公开(公告)号：US5559674A

公开(公告)日：1996-09-24

申请号：US568396

申请日：1995-12-15

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： H01L23/36 ,  H01L23/40 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/467 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002

摘要： A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat sink may closely contact the integrated circuit package. A cover is fixed to the guide member such that it covers outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.

摘要翻译： 用于将散热器安装在安装在印刷电路板上的集成电路封装上的结构被构造成使得具有框架部分和支撑柱部分的引导构件固定到印刷电路板上，并且散热器就座在内部 引导构件的周边，使得散热器可以紧密接触集成电路封装。 盖子被固定到引导构件，使得其覆盖散热器的上表面的外周边缘部分。 该结构的冷却效率高，易于安装。

公开(公告)号：US08892369B2

公开(公告)日：2014-11-18

申请号：US13221112

申请日：2011-08-30

申请人： Hiroyuki Furuya ,  Atsushi Yamaguchi ,  Kazuhiro Nitta ,  Tadashi Katsui

发明人： Hiroyuki Furuya ,  Atsushi Yamaguchi ,  Kazuhiro Nitta ,  Tadashi Katsui

IPC分类号： G01F1/00 ,  G06F1/20

CPC分类号： G06F1/206 ,  H05K7/20209

摘要： A predicting apparatus includes an obtaining unit and a predicting unit. The obtaining unit included in the predicting apparatus obtains actual measurements of data about a fan being rotated at a predetermined revolution frequency N [rpm]. The predicting apparatus then predicts data about the fan to be rotated at a revolution frequency N′ that is different from the predetermined revolution frequency N based on the actual measurements of the data thus obtained.

摘要翻译： 预测装置包括获取单元和预测单元。 包含在预测装置中的获取单元获得关于以预定转速N [rpm]旋转的风扇的数据的实际测量值。 然后，预测装置基于由此获得的数据的实际测量值，以与预定转速N不同的转速N'来预测要旋转的风扇的数据。

公开(公告)号：US20120072132A1

公开(公告)日：2012-03-22

申请号：US13221112

申请日：2011-08-30

申请人： Hiroyuki Furuya ,  Atsushi Yamaguchi ,  Kazuhiro Nitta ,  Tadashi Katsui

发明人： Hiroyuki Furuya ,  Atsushi Yamaguchi ,  Kazuhiro Nitta ,  Tadashi Katsui

IPC分类号： G06F19/00

CPC分类号： G06F1/206 ,  H05K7/20209

摘要： A predicting apparatus includes an obtaining unit and a predicting unit. The obtaining unit included in the predicting apparatus obtains actual measurements of data about a fan being rotated at a predetermined revolution frequency N [rpm]. The predicting apparatus then predicts data about the fan to be rotated at a revolution frequency N′ that is different from the predetermined revolution frequency N based on the actual measurements of the data thus obtained.

摘要翻译： 预测装置包括获取单元和预测单元。 包含在预测装置中的获取单元获得关于以预定转速N [rpm]旋转的风扇的数据的实际测量值。 然后，预测装置基于由此获得的数据的实际测量值，以与预定转速N不同的转速N'来预测要旋转的风扇的数据。

公开(公告)号：US06460608B2

公开(公告)日：2002-10-08

申请号：US09820980

申请日：2001-03-30

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： F28F700

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

公开(公告)号：US06333847B1

公开(公告)日：2001-12-25

申请号：US09241478

申请日：1999-02-02

申请人： Tadashi Katsui ,  Haruhiko Yamamoto

发明人： Tadashi Katsui ,  Haruhiko Yamamoto

IPC分类号： H02B104

CPC分类号： G06F1/203

摘要： To prevent an operator from being hurt by a hot outside panel of an electronic device when he touches the outside panel with his hand or a portion of his body, the outside panel is improved and an electronic device safe for the operator is provided. There are provided spaces for heat insulation in an outside panel and, by the action of the spaces, the apparent temperature of the outside panel is decreased. Also, ducts are provided in the outside panel, and the temperature of the outside panel itself is decreased by the action of the ducts. Further, a large number of protrusions are provided on the surface of the outside panel, and a heat insulating section is formed at the forward end of each protrusion, so that the apparent temperature is decreased.

摘要翻译： 为了防止操作者用手或其身体的一部分触摸外部面板时受到电子设备的热外部面板的伤害，提供了外部面板，并且为操作者提供了安全的电子设备。 在外板中设置有用于隔热的空间，并且通过间隙的作用，外板的表观温度降低。 此外，在外板中设置管道，并且通过管道的作用使外板本身的温度降低。 此外，在外板的表面上设置有多个突起，并且在每个突起的前端形成绝热部，使得表观温度降低。

公开(公告)号：US5689404A

公开(公告)日：1997-11-18

申请号：US548475

申请日：1995-10-26

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3677 ,  H01L2924/0002

摘要： The heat sink of the present invention applicable to at least two heating elements including two integrated circuit packages includes a base member fixed to the integrated circuit packages and having a plurality of fins, and air cooling means provided at a substantially central position of the base member. This construction allows an improvement in reliability, a reduction in noise, and a reduction in power consumption.

