公开(公告)号：US20090294164A1

公开(公告)日：2009-12-03

申请号：US12219079

申请日：2008-07-15

申请人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

发明人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

IPC分类号： H05K1/11 ,  H05K3/40

CPC分类号： H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized.

摘要翻译： 本发明公开了一种印刷电路板，其包括无轨道通孔和制造印刷电路板的方法。 印刷电路板包括没有上部焊盘的无地通孔。 通孔包括具有小于通孔的最小直径的线宽的电路图案。 通孔在其端面上没有具有最小直径的上部焊盘，因此与通孔连接的电路图案被精细地形成，导致高密度电路图案。 因此，实现了层数减少的紧凑型印刷电路板。

公开(公告)号：US20090236130A1

公开(公告)日：2009-09-24

申请号：US12216428

申请日：2008-07-03

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K3/42

CPC分类号： H05K3/4608 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0315 ,  Y10T29/49165

摘要： Disclosed herein is a multilayered circuit board, including: a metal base layer including a metal layer formed through-holes, an insulating film formed on a surface of the metal layer, a first circuit layer having circuit patterns formed on one side of the metal layer and a second circuit layer having protruding connecting pads, formed on the other side of the metal layer; a build-up layer formed on the first circuit layer; and a solder resist layer. The multilayered printed circuit board is advantageous in that the thickness thereof is decreased and the bending strength and radiation characteristics thereof are improved.

摘要翻译： 本发明公开了一种多层电路板，包括：金属基层，包括金属层形成的通孔;绝缘膜，形成在金属层的表面上;第一电路层，具有形成在金属层一侧的电路图案 以及形成在所述金属层的另一侧的具有突出连接焊盘的第二电路层; 形成在第一电路层上的积聚层; 和阻焊层。 多层印刷电路板的优点在于其厚度降低，并且其弯曲强度和辐射特性得到改善。