摘要:
An optical part fixing chip in accordance with the present invention comprises: a guide trench bored in a substrate and having one end thereof abutted on one side of the chip; and a stepped area abutting on one end of the guide trench and extending along one side of the optical part fixing chip. The height of the step of the stepped area is the same as the depth of the guide trench.
摘要:
A spring wire with a hardness of 50 to 56 HRC is subjected to first and second shot peening processes within a warm working temperature range of 150 to 350° C. In the first shot peening process, a first shot of a shot size of at least 1.0 mm is used. In the second shot peening process, a second shot smaller in shot size than the first shot is sued. Through these shot peening processes, compressive residual stress is imparted to the spring wire. The spring wire includes a residual stress increase part, residual stress peak part, and residual stress decrease part. In the residual stress decrease part, a part including a compressive residual stress magnitude equivalent to the magnitude of the compressive residual stress at a surface of the spring wire exists at a region at a depth exceeding the permissible pit depth.
摘要:
A semiconductor photo-detector, which has a high quantum efficiency due to high coupling with an incident beam and operates at higher frequency due to a reduced area of PN junction. In a semiconductor photo-detector of the present invention, reflection layers are deposited on both of the parallel surfaces of a square-shaped wave-guide, while light absorption layers are deposited on at least another pair of parallel surfaces which is one of the parallel pairs of remaining surfaces.
摘要:
A semiconductor photodetector having a planar structure, including a first silicon layer having a first conductivity and formed with a recess, a silicon dioxide film covering a sidewall of the recess therewith, a germanium monocrystal layer formed in the recess, a first germanium layer having a first conductivity and sandwiched between the germanium monocrystal layer and the first silicon layer in the recess, a second germanium layer having a second conductivity and formed on the germanium monocrystal layer, and a second silicon layer having a second conductivity and formed on the second germanium layer. The first and second germanium layers prevent a depletion layer, which are generated in the germanium monocrystal layer when a voltage is applied to the semiconductor photodetector, from reaching the first and second silicon layers, respectively. In accordance with the semiconductor photodetector, a depletion layer generated in the germanium monocrystal layer is prevented from reaching the first and second silicon layers, and hence, electric charges generated by introduction of light into the germanium monocrystal layer would not be recombined to each other through a recombination core. As a result, it is possible to avoid reduction in a photoelectric current or a quantum efficiency.
摘要:
A color cathode ray tube includes an electron gun having a plurality of electrodes, an electron beam deflection device and a phosphor screen. A deflection defocusing correcting element is located in a deflection magnetic field produced by the deflection device to locally modify the magnetic field in a path of an electron beam and corrects the deflection defocusing of the electron beam corresponding to deflection of the electron beam. The deflection defocusing element includes the magnetic metal plate providing magnetic pole pieces and a non-magnetic metal support for holding the magnetic metal plate in place. The magnetic metal plate and the non-magnetic metal support are laminated or clad one on another, or joined edge-to-edge.
摘要:
Disclosed is a semiconductor device in which dummy regions which are lower than an isolated element region are formed around the isolated element region. Another dummy region which has a height nearly equal to those of element regions may be formed at a non-element-region-existing region, accompanying with lower dummy regions. The method for making the semiconductor device has the steps of suitably forming the element regions and dummy regions on a insulating layer on a substrate, depositing a insulator on the entire surface of the insulating layer and polishing the insulator to obtain a plane surface.