摘要翻译： 适用于包括两个集成电路封装的至少两个加热元件的本发明的散热器包括固定到集成电路封装并具有多个散热片的基座部件，以及设置在基座部件的基本中心位置处的空气冷却装置 。 这种结构可以提高可靠性，降低噪音，降低功耗。

公开(公告)号：US20110303406A1

公开(公告)日：2011-12-15

申请号：US13154838

申请日：2011-06-07

申请人： Jun Takeda ,  Nobuyuki Tamura ,  Tadashi Katsui ,  Masamichi Iwasaki ,  Shinji Mizumura ,  Hideo Okoshi

发明人： Jun Takeda ,  Nobuyuki Tamura ,  Tadashi Katsui ,  Masamichi Iwasaki ,  Shinji Mizumura ,  Hideo Okoshi

IPC分类号： G05D23/00 ,  H05K7/20

CPC分类号： H05K7/20745 ,  H05K7/20836

摘要： A computer room air-conditioning system includes a temperature detection unit which is provided for each of a front and a back of each rack, and measures air temperatures of the front and the back; and a control device for acquiring a measured temperature by each temperature detection unit, and performing control based on the measured temperature. With the configuration, the control device includes a temperature difference calculation unit for calculating a temperature difference between cool air at the front and warm air at the back of each rack based on each measured and acquired temperature; and a heating element cooling control unit for controlling by adjustment an amount of flow of cool air from the underfloor space to the computer room based on the calculated temperature difference.

摘要翻译： 计算机室空调系统包括为每个机架的前后设置的温度检测单元，并且测量前后的空气温度; 以及控制装置，用于通过每个温度检测单元获取测量的温度，并且基于测量的温度进行控制。 通过该结构，控制装置具有：温度差计算部，其根据各测定和获取的温度，计算前端的冷空气与后方的暖风的温度差; 以及加热元件冷却控制单元，用于基于计算出的温差来调节从地板下空间到计算机室的冷气流量。

公开(公告)号：US07828045B2

公开(公告)日：2010-11-09

申请号：US10230992

申请日：2002-08-30

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

摘要翻译： 本发明涉及一种散热器。 更具体地，本发明涉及一种散热器，其用于从诸如笔记本型个人计算机的便携式电子设备中布置的诸如微处理器的集成电路封装散热，并且还用于从硬盘 在电子设备中使用的单元。 散热器包括：用于传递由加热部件产生的热量的传热部件; 保持部，其保持所述传热部件; 以及具有空间的散热体，其中嵌入有至少具有叶片的冷却风扇和驱动电动机，其中，用于保持传热构件的保持部分的部分位于空间下方。

公开(公告)号：US06501652B2

公开(公告)日：2002-12-31

申请号：US09931874

申请日：2001-08-20

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a heat sink. It is an object of the present invention to provide a heat sink at a low manufacturing cost, the life of the motor of which is long so that the reliability of the heat sink can be enhanced and, further, a sufficiently high cooling performance can be obtained and the designing of the heat sink can be easily performed. The heat sink includes: a bottom surface coming into contact with a heating element; a side on which a plurality of ventilation holes are formed; and an upper surface into which a cooling fan composed of blades and a motor is embedded and fixed.

摘要翻译： 本发明涉及一种散热器。 本发明的目的是提供一种低制造成本的散热器，其电动机的寿命长，从而可以提高散热器的可靠性，并且还可以具有足够高的冷却性能 可以容易地实现散热器的设计。 散热器包括：与加热元件接触的底面; 其上形成有多个通气孔的一侧; 以及嵌入并固定由叶片和马达构成的冷却风扇的上表面。

公开(公告)号：US06487079B2

公开(公告)日：2002-11-26

申请号：US09825053

申请日：2001-04-04

申请人： Tadashi Katsui

发明人： Tadashi Katsui

IPC分类号： H05K720

CPC分类号： H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/467 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat: sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.

摘要翻译： 用于将散热器安装在安装在印刷电路板上的集成电路封装上的结构被构造成使得具有框架部分和支撑柱部分的引导构件固定到印刷电路板上，并且散热器就座在内部 引导构件的周边，使得散热器可以与集成电路封装紧密接触，然后将盖子固定到引导构件，使得其覆盖在散热器的上表面的外周边缘部分上。 该结构的冷却效率高，易于安装。