于投影光的不同相位。 还包括检测器,其适于获取该区域的至少两个图像,每个图像对应于至少两个不同相中的一个。 编码器监视电路板的移动并输出位置输出,连接到编码器的处理器,电路板传输,照明器和检测器控制地照亮照明器,使位置输出的函数露出该区域,处理器 选择所述至少两个图像并且使用所述共同图像构建高度图图像。

    Calibration methods for placement machines incorporating on-head linescan sensing
    33.
    发明授权
    Calibration methods for placement machines incorporating on-head linescan sensing 失效
    结合头部线路的贴片机的校准方法可以感测

    公开(公告)号:US06744499B2

    公开(公告)日:2004-06-01

    申请号:US10337644

    申请日:2003-01-07

    IPC分类号: G01J110

    摘要: A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

    摘要翻译: 公开了一种校准具有头部线扫描传感器的拾放机的方法。 校准包括通过焦点度量方法获得一个或多个喷嘴尖端的z轴高度信息,包括傅立叶变换方法和归一化相关方法。 此外,在放置部件的过程中,测量和补偿其他物理特性,例如线性检测器倾斜,水平比例因子和垂直比例因子。 另一种物理特性的喷嘴径流也通过正弦曲线拟合法测量,并且所得到的Z高度校准数据用于稍后放置组件。