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    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING LANDLESS VIA
    1.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING LANDLESS VIA 审中-公开
    印刷电路板的制造方法，包括无线电

    公开(公告)号：US20120066902A1

    公开(公告)日：2012-03-22

    申请号：US13301063

    申请日：2011-11-21

    申请人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

    发明人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

    IPC分类号： H05K3/10

    CPC分类号： H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land.

    摘要翻译： 一种制造印刷电路板的方法，包括：制备双面基板，其包括绝缘层，形成在所述绝缘层的一侧上的第一铜层和形成在所述绝缘层的另一侧上的第二铜层; 通过所述第二铜层和所述绝缘层形成通孔; 在所述通孔的内壁上形成镀层; 并且在双面基板上形成通孔，包括形成在具有最小直径并且具有小于通孔的最小直径的线宽度的通孔的表面上的电路图案的第一电路层，以及 第二电路层包括较低的焊盘。

    Printed circuit board including landless via and method of manufacturing the same
    2.
    发明申请
    Printed circuit board including landless via and method of manufacturing the same 审中-公开
    包括无地面通孔及其制造方法的印刷电路板

    公开(公告)号：US20090294164A1

    公开(公告)日：2009-12-03

    申请号：US12219079

    申请日：2008-07-15

    申请人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

    发明人： Han Kim ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Chang Gun Oh

    IPC分类号： H05K1/11 ,  H05K3/40

    CPC分类号： H05K1/116 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09545 ,  Y10T29/49165

    摘要： Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized.

    摘要翻译： 本发明公开了一种印刷电路板，其包括无轨道通孔和制造印刷电路板的方法。 印刷电路板包括没有上部焊盘的无地通孔。 通孔包括具有小于通孔的最小直径的线宽的电路图案。 通孔在其端面上没有具有最小直径的上部焊盘，因此与通孔连接的电路图案被精细地形成，导致高密度电路图案。 因此，实现了层数减少的紧凑型印刷电路板。

    Multilayered printed circuit board and method of manufacturing the same
    6.
    发明申请
    Multilayered printed circuit board and method of manufacturing the same 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20090236131A1

    公开(公告)日：2009-09-24

    申请号：US12222055

    申请日：2008-07-31

    申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    IPC分类号： H05K1/09 ,  H05K3/02

    CPC分类号： H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

    摘要： Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer, including connecting pads, is formed, the pads protruding over the via holes; a build-up layer formed on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and a solder resist layer formed on an outermost layer of the build-up layer.

    摘要翻译： 本文公开了一种多层电路板，包括：使用该方法制造的多层印刷电路板，包括具有通孔的绝缘树脂层，其一侧形成有包括电路图案的第一电路层，另一侧 形成包括连接焊盘的第二电路层，焊盘在通孔上方突出; 形成在所述第一电路层上的积聚层，所述堆积层包括多个绝缘层和多个电路层; 以及形成在积层层的最外层上的阻焊层。