公开(公告)号：US10784079B2

公开(公告)日：2020-09-22

申请号：US16408795

申请日：2019-05-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Chieh Meng ,  Chui-Ya Peng ,  Nai-Han Cheng

IPC: H01J37/317 ,  H01J37/08 ,  H01J27/20 ,  H01L21/8238 ,  C23C14/48 ,  H01L21/265

Abstract: The present disclosure describes an ion implantation system that includes a bushing designed to reduce the accumulation of IMP by-produces on the bushing's inner surfaces. The ion implantation system can include a chamber, an ion source configured to generate an ion beam, and a bushing coupling the ion source and the chamber. The bushing can include (i) a tubular body having an inner surface, a first end, and a second end and (ii) multiple angled trenches disposed within the inner surface of the tubular body, where each of the multiple angled trenches extends towards the second end of the tubular body.

公开(公告)号：US20200098544A1

公开(公告)日：2020-03-26

申请号：US16408795

申请日：2019-05-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Chieh MENG ,  Chui-Ya Peng ,  Nai-Han CHENG

IPC: H01J37/317 ,  H01J37/08 ,  H01J27/20 ,  H01L21/265 ,  H01L21/8238 ,  C23C14/48

Abstract: The present disclosure describes an ion implantation system that includes a bushing designed to reduce the accumulation of IMP by-produces on the bushing's inner surfaces. The ion implantation system can include a chamber, an ion source configured to generate an ion beam, and a bushing coupling the ion source and the chamber. The bushing can include (i) a tubular body having an inner surface, a first end, and a second end and (ii) multiple angled trenches disposed within the inner surface of the tubular body, where each of the multiple angled trenches extends towards the second end of the tubular body.

公开(公告)号：US20190131157A1

公开(公告)日：2019-05-02

申请号：US15797466

申请日：2017-10-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yen-Fong Chen ,  Yan Cing Lin ,  Chui-Ya Peng

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  H01L21/66 ,  G01B5/30

Abstract: An apparatus includes a holder configured to carry one or more semiconductor wafers, an arm coupled with the holder, and a detector coupled with either the holder or the arm. The detector is configured to measure a change in weight of the one or more semiconductor wafers. The detector includes a strain gauge weight sensor, a piezoelectric sensor, or any other suitable sensor. The change in weight of the one or more semiconductor wafers is used to determine any possible presence of a broken or missing wafer.

公开(公告)号：US09812570B2

公开(公告)日：2017-11-07

申请号：US14788522

申请日：2015-06-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chih-Fen Chen ,  Chui-Ya Peng ,  Ching Yu ,  Pin-Hen Lin ,  Yen Chuang ,  Yuh-Ta Fan

IPC: H01L29/78 ,  H01L29/66 ,  H01L21/336 ,  H01L29/08 ,  H01L29/165

CPC classification number: H01L29/7848 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7835

Abstract: A semiconductor device includes a substrate, a liner, and an epitaxy structure. The substrate has a recess. The liner is disposed in the recess. The liner is denser than the substrate. The epitaxy structure is disposed in the recess. The liner is disposed between the epitaxy structure and the substrate.