公开(公告)号：US09564179B2

公开(公告)日：2017-02-07

申请号：US15089801

申请日：2016-04-04

Applicant: TDK CORPORATION

Inventor： Susumu Taniguchi ,  Hisayuki Abe

IPC: G11B17/00 ,  G11B33/14

CPC classification number: G11B33/1426 ,  G11B17/00 ,  G11B25/043 ,  G11B33/1446 ,  G11B33/148

Abstract: A spoiler (40) that is a rectifying component for a magnetic disk device including a flat plate-like plate portion (41) arranged to face a magnetic disk (10), and a support portion (42) that supports the plate portion (41) includes a body portion (401) made of a resin, and a metal plating layer (402) that covers an entire surface of the body portion (401).

Abstract translation: 作为用于磁盘装置的整流部件的扰流器（40），包括布置成面对磁盘（10）的平板状板部分（41）和支撑板部分（41）的支撑部分（42） ）包括由树脂制成的主体部分（401）和覆盖主体部分（401）的整个表面的金属镀层（402）。

公开(公告)号：US09070606B2

公开(公告)日：2015-06-30

申请号：US13960228

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: H01L23/485 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/05552

Abstract: The present invention relates to a terminal structure comprising: a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, a height Hbm at which the bump has a maximum diameter (Lbm) is lower than a maximum height Hu of the under-bump metal layer.

Abstract translation: 本发明涉及一种端子结构，包括：基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中在沿着层叠方向的截面中，所述凸块具有最大直径（Lbm）的高度Hbm低于所述凸块下凸块的最大高度Hu， 凸块金属层